This user's guide describes the characteristics, operation, and use of the TMUX7208EVM evaluation module (EVM). A complete schematic diagram, printed-circuit board layouts, and bill of materials are included in this document.
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The TMUX7208EVM supports evaluation of the TMUX7208 device in the 16-pin TSSOP (PW) package. TMUX7208 is a complementary metal-oxide semiconductor (CMOS) switch with latch-up immunity in a 8:1 single channel configuration. The device supports dual supplies (±4.5 V to ±22 V), a single supply (4.5 V to 44 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX7208 supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD. All logic control inputs support logic levels from 1.8 V to VDD, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. The Fail-Safe Logic circuitry applies voltages on the control pins before the supply pin, which protects the device from potential damage.
The EVM has the following features:
The following instructions are for setting up the EVM:
Pin # | 0805 Capacitor Pad ID | Protection Diode Pad | Protection Diode PN# | 0603 Pull-up Pad | 0603 Pull-Down Pad | Pad Locations |
---|---|---|---|---|---|---|
4 | C11 | D3 | SMAJ36CA | R13 | R19 | Top Layer |
5 | C12 | D4 | SMAJ36CA | R14 | R20 | Top Layer |
6 | C13 | D5 | SMAJ36CA | R21 | R27 | Top Layer |
7 | C14 | D6 | SMAJ36CA | R22 | R28 | Top Layer |
8 | C19 | D14 | SMAJ36CA | R45 | R48 | Top Layer |
9 | C18 | D11 | SMAJ36CA | R38 | R44 | Top Layer |
10 | C17 | D10 | SMAJ36CA | R37 | R43 | Top Layer |
11 | C16 | D8 | SMAJ36CA | R30 | R36 | Top Layer |
12 | C15 | D7 | SMAJ36CA | R29 | R35 | Top Layer |
Table 5-2 is the truth table for the TMUX7208, for reference to configure the corresponding control jumpers. Additional signal path jumpers may be configured as shown in Table 6-1.
EN J6 |
A2 J5 |
A1 J4 |
A0 J3 |
Selected Source Connected to Drain (D) Pin |
---|---|---|---|---|
0 | X(1) | X | X | All sources are off (HI-Z) |
1 | 0 | 0 | 0 | S1 |
1 | 0 | 0 | 1 | S2 |
1 | 0 | 1 | 0 | S3 |
1 | 0 | 1 | 1 | S4 |
1 | 1 | 0 | 0 | S5 |
1 | 1 | 0 | 1 | S6 |
1 | 1 | 1 | 0 | S7 |
1 | 1 | 1 | 1 | S8 |
Jumper ID | Header Pos. 1 | Header Pos. 2 | Header Pos. 3 | Header Pos. 4 | Header Pos. 5 | Board Function | Fitted (Y/N) |
---|---|---|---|---|---|---|---|
J1 | GND | VSS | N/A | N/A | N/A | Power | Y |
J2 | VSS | GND | VDD | N/A | N/A | Power | Y |
J3 | VDD | A0 | GND | N/A | N/A | Control | Y |
J4 | VDD | A1 | GND | N/A | N/A | Control | Y |
J5 | VDD | A2 | GND | N/A | N/A | Control | Y |
J6 | VDD | EN | GND | N/A | N/A | Control | Y |
J7 | VDD | S1 | VSS | GND | N/A | I/O | Y |
J8 | VDD | S2 | VSS | GND | N/A | I/O | Y |
J9 | VDD | S3 | VSS | GND | N/A | I/O | Y |
J10 | VDD | S4 | VSS | GND | N/A | I/O | Y |
J11 | VDD | S5 | VSS | GND | N/A | I/O | Y |
J12 | VDD | S6 | VSS | GND | N/A | I/O | Y |
J13 | VDD | S7 | VSS | GND | N/A | I/O | Y |
J14 | VDD | S8 | VSS | GND | N/A | I/O | Y |
J15 | VDD | D | VSS | GND | N/A | I/O | Y |
S1 | I/O | GND | GND | GND | GND | I/O SMA | N |
S2 | I/O | GND | GND | GND | GND | I/O SMA | N |
S3 | I/O | GND | GND | GND | GND | I/O SMA | N |
S4 | I/O | GND | GND | GND | GND | I/O SMA | N |
S5 | I/O | GND | GND | GND | GND | I/O SMA | N |
S6 | I/O | GND | GND | GND | GND | I/O SMA | N |
S7 | I/O | GND | GND | GND | GND | I/O SMA | N |
S8 | I/O | GND | GND | GND | GND | I/O SMA | N |
D | I/O | GND | GND | GND | GND | I/O SMA | N |
Signal | Test Point ID |
---|---|
VDD | TP1 and TP10 |
GND | TP3, TP4, TP5, TP6, TP7, TP8, and TP9 |
VSS | TP2 and TP11 |
D | TP20 and TP21 |
S1 | TP22 and TP23 |
S2 | TP24 and TP25 |
S3 | TP26 and TP27 |
S4 | TP28 and TP29 |
S5 | TP30 and TP31 |
S6 | TP32 and TP33 |
S7 | TP34 and TP35 |
S8 | TP36 and TP37 |
A0 | TP12 and TP13 |
A1 | TP14 and TP15 |
A2 | TP16 and TP17 |
EN | TP18 and TP19 |
Figure 7-1 and Figure 7-2 show the EVM PCB layout images.
Schemetic views fo the TMUX7208EVM. Figure 8-1 shows the editor view, which includes all connections and parts that are DNI. Figure 8-2 shows DNI view, removing DNI parts which are not included on the evaluation model out-of-the-box.
Table 9-1 details the EVM bill of materials.
Designator | Component | Manufactuer | Description | Quantity |
---|---|---|---|---|
C1, C2 | CKG45NX7S2A106M500JJ | TDK | CAP, CERM, 10 µF, 100 V, ± 20%, X7S, AEC-Q200 Grade 1, 1812 | 2 |
C4, C5 | C1608X7S2A104K080AB | TDK | CAP, CERM, 0.1 µF, 100 V, ± 10%, X7S, 0603 | 2 |
C6, C7 | C2012X7S2A105K125AB | TDK | CAP, CERM, 1 µF, 100 V, ± 10%, X7S, 0805 | 2 |
H1, H2, H3, H4 | SJ-5303 (CLEAR) | Bumper Specialties, Inc. | Bumpon, Hemisphere, 0.44 X 0.20, Clear | 4 |
J1 | 691214110003 | Wurth Electronics | Terminal Block, 3.5 mm, 3×1, Tin, TH | 1 |
J2 | PEC02SAAN | Sullins Connector Solutions | Header, 100 mil, 2×1, Tin, TH | 1 |
J3, J8, J5, J9, J10 | PEC03SAAN | Sullins Connector Solutions | Header, 100 mil, 3×1, Tin, TH | 5 |
R3, R4, R5, R6, R9, R10, R13, R14 | RMCF0603ZT0R00 | Stackpole Electronics Inc | RES, 0, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 | 8 |
SH-J? | SPC02SYAN | Sullins Connector Solutions | Shunt, 100 mil, Flash Gold, Black | 7 |
TP1, TP3, TP4, TP6, TP8, TP9, TP10, TP11, TP14, TP15, TP17, TP18 | 5000 | Keystone | Test Point, Miniature, Red, TH | 12 |
J2 | 691214110003 | Würth Elektronik | Terminal Block, 3.5 mm, 3×1, Tin, TH | 1 |
J7, J8, J9, J10, J11, J12, J13, J14, J15 | PEC04SAAN | Sullins Connector Solutions | Header, 100 mil, 4×1, Tin, TH | 9 |
A0.0, A0.1, A1.0, A1.1, A2.0, A2.1, D0, D1, EN0, EN1, S1.0, S1.1, S2.0, S2.1, S3.0, S3.1, S4.0, S4.1, S5.0, S5.1, S6.0, S6.1, S7.0, S7.1, S8.0, S8.1 | 5122 | Keystone Electronics | Test Point, Compact, Blue, TH | 26 |
GND1, GND2, GND3, GND4, GND5, GND6, GND7 | 5006 | Keystone Electronics | Test Point, Compact, Black, TH | 7 |
VDD1, VSS1 | 5005 | Keystone Electronics | Test Point, Compact, Red, TH | 2 |
VDD2 | 5000 | Keystone Electronics | Test Point, Miniature, Red, TH | 1 |
VSS2 | 5000 | Keystone Electronics | Test Point, Miniature, Red, TH | 1 |
J3, J4, J5, J6 | PEC03SAAN | Sullins Connector Solutions | Header, 100 mil, 3×1, Tin, TH | 4 |
J1 | PEC02SAAN | Sullins Connector Solutions | Header, 100 mil, 2×1, Tin, TH | 1 |
C5, C6 | CKG45NX7S2A106M500JJ | TDK Corporation | CAP, CERM, 10 µF, 100 V, ± 20%, X7S, AEC-Q200 Grade 1, 1812 | 2 |
H9, H10, H11, H12 | SJ-5303 (CLEAR) | 3M | Bumpon, Hemisphere, 0.44 X 0.20, Clear | 4 |
C3, C4 | C2012X7S2A105K125AB | TDK Corporation | CAP, CERM, 1 µF, 100 V, ± 10%, X7S, 0805 | 2 |
C1, C2 | C1608X7S2A104K080AB | TDK Corporation | CAP, CERM, 0.1 µF, 100 V, ± 10%, X7S, 0603 | 2 |
R3, R4, R9, R10, R15, R16, R17, R18, R23, R24, R25, R26, R31, R32, R33, R34, R39, R40, R41, R42, R46, R47, R49 | RMCF0603ZT0R00 | Stackpole Electronics Inc. | RES, 0, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 | 23 |