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  • OPA4197-Q1 Functional Safety FIT Rate, FMD and Pin FMA

    • SFFS623 april   2023 OPA4197-Q1

       

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  • OPA4197-Q1 Functional Safety FIT Rate, FMD and Pin FMA
  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
  6. IMPORTANT NOTICE
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FUNCTIONAL SAFETY FIT RATE, FMD AND PIN-FMA

OPA4197-Q1 Functional Safety FIT Rate, FMD and Pin FMA

Trademarks

All trademarks are the property of their respective owners.

1 Overview

This document contains information for OPA4197-Q1 (TSSOP package) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

GUID-76380DC8-71B9-4867-B5F0-635E5DFEE47E-low.gifFigure 1-1 Functional Block Diagram

OPA4197-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.

2 Functional Safety Failure In Time (FIT) Rates

This section provides Functional Safety Failure In Time (FIT) rates for OPA4197-Q1 based on two different industry-wide used reliability standards:

  • Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-2 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262FIT (Failures Per 109 Hours)
Total Component FIT Rate11
Die FIT Rate3
Package FIT Rate8

The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission Profile: Motor Control from Table 11
  • Power dissipation: 54 mW
  • Climate type: World-wide Table 8
  • Package factor (lambda 3): Table 17b
  • Substrate Material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2
TableCategoryReference FIT RateReference Virtual TJ
5CMOS, BICMOS
Digital, analog / mixed
25 FIT55°C

The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.

3 Failure Mode Distribution (FMD)

The failure mode distribution estimation for OPA4197-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.

The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.

Table 3-1 Die Failure Modes and Distribution
Die Failure ModesFailure Mode Distribution (%)

Output open (Hi-Z)

20%
Output saturated high25%
Output saturated low25%
Output functional, out of specification voltage or timing30%

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the OPA4197-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to Ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 shows the OPA4197-Q1 pin diagram. For a detailed description of the device pins, see the Pin Configuration and Functions section in the OPA4197-Q1 data sheet.

GUID-1DF72A65-0DF4-4CC1-81FC-112CBB2164CF-low.svgFigure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • 'Short circuit to Power' means short to V+.
  • 'Short circuit to GND or Ground' means short to V–.
  • V+ is equivalent to VCC and V‒ equivalent to VEE.
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
OUT A1Depending on the circuit configuration, the device is likely to be forced into a short-circuit condition with the OUT A voltage ultimately forced to the V– voltage. Prolonged exposure to short-circuit conditions could result in long-term reliability issues.A
–IN A2The device does not receive negative feedback. Depending on the circuit configuration, the output most likely moves to the negative supply.B
+IN A3Device common-mode is tied to the negative rail. Depending on the circuit configuration, the output likely does not respond because the device is in an invalid common-mode condition.C
V+4Op-amp supplies are shorted together, leaving the V+ pin at some voltage between the V+ and V‒ sources (depending on the source impedance).A
+IN B5Device common-mode is tied to the negative rail. Depending on the circuit configuration, the output likely does not respond because the device is in an invalid common-mode condition.C
–IN B6The device does not receive negative feedback. Depending on the circuit configuration, the output most likely moves to the negative supply.B
OUT B7Depending on the circuit configuration, the device is likely to be forced into a short-circuit condition with the OUT B voltage ultimately forced to the V‒ voltage. Prolonged exposure to short-circuit conditions could result in long-term reliability issues.A
OUT C8Depending on the circuit configuration, the device is likely to be forced into a short-circuit condition with the OUT C voltage ultimately forced to the V‒ voltage. Prolonged exposure to short-circuit conditions could result in long-term reliability issues.A
–IN C9The device does not receive negative feedback. Depending on the circuit configuration, the output most likely moves to the negative supply.B
+IN C10Device common-mode is tied to the negative rail. Depending on the circuit configuration, the output likely does not respond because the device is in an invalid common-mode condition.C
+IN D12Device common-mode is tied to the negative rail. Depending on the circuit configuration, the output likely does not respond because the device is in an invalid common-mode condition.C
–IN D13The device does not receive negative feedback. Depending on the circuit configuration, the output most likely moves to the negative supply.B
OUT D14Depending on the circuit configuration, the device is likely to be forced into a short-circuit condition with the OUT D voltage ultimately forced to the V‒ voltage. Prolonged exposure to short-circuit conditions could result in long-term reliability issues.A
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
OUT A1No negative feedback or ability for OUT A to drive the application.B
–IN A2Inverting pin of the op amp is left floating. Negative feedback is not provided to the device, likely resulting in the device output moving between the positive and negative rails. The ‒IN A pin voltage likely ends up at the positive or negative rail because of leakage on the ESD diodes.B
+IN A3Device common-mode is disconnected. The op amp is not provided with common-mode bias, and the device output likely ends up at the positive or negative rail. The +IN A pin voltage likely ends up at the positive or negative rail because of leakage on the ESD diodes.B
V+4Positive supply is left floating. The op amp ceases to function because no current can source or sink to the device.A
+IN B5Device common-mode is disconnected. The op amp is not provided with common-mode bias, and the device output likely ends up at the positive or negative rail. The +IN B pin voltage likely ends up at the positive or negative rail because of leakage on the ESD diodes.B
–IN B6Inverting pin of the op amp is left floating. Negative feedback is not provided to the device, likely resulting in the device output moving between the positive and negative rails. The ‒IN B pin voltage likely ends up at the positive or negative rail because of leakage on the ESD diodes.B
OUT B7No negative feedback or ability for OUT B to drive the application.B
OUT C8No negative feedback or ability for OUT C to drive the application.B
–IN C9Inverting pin of the op amp is left floating. Negative feedback is not provided to the device, likely resulting in the device output moving between the positive and negative rails. The ‒IN C pin voltage likely ends up at the positive or negative rail because of leakage on the ESD diodes.B
+IN C10Device common-mode is disconnected. The op amp is not provided with common-mode bias, and the device output likely ends up at the positive or negative rail. The +IN C pin voltage likely ends up at the positive or negative rail because of leakage on the ESD diodes.B
V–11Negative supply is left floating. The op amp ceases to function because no current can source or sink to the device.B
+IN D12Device common-mode is disconnected. The op amp is not provided with common-mode bias, and the device output likely ends up at the positive or negative rail. The +IN D pin voltage likely ends up at the positive or negative rail because of leakage on the ESD diodes.B
–IN D13Inverting pin of the op amp is left floating. Negative feedback is not provided to the device, likely resulting in the device output moving between the positive and negative rails. The ‒IN D pin voltage likely ends up at the positive or negative rail because of leakage on the ESD diodes.B
OUT D14No negative feedback or ability for OUT D to drive the application.B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted toDescription of Potential Failure Effect(s)Failure Effect Class
OUT A12Depending on the circuit configuration, the circuit gain is reduced to unity gain, and the application might not function as intended.B
–IN A23Both inputs are tied together. Depending on the offset of the device, the output voltage likely moves to near midsupply.D
+IN A34Depending on the circuit configuration, the application is likely not to function because device common-mode voltage is connected to +IN A.B
V+45Depending on the circuit configuration, the application is likely not to function because device common-mode voltage is connected to V+.B
+IN B56Both inputs are tied together. Depending on the offset of the device, the output voltage likely moves to near midsupply.D
–IN B67Depending on the circuit configuration, the circuit gain is reduced to unity gain, and the application might not function as intended.B
OUT B78Depending on the circuit configuration, the device is likely to be forced into a short-circuit condition with the OUT B voltage ultimately forced to the OUT C voltage or vice versa. Prolonged exposure to short-circuit conditions might result in long-term reliability issues.A
OUT C89Depending on the circuit configuration, the circuit gain is reduced to unity gain, and the application might not function as intended.B
–IN C910Both inputs are tied together. Depending on the offset of the device, the output voltage likely moves to near midsupply.D
+IN C1011Device common-mode is tied to the negative rail. Depending on the circuit configuration, the output likely does not respond because the device is in an invalid common-mode condition.C
V–1112Device common-mode is tied to the negative rail. Depending on the circuit configuration, the output likely does not respond because the device is in an invalid common-mode condition.C
+IN D1213Both inputs are tied together. Depending on the offset of the device, the output voltage likely moves to near midsupply.D
–IN D1314Depending on the circuit configuration, the circuit gain is reduced to unity gain, and the application might not function as intended.B
OUT D141Depending on the circuit configuration, the device is likely to be forced into a short-circuit condition with the OUT D voltage ultimately forced to the OUT A voltage or vice versa. Prolonged exposure to short-circuit conditions might result in long-term reliability issues.A
Table 4-5 Pin FMA for Device Pins Short-Circuited to Supply
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
OUT A1Depending on the circuit configuration, the device is likely to be forced into a short-circuit condition with the OUT A voltage ultimately forced to the V+ voltage. Prolonged exposure to short-circuit conditions could result in long-term reliability issues.A
–IN A2The device does not receive negative feedback. Depending on the noninverting input voltage and circuit configuration, the output most likely moves to the negative supply.B
+IN A3Depending on the circuit configuration, the application is likely not to function because device common-mode voltage is connected to +IN A.B
+IN B5Depending on the circuit configuration, the application is likely not to function because device common-mode voltage is connected to +IN B.B
–IN B6The device does not receive negative feedback. Depending on the noninverting input voltage and circuit configuration, the output most likely moves to the negative supply.B
OUT B7Depending on the circuit configuration, the device is likely to be forced into a short-circuit condition with the OUT B voltage ultimately forced to the V+ voltage. Prolonged exposure to short-circuit conditions could result in long-term reliability issues.A
OUT C8Depending on the circuit configuration, the device is likely to be forced into a short-circuit condition with the OUT C voltage ultimately forced to the V+ voltage. Prolonged exposure to short-circuit conditions could result in long-term reliability issues.A
–IN C9The device does not receive negative feedback. Depending on the noninverting input voltage and circuit configuration, the output most likely moves to the negative supply.B
+IN C10Depending on the circuit configuration, the application is likely not to function because device common-mode voltage is connected to +IN C.B
V–11Op-amp supplies are shorted together, leaving the V‒ pin at some voltage between the V‒ and V+ sources (depending on the source impedance).A
+IN D12Depending on the circuit configuration, the application is likely not to function because device common-mode voltage is connected to +IN D.B
–IN D13The device does not receive negative feedback. Depending on the noninverting input voltage and circuit configuration, the output most likely moves to the negative supply.B
OUT D14Depending on the circuit configuration, the device is likely to be forced into a short-circuit condition with the OUT D voltage ultimately forced to the V+ voltage. Prolonged exposure to short-circuit conditions could result in long-term reliability issues.A

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