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This document contains information for TPD3S713-Q1 (RVC package) to aid in a functional safety system design. Information provided are:
Figure 1-1 shows the device functional block diagram for reference.
TPD3S713-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.
This section provides Functional Safety Failure In Time (FIT) rates for TPD3S713-Q1 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
---|---|
Total Component FIT Rate | 9 |
Die FIT Rate | 2 |
Package FIT Rate | 7 |
The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | Digital, Analog, Mixed | 25 FIT | 55°C |
The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.
The failure mode distribution estimation for TPD3S713-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.
The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.
Die Failure Modes | Failure Mode Distribution (%) |
---|---|
BUS no output | 35% |
BUS output not in specification-voltage or timing | 30% |
OUT power FET stuck on | 15% |
DP_IN, DM_IN, DP_OUT, DM_OUT – not in specification – voltage or timing | 15% |
FAULT false trip or fails to trip | 5% |
The FMD in Table 3-1 excludes short circuit faults across the isolation barrier. Faults for short circuit across the isolation barrier can be excluded according to ISO 61800-5-2:2016 if the following requirements are fulfilled:
Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance.
This section provides a Failure Mode Analysis (FMA) for the pins of the TPD3S713-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:
Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.
Class | Failure Effects |
---|---|
A | Potential device damage that affects functionality |
B | No device damage, but loss of functionality |
C | No device damage, but performance degradation |
D | No device damage, no impact to functionality or performance |
Figure 4-1 shows the TPD3S713-Q1 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TPD3S713-Q1 data sheet.
Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:
Device used within the 'Recommended Operating Conditions' and the 'Absolute Maximum Ratings' found in the appropriate device data sheet.
Configuration as shown in the 'Example Application Circuit' found in the appropriate device data sheet.
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
IMON | 1 | Loss of current monitor functionality, device can't sense the current. | C |
IN | 2 | Device will not operate. No BUS output voltage. | B |
IN | 3 | Device will not operate. No BUS output voltage. | B |
DM_OUT | 4 | Device can't communicate with host and attached device. | B |
DP_OUT | 5 | Device can't communicate with host and attached device. | B |
CS | 6 | Loss of 'Linear cable compensation current' functionality. | C |
EN | 7 | Loss of ENABLE functionality. Device will remain in shut-down mode. | B |
ILIM_SEL | 8 | ILIM_LO resistor is valid, not any function will be impacted. | C |
INT1 | 9 | Device can‘t enter into the normal mode. | B |
INT2 | 10 | No effect. | D |
GND | 11 | No effect. | D |
BIAS | 12 | Device can't communicate with host and attached device. | B |
DP_IN | 13 | Device can't communicate with host and attached device. | B |
DM_IN | 14 | Device can't communicate with host and attached device. | B |
BUS | 15 | Device hiccups and under current limitted status. | B |
BUS | 16 | Device hiccups and under current limitted status. | B |
NC | 17 | No effect. | D |
/FAULT | 18 | Loss of /FAULT functionality, device always appears to be in the fault condition. | C |
ILIM_LO | 19 | Device will have the max current limit value at 1.15A TYP. | C |
ILIM_HI | 20 | Device will have the max current limit value at 1.15A TYP. | C |
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
IMON | 1 | Loss of current monitor functionality, device can't sense the current. | C |
IN | 2 | Long-term reliability may impact due to lower bonding-wire count. | C |
IN | 3 | Long-term reliability may impact due to lower bonding-wire count. | C |
DM_OUT | 4 | Device can't communicate with host and attached device. | B |
DP_OUT | 5 | Device can't communicate with host and attached device. | B |
CS | 6 | Loss of 'Linear cable compensation current' functionality. | C |
EN | 7 | Device enable status is uncertain and can't be controlled. | B |
ILIM_SEL | 8 | ILIM_HI/LO selection is uncertain and can't be controlled. | C |
INT1 | 9 | Device operating mode is uncertain and can't be controlled. | C |
INT2 | 10 | BUS OVP threshold is uncertain between 6V and 6.95V. | C |
GND | 11 | Device remains unpowered. | B |
BIAS | 12 | Affect the IEC ESD performance. | C |
DP_IN | 13 | Device can't communicate with host and attached device. | B |
DM_IN | 14 | Device can't communicate with host and attached device. | B |
BUS | 15 | Long-term reliability may impact due to lower bonding-wire count. | C |
BUS | 16 | Long-term reliability may impact due to lower bonding-wire count. | C |
NC | 17 | No effect. | D |
/FAULT | 18 | Loss of /FAULT functionality. | C |
ILIM_LO | 19 | No effect if ILIM_SEL is high, otherwise current limit value is close to 0, and device is in current limit status. | B |
ILIM_HI | 20 | No effect if ILIM_SEL is low, otherwise current limit value is close to 0, and device is in current limit status. | B |
Pin Name | Pin No. | Shorted to | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|---|
IMON | 1 | IN | Loss of current monitor functionality, device can't sense the current. | C |
IN | 2 | IN | No effect. | D |
IN | 3 | DM_OUT | Device can't communicate with host and attached device. | B |
DM_OUT | 4 | DP_OUT | Device can't communicate with host and attached device. | B |
DP_OUT | 5 | CS | Device can't communicate with host and attached device, and loss of 'Linear cable compensation current' functionality. | B |
CS | 6 | EN | Loss of 'Linear cable compensation current' functionality, and device enable status is uncertain and can't be controlled. | B |
EN | 7 | ILIM_SEL | ILIM_SEL high/low and device off/on depend on how EN and ILIM_SEL circuits interact. | B |
ILIM_SEL | 8 | INT1 | ILIM_SEL high/low and device operating mode depend on how ILIM_SEL and INT1 circuits interact. | B |
INT1 | 9 | INT2 | Device operating mode and BUS OVP threshold depend on how INT1 and INT2 circuits interact. | B |
INT2 | 10 | GND | No effect. | D |
GND | 11 | BIAS | Device can't communicate with host and attached device. | B |
BIAS | 12 | DP_IN | Device can't communicate with host and attached device. | B |
DP_IN | 13 | DM_IN | Device can't communicate with host and attached device. | B |
DM_IN | 14 | BUS | Device enter into DM_IN OVP, and can't communicate with host and attached device. | B |
BUS | 15 | BUS | No effect. | D |
BUS | 16 | NC | NC pin is open-drain structure, if NC pin is trigged, BUS will be shortted to ground. | B |
NC | 17 | /FAULT | NC pin is open-drain structure, if NC pin is trigged, /FAULT will be shortted to ground. | C |
/FAULT | 18 | ILIM_LO | Loss of /FAULT functionality, current limit value is impacted. | B |
ILIM_LO | 19 | ILIM_HI | Current limit value is impacted. | C |
ILIM_HI | 20 | IMON | Loss of current monitor functionality, current limit value is impacted. | C |
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
IMON | 1 | Loss of current monitor functionality, device can't sense the current. | C |
IN | 2 | No effect. | D |
IN | 3 | No effect. | D |
DM_OUT | 4 | Device can't communicate with host and attached device. | B |
DP_OUT | 5 | Device can't communicate with host and attached device. | B |
CS | 6 | Loss of 'Linear cable compensation current' functionality. | C |
EN | 7 | Device is always enabled. | C |
ILIM_SEL | 8 | ILIM_HI is always selected. | C |
INT1 | 9 | Device is always in normal mode. | C |
INT2 | 10 | BUS OVP threshold is 6.95V. | C |
GND | 11 | Former power supply may be pulled down, device is unpowered. | B |
BIAS | 12 | Affect the IEC ESD performance. | C |
DP_IN | 13 | Device enter into DP_IN OVP, it can't communicate with host and attached device. | B |
DM_IN | 14 | Device enter into DM_IN OVP, it can't communicate with host and attached device. | B |
BUS | 15 | Power switch will be bypassed. | B |
BUS | 16 | Power switch will be bypassed. | B |
NC | 17 | No effect. | D |
/FAULT | 18 | Loss of /FAULT functionality, can't check whether the device is in the fault condition. | C |
ILIM_LO | 19 | No effect if ILIM_SEL is high, otherwise current limit value is close to 0, and device is in current limit status. | B |
ILIM_HI | 20 | No effect if ILIM_SEL is low, otherwise current limit value is close to 0, and device is in current limit status. | B |