ZHCSV38T January   1993  – December 2024 SN54LVC02A , SN74LVC02A

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 说明
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions, SN54LVC02A
    4. 4.4  Recommended Operating Conditions, SN74LVC02A
    5. 4.5  Thermal Information
    6. 4.6  Electrical Characteristics, SN54LVC02A
    7. 4.7  Electrical Characteristics, SN74LVC02A
    8. 4.8  Switching Characteristics, SN54LVC02A
    9. 4.9  Switching Characteristics, SN74LVC02A
    10. 4.10 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

4.5 Thermal Information

THERMAL METRIC(1) SN74LVC02A UNIT
BQA (WQFN) D (SOIC) DB (SSOP) NS (SOP) PW (TSSOP) RGY (VQFN)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 102.3 127.8 140.4 123.8 150.8 92.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.