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  • TCAN1043A-Q1 Functional Safety FIT Rate, FMD, and Pin FMA

    • SFFS096 October   2021 TCAN1043A-Q1

       

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  • TCAN1043A-Q1 Functional Safety FIT Rate, FMD, and Pin FMA
  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
  6. 5Revision History
  7. IMPORTANT NOTICE
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FUNCTIONAL SAFETY FIT RATE, FMD AND PIN-FMA

TCAN1043A-Q1 Functional Safety FIT Rate, FMD, and Pin FMA

Trademarks

All trademarks are the property of their respective owners.

1 Overview

This document contains information for TCAN1043A-Q1. This is a Controller Area Network (CAN) transceiver in the SOIC (D), VSON (DMT), and SOT (DYY) packages to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin Failure Mode Analysis (FMA) for the device pins of TCAN1043A-Q1

Figure 1-1 shows the device functional block diagram for reference.

GUID-65DD3896-1DEA-46EB-B559-4578F9FC0763-low.gif Figure 1-1 TCAN1043A-Q1 Functional Block Diagram
TCAN1043A-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.

2 Functional Safety Failure In Time (FIT) Rates

This section provides Functional Safety Failure In Time (FIT) rates for TCAN1043A-Q1 based on two different industry-wide used reliability standards:

  • Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-2 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262FIT (Failures Per 109 Hours) 14-pin SOIC (D)FIT (Failures Per 109 Hours) 14-pin VSON (DMT)FIT (Failures Per 109 Hours) 14-pin SOT (DYY)
Total Component FIT Rate221011
Die FIT Rate647
Package FIT Rate1664

The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission Profile: Motor Control from Table 11
  • Power dissipation: 353 mW
  • Climate type: World-wide Table 8
  • Package factor (lambda 3): Table 17b
  • Substrate Material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2
TableCategoryReference FIT RateReference Virtual TJ
5CMOS/BICMOS
ASICs Analog & Mixed ≤ 50 V supply
25 FIT55°C

The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.

3 Failure Mode Distribution (FMD)

The failure mode distribution estimation for TCAN1043A-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.

The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.

Table 3-1 Die Failure Modes and Distribution
Die Failure Modes Failure Mode Distribution (%)
Receiver Fail 35%
Transmitter Fail 35%
System stuck in sleep mode 15%
Control and Mode logic failure 10%
CANL or CANH driver stuck dominant 5%

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TCAN1043A-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to Ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to VCC (see Table 4-5)
  • Pin short-circuited to VSUP (see Table 4-6)
  • Pin short-circuited to VIO (Table 4-7)

Table 4-2 through Table 4-7 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 shows the TCAN1043A-Q1 SOIC pin diagram. Figure 4-2 shows the TCAN1043A-Q11 VSON pin diagram. Figure 4-3 shows the TCAN1043A-Q1 SOT pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TCAN1043A-Q1 data sheet.

Figure 4-1 SOIC Pin Diagram
Figure 4-2 VSON Pin Diagram
Figure 4-3 SOT Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • VCC = 4.5 V to 5.5 V
  • VSUP = 4.5 V to 40 V
  • VIO = 1.7 V to 5.5 V
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
TXD1TXD is biased dominant indefinitely and device enters dominant time out mode. Unable to transmit data.B
GND2NoneD
VCC3Device is in protected mode, The high current draw from external regulator supplying VCC.B
RXD4Receiver output biased recessive indefinitely. The host is unable to receive data from bus.B
VIO5Device is in protected mode. Transceiver passive on bus, and high current draw from external regulator supplying VIO.B
EN6EN pin biased low, device is not able to enter normal mode. Unable to communicate.B
INH7High ISUP current, INH pin may be damaged, and indication from sleep mode transition not available.A
nFAULT8nFAULT pin biased low indefinitely which indicates a fault indefinitely.B
WAKE9WAKE pin biased low indefinitely, is not able to utilize local wake-up function.B
VSUP10Device unpowered, high ISUP current.B
NC11NoneD
CANL12VO(REC) spec violated. Degraded EMC performance.C
CANH13Device cannot drive dominant to the bus, no communication possible.B
nSTB14nSTB biased low indefinitely. The transceiver unable to enter normal mode. Unable to communicate. B
Thermal Pad-NoneD
Note: The VSON package includes a thermal pad.
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
TXD1TXD pin defaults to a recessive bias, device is always recessive and unable to transmit data.B
GND2Device unpowered.B
VCC3Device in protected mode.B
RXD4No RXD output, unable to receive data.B
VIO5Device in protected mode.B
EN6EN pin defaults to a logic-low bias, device is not able to enter normal mode. Unable to communicate.B
INH7NoneD
nFAULT8No effect on performance, unable to monitor system faults.B
WAKE9No effect on device performance, is not able to use local wake-up function.B
VSUP10Device unpowered.B
NC11NoneD
CANL12Device cannot drive dominant on bus, and is unable to communicate.B
CANH13Device cannot drive dominant on bus, and is unable to communicate.B
nSTB14nSTB defaults to a logic-low bias, device is not able to enter normal mode. Unable to communicate.B
Thermal Pad-NoneD
Note: The VSON package includes a thermal pad.
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effect(s) Failure Effect Class
TXD 1 GND TXD will be biased dominant indefinitely and device will enter dominant time out mode. Unable to transmit data. B
GND 2 VCC Device will be in protected mode, high ICC current. B
VCC 3 RXD RXD output biased recessive indefinitely, controller unable to receive data from CAN bus. B
RXD 4 VIO RXD output biased recessive indefinitely, controller unable to receive data from CAN bus. B
VIO 5 EN EN pin biased high indefinitely, device is unable to enter standby and silent mode. B
EN 6 INH Absolute maximum violation on EN pin except in sleep mode. Transceiver may be damaged. A
nFAULT 8 WAKE Potential absolute maximum violation on nFAULT pin if WAKE is biased high. Transceiver may be damaged. A
WAKE 9 VSUP WAKE biased high indefinitely, unable to utilize local wake-up function. B
VSUP 10 NC None D
NC 11 CANL None D
CANL 12 CANH Bus biased recessive, no communication possible. IOS current may be reached on CANH/CANL. B
CANH 13 nSTB Driver and receiver turn off when the CAN bus is recessive. May not enter normal mode. B
Note: The VSON package includes a thermal pad. All device pins are adjacent to the thermal pad. The device behavior when pins are shorted to the thermal pad depends on which net is connected to the thermal pad.
Table 4-5 Pin FMA for Device Pins Short-Circuited to VCC
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
TXD1TXD biased recessive indefinitely, unable to transmit data.B
GND2Device unpowered, high current draw from external regulator supplying VCC.B
VCC3NoneD
RXD4Receiver output biased recessive indefinitely. Host unable to receive data from bus.B
VIO5IO pins will operate as 5 V input/outputs. Microcontroller may be damaged if VCC > VIO.C
EN6EN biased high indefinitely, device are unable to enter standby and silent mode.B
INH7Absolute maximum violation on VCC pin, INH is biased at VCC voltage, system may not wake up.B
nFAULT8nFAULT biased high indefinitely, transceiver unable to report faults.B
WAKE9NoneD
VSUP10Absolute maximum violation on VCC.B
NC11NoneD
CANL12IOS current may be reached, RXD always recessive.B
CANH13VO(REC) spec violated, degraded EMC performance.C
nSTB14nSTB biased high indefinitely, transceiver unable to enter standby and sleep mode.B
Table 4-6 Pin FMA for Device Pins Short-Circuited to VSUP
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
TXD1Absolute maximum violation, transceiver may be damaged.A
GND2Device unpowered, high ISUP current.B
VCC3Absolute maximum violation, transceiver may be damaged.A
RXD4Absolute maximum violation, transceiver may be damaged.A
VIO5Absolute maximum violation, transceiver may be damaged.A
EN6Absolute maximum violation, transceiver may be damaged.A
INH7Minimal current driven into the INH pin.D
nFAULT8Absolute maximum violation, transceiver may be damaged.A
WAKE9WAKE biased high, unable to use local wake-up function.B
VSUP10NoneD
NC11NoneD
CANL12IOS current may be reached. RXD always recessive.B
CANH13VO(REC) spec violated, degraded EMC performance and communcation errors may result as well.C
nSTB14Absolute maximum violation, transceiver may be damaged.A
Table 4-7 Pin FMA for Device Pins Short-Circuited to VIO
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
TXD 1 TXD biased recessive indefinitely, unable to transmit data. B
GND 2 Device unpowered, high current draw from external regulator supplying VIO. B
VCC 3 IO pins will operate as 5 V input/outputs. Microcontroller may be damaged if VCC > VIO. C
RXD 4 Receiver output biased recessive indefinitely. Host unable to receive data from bus. B
VIO 5 None D
EN 6 EN biased high indefinitelyf, device are unable to enter standby and silent mode. B
INH 7 Absolute maximum violation on VIO pin, INH is biased at VIO voltage, system may not wake up. B
nFAULT 8 nFAULT biased high indefinitely, transceiver unable to report faults. B
WAKE 9 None D
VSUP 10 Absolute maximum violation on VIO. B
NC 11 None D
CANL 12 IOS current may be reached, RXD always recessive. B
CANH 13 VO(REC) spec violated, degraded EMC performance. C
nSTB 14 nSTB biased high indefinitely, transceiver unable to enter standby and sleep mode. B
Note: Table 4-7 is only applicable to the TCAN1043A-Q1 device.

5 Revision History

DATEREVISIONNOTES
*Initial Release

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