DATA SHEET
TPS16530 58 V、4.5 A 电子保险丝（带脉冲电流支持），用于负载瞬态
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1 特性
- 工作电压为 4.5V 至 58V，
绝对最大值为 67V - 集成式 58V、31mΩ RON 热插拔 FET
- 可调节电流限值：0.6A 至 4.5A (±7%)
- 在 56V 电压下工作时提供符合 IPC9592B 标准的间隙（20 引脚 HTSSOP）
- 2x 脉冲电流支持，用于负载瞬态
- 低静态电流，关断时为 21µA
- 精度为 ± 2% 的可调节 UVLO 切断
- 可调节输出压摆率控制，用于实现浪涌电流限制
- 通过在器件加电期间进行热调节，为大型及未知电容负载充电
- 电源正常输出 (PGOOD)
- 可选过流故障响应选项（自动重试和闭锁模式）
- 模拟电流监控器 (IMON) 输出 (± 6%)
- 采用易于使用的 20 引脚 HTSSOP 和
24 引脚 VQFN 封装
2 应用
- 在电信无线电中提供功率放大器保护
- 医疗设备
- 火警控制面板
- 工业打印机
3 说明
TPS16530 是一款易于使用的正 58V、
4.5A 电子保险丝，具有一个 31mΩ 的集成 FET，不仅提供对负载、电源和电子保险丝本身的保护以及可调特性，例如精确的过流保护、快速短路保护、输出压摆率控制和欠压锁定，还可以使用 PGOOD 来启用和禁用下游直流/直流转换器控制。
借助使能引脚，可以从外部控制内部 FET 的启用和禁用。关断引脚可用于将器件置于低功耗关断模式。为实现系统状态监视和下游负载控制，该器件提供了故障和精确的电流监视器输出。MODE 引脚可用于在两种限流故障响应（闭锁自动重试）之间灵活地对器件进行配置。
这些器件采用 20 引脚 HTSSOP
和 24 引脚 VQFN 封装，并且额定工作温度范围为 -40°C 至 +125°C。
器件信息(1)
| 器件型号 | 封装 | 封装尺寸（标称值） |
|---|---|---|
| TPS16530 | VQFN (24) | 4.00mm × 4.00mm |
| TPS16530 | HTSSOP (20) | 6.50mm x 4.40mm |
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。
简化版原理图
脉冲电流支持4 Revision History
| DATE | REVISION | NOTES |
|---|---|---|
| August 2021 | * | Initial Release |
5 Pin Configuration and Functions
Figure 5-1 TPS16530 RGE Package24-Pin VQFNTop View
Figure 5-2 TPS16530 PWP Package20-Pin HTSSOPTop ViewTable 5-1 Pin Functions
| PIN | TYPE | DESCRIPTION | ||
|---|---|---|---|---|
| NAME | TPS16530 | |||
| VQFN | HTSSOP | |||
| IN | 1 | 1 | P | Power Input. Connects to the DRAIN of the internal FET. |
| 2 | 2 | |||
| — | 3 | |||
| P_IN | 5 | 4 | P | Supply voltage of the device. Always connect P_IN to IN directly. |
| UVLO | 6 | 6 | I | Input for setting the programmable undervoltage lockout threshold. An undervoltage event turns off the internal FET and asserts FLT to indicate the power-failure. If not used, this pin can be connected to IN or P_IN. |
| EN | 7 | 8 | I | Active low enable pin. If not used, this pin can be connected to GND. Do not leave this pin open or floating. |
| GND | 8 | 9 | — | Connect GND to system ground |
| dVdT | 9 | 10 | I/O | A capacitor from this pin to GND sets output voltage slew rate. Leaving this pin floating enables device power up in thermal regulation resulting in fast output charge. See the Hot Pug-In and In-Rush Current Control section. |
| ILIM | 10 | 11 | I/O | A resistor from this pin to GND sets the overload limit. See Overload and Short Circuit Protection section. |
| MODE | 11 | 12 | I | Mode selection pin for Overload fault response. See the Device Functional Modes section. |
| SHDN | 12 | 13 | I | Shutdown pin. Pulling SHDN low makes the device to enter into low power shutdown mode. Cycling SHDN pin voltage resets the device that has latched off due to a fault condition. |
| IMON | 13 | 14 | O | Analog current monitor output. This pin sources a scaled down ratio of current through the internal FET. A resistor from this pin to GND converts current to proportional voltage. If unused, leave this pin floating. |
| FLT | 14 | 15 | O | Fault event indicator. It is an open drain output. If unused, leave floating or connect to GND. |
| PGOOD | 16 | 16 | O | Active High. A high indicates that the internal FET is enhanced. PGOOD goes low when the internal FET is turned OFF during a fault or when SHDN is pulled low. If PGOOD is unused then connect to GND or leave it floating. |
| OUT | 17 | 18 | P | Power Output of the device |
| 18 | 19 | |||
| — | 20 | |||
| N.C | 3 | 5 | — | Internally Not connected. Can be connected to other pins (P_IN, OUT, GND) for enhanced thermal performance. |
| 4 | 7 | |||
| 15 | 17 | |||
| 19 | — | |||
| 20 | — | |||
| 21 | — | |||
| 22 | — | |||
| 23 | — | |||
| 24 | — | |||
| PowerPAD™ | — | Connect the PowerPAD to GND plane for heat sinking. Do not use the PowerPAD as the only electrical connection to GND. | ||
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| IN, P_IN, OUT, UVLO, FLT, PGOOD | Input Voltage | –0.3 | 67 | V |
| EN, dVdT, IMON, MODE, SHDN, ILIM | Input Voltage | –0.3 | 5.5 | |
| I FLT , IdVdT, IPGOOD | Sink current | 10 | mA | |
| IdVdT, IILIM , IMODE, I SHDN | Source current | Internally limited | ||
| TJ | Operating Junction temperature | –40 | 150 | °C |
| Transient junction temperature | –40 | T(TSD) | ||
| Tstg | Storage temperature | –65 | 150 | |
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
