IN |
1 |
1 |
P |
Power Input. Connects to the DRAIN of the internal
FET. |
2 |
2 |
— |
3 |
P_IN |
5 |
4 |
P |
Supply voltage of the device. Always connect P_IN to IN
directly. |
UVLO |
6 |
6 |
I |
Input for setting the programmable undervoltage lockout threshold.
An undervoltage event turns off the internal FET and asserts
FLT to indicate the power-failure. If not
used, this pin can be connected to IN or P_IN. |
EN |
7 |
8 |
I |
Active low enable pin. If not used, this pin can be connected to
GND. Do not leave this pin open or floating. |
GND |
8 |
9 |
— |
Connect GND to system ground |
dVdT |
9 |
10 |
I/O |
A
capacitor from this pin to GND sets output voltage slew rate.
Leaving this pin floating enables device power up in thermal
regulation resulting in fast output charge. See the Hot Pug-In and In-Rush Current Control
section. |
ILIM |
10 |
11 |
I/O |
A
resistor from this pin to GND sets the overload limit. See Overload and Short Circuit Protection
section. |
MODE |
11 |
12 |
I |
Mode selection pin for Overload fault response. See the Device Functional Modes section. |
SHDN |
12 |
13 |
I |
Shutdown pin. Pulling SHDN low makes the
device to enter into low power shutdown mode. Cycling
SHDN pin voltage resets the device that has
latched off due to a fault condition. |
IMON |
13 |
14 |
O |
Analog current monitor output. This pin sources a scaled down ratio
of current through the internal FET. A resistor from this pin to GND
converts current to proportional voltage. If unused, leave this pin
floating. |
FLT |
14 |
15 |
O |
Fault event indicator. It is an open drain output. If unused, leave
floating or connect to GND. |
PGOOD |
16 |
16 |
O |
Active High. A high indicates that the internal FET is enhanced.
PGOOD goes low when the internal FET is turned OFF during a fault or
when SHDN is pulled low. If PGOOD is unused
then connect to GND or leave it floating. |
OUT |
17 |
18 |
P |
Power Output of the device |
18 |
19 |
— |
20 |
N.C |
3 |
5 |
— |
Internally Not connected. Can be connected to other
pins (P_IN, OUT, GND) for enhanced thermal performance. |
4 |
7 |
15 |
17 |
19 |
— |
20 |
— |
21 |
— |
22 |
— |
23 |
— |
24 |
— |
PowerPAD™ |
— |
Connect the PowerPAD to GND plane for heat sinking. Do not use the
PowerPAD as the only electrical connection to GND. |