ZHCSNB6A April   2021  – February 2022 TPS23882B

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1. 6.1 Detailed Pin Description
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Timing Diagrams
  9. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1 Operating Modes
        1. 9.1.1.1 Auto
        2. 9.1.1.2 Autonomous
        3. 9.1.1.3 Semiauto
        4. 9.1.1.4 Manual and Diagnostic
        5. 9.1.1.5 Power Off
      2. 9.1.2 PoE Compliance Terminology
      3. 9.1.3 PoE 2 Type-3 2-Pair PoE
      4. 9.1.4 Requested Class Versus Assigned Class
      5. 9.1.5 Power Allocation and Power Demotion
      6. 9.1.6 Programmable SRAM
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Port Remapping
      2. 9.3.2 Port Power Priority
      3. 9.3.3 Analog-to-Digital Converters (ADC)
      4. 9.3.4 I2C Watchdog
      5. 9.3.5 Current Foldback Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Detection
      2. 9.4.2 Classification
      3. 9.4.3 DC Disconnect
    5. 9.5 I2C Programming
      1. 9.5.1 I2C Serial Interface
    6. 9.6 Register Maps
      1. 9.6.1 Complete Register Set
      2. 9.6.2 Detailed Register Descriptions
        1. 9.6.2.1  INTERRUPT Register
        2. 9.6.2.2  INTERRUPT MASK Register
        3. 9.6.2.3  POWER EVENT Register
        4. 9.6.2.4  DETECTION EVENT Register
        5. 9.6.2.5  FAULT EVENT Register
        6. 9.6.2.6  START/ILIM EVENT Register
        7. 9.6.2.7  SUPPLY and FAULT EVENT Register
          1. 9.6.2.7.1 Detected SRAM Faults and "Safe Mode"
        8. 9.6.2.8  CHANNEL 1 DISCOVERY Register
        9. 9.6.2.9  CHANNEL 2 DISCOVERY Register
        10. 9.6.2.10 CHANNEL 3 DISCOVERY Register
        11. 9.6.2.11 CHANNEL 4 DISCOVERY Register
        12. 9.6.2.12 POWER STATUS Register
        13. 9.6.2.13 PIN STATUS Register
          1. 9.6.2.13.1 AUTONOMOUS MODE
        14. 9.6.2.14 OPERATING MODE Register
        15. 9.6.2.15 DISCONNECT ENABLE Register
        16. 9.6.2.16 DETECT/CLASS ENABLE Register
        17. 9.6.2.17 Power Priority / 2Pair PCUT Disable Register Name
        18. 9.6.2.18 TIMING CONFIGURATION Register
        19. 9.6.2.19 GENERAL MASK Register
        20. 9.6.2.20 DETECT/CLASS RESTART Register
        21. 9.6.2.21 POWER ENABLE Register
        22. 9.6.2.22 RESET Register
        23. 9.6.2.23 ID Register
        24. 9.6.2.24 Connection Check and Auto Class Status Register
        25. 9.6.2.25 2-Pair Police Ch-1 Configuration Register
        26. 9.6.2.26 2-Pair Police Ch-2 Configuration Register
        27. 9.6.2.27 2-Pair Police Ch-3 Configuration Register
        28. 9.6.2.28 2-Pair Police Ch-4 Configuration Register
        29. 9.6.2.29 Capacitance (Legacy PD) Detection
        30. 9.6.2.30 Power-on Fault Register
        31. 9.6.2.31 PORT RE-MAPPING Register
        32. 9.6.2.32 Channels 1 and 2 Multi Bit Priority Register
        33. 9.6.2.33 Channels 3 and 4 Multi Bit Priority Register
        34. 9.6.2.34 Port Power Allocation Register
        35. 9.6.2.35 TEMPERATURE Register
        36. 9.6.2.36 INPUT VOLTAGE Register
        37. 9.6.2.37 CHANNEL 1 CURRENT Register
        38. 9.6.2.38 CHANNEL 2 CURRENT Register
        39. 9.6.2.39 CHANNEL 3 CURRENT Register
        40. 9.6.2.40 CHANNEL 4 CURRENT Register
        41. 9.6.2.41 CHANNEL 1 VOLTAGE Register
        42. 9.6.2.42 CHANNEL 2 VOLTAGE Register
        43. 9.6.2.43 CHANNEL 3 VOLTAGE Register
        44. 9.6.2.44 CHANNEL 4 VOLTAGE Register
        45. 9.6.2.45 2x FOLDBACK SELECTION Register
        46.       93
        47. 9.6.2.46 FIRMWARE REVISION Register
        48. 9.6.2.47 I2C WATCHDOG Register
        49. 9.6.2.48 DEVICE ID Register
        50. 9.6.2.49 CHANNEL 1 DETECT RESISTANCE Register
        51. 9.6.2.50 CHANNEL 2 DETECT RESISTANCE Register
        52. 9.6.2.51 CHANNEL 3 DETECT RESISTANCE Register
        53. 9.6.2.52 CHANNEL 4 DETECT RESISTANCE Register
        54. 9.6.2.53 CHANNEL 1 DETECT CAPACITANCE Register
        55. 9.6.2.54 CHANNEL 2 DETECT CAPACITANCE Register
        56. 9.6.2.55 CHANNEL 3 DETECT CAPACITANCE Register
        57. 9.6.2.56 CHANNEL 4 DETECT CAPACITANCE Register
        58. 9.6.2.57 CHANNEL 1 ASSIGNED CLASS Register
        59. 9.6.2.58 CHANNEL 2 ASSIGNED CLASS Register
        60. 9.6.2.59 CHANNEL 3 ASSIGNED CLASS Register
        61. 9.6.2.60 CHANNEL 4 ASSIGNED CLASS Register
        62. 9.6.2.61 AUTO CLASS CONTROL Register
        63. 9.6.2.62 CHANNEL 1 AUTO CLASS POWER Register
        64. 9.6.2.63 CHANNEL 2 AUTO CLASS POWER Register
        65. 9.6.2.64 CHANNEL 3 AUTO CLASS POWER Register
        66. 9.6.2.65 CHANNEL 4 AUTO CLASS POWER Register
        67. 9.6.2.66 ALTERNATIVE FOLDBACK Register
        68. 9.6.2.67 SRAM CONTROL Register
          1. 9.6.2.67.1 SRAM START ADDRESS (LSB) Register
          2. 9.6.2.67.2 SRAM START ADDRESS (MSB) Register
          3. 9.6.2.67.3 118
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Autonomous Operation
      2. 10.1.2 Introduction to PoE
        1. 10.1.2.1 2-Pair Versus 4-Pair Power and the New IEEE802.3bt Standard
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Connections on Unused Channels
        2. 10.2.2.2 Power Pin Bypass Capacitors
        3. 10.2.2.3 Per Port Components
        4. 10.2.2.4 System Level Components (not Shown in the Schematic Diagrams)
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 VDD
    2. 11.2 VPWR
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Kelvin Current Sensing Resistors
      2.      138
    2. 12.2 Layout Example
      1. 12.2.1 Component Placement and Routing Guidelines
        1. 12.2.1.1 Power Pin Bypass Capacitors
        2. 12.2.1.2 Per-Port Components
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

重要声明和免责声明

TI 均以“原样”提供技术性及可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证其中不含任何瑕疵，且不做任何明示或暗示的担保，包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示担保。

所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任：(1) 针对您的应用选择合适的TI 产品；(2) 设计、验证并测试您的应用；(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更，恕不另行通知。TI 对您使用所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源，也不提供其它TI或任何第三方的知识产权授权许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等，TI对此概不负责，并且您须赔偿由此对TI 及其代表造成的损害。

TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE

邮寄地址：上海市浦东新区世纪大道 1568 号中建大厦 32 楼，邮政编码：200122

Copyright © 2022 德州仪器半导体技术（上海）有限公司