TPS92519-Q1 是一款单片双路同步降压 LED 驱动器,具有 4.5V 至 65V 宽工作输入电压范围,可独立为两串串联的 LED 供电。
TPS92519-Q1 实施自适应导通时间平均电流模式控制功能,经设计可与分流 FET 调光技术和基于 LED 矩阵管理器的动态光束前照灯兼容。自适应导通时间控制功能可提供近乎恒定的开关频率,可使用 FSET 输入来设置该开关频率。电感器电流感应和闭环反馈功能可在较宽的输入电压、输出电压和环境温度范围内实现 ±4% 以上的精度。
高性能 LED 驱动器可使用模拟调光或 PWM 调光技术来单独调制 LED 电流。通过在高阻抗模拟调整 (IADJ) 输入范围内将电压从 140mV 改变为 2.45V,可获得超过 16:1 范围的线性模拟调光响应。通过使用所需占空比和频率直接调制对应的 UDIM 输入引脚,实现 LED 电流的 PWM 调光。该器件支持高频分流 FET 调光,并与使用 LED 矩阵管理器的像素控制技术兼容。
TPS92519-Q1 支持两个或更多通道的并行运行,从而实现驱动大电流 LED 或激光二极管所需的灵活性。电流基于 IADJ 输入在并行通道之间共享,不受元件容差和寄生效应的影响。
TPS92519-Q1 包含高级故障保护功能:逐周期开关电流限制、自举欠压和热关断。该器件包括一个开漏故障输出以指示输出开路和短路情况。
TPS92519-Q1 采用 8.1mm × 11mm 热增强型 32 引脚 HTSSOP 封装,具有 2.75mm × 3.45mm 的底部外露焊盘。
器件型号(1) | 封装 | 封装尺寸(标称值) |
---|---|---|
TPS92519-Q1 | HTSSOP | 8.1mm × 11mm |
Changes from Revision * (August 2021) to Revision A (December 2021)
PIN | I/O | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
DAP | |||
BST1 | 19 | P | Supply input for high-side MOSFET gate drive circuit. Connect a ceramic capacitor between BSTx and SWx pins. An internal diode is connected between V5D and BSTx. |
BST2 | 30 | P | |
COMP1 | 16 | I/O | Output of internal transconductance error amplifier. Connect an integral compensation network to ensure stability. |
COMP2 | 1 | I/O | |
CSN1 | 17 | I | Negative input (–) of internal rail-to-rail transconductance error amplifier. Connect directly to the negative node of the LED current sense resistor, RCS. |
CSN2 | 32 | I | |
CSP1 | 18 | I | Positive input (+) of internal rail-to-rail transconductance error amplifier. Connect directly to the positive node of the LED current sense resistor, RCS. |
CSP2 | 31 | I | |
EN | 24 | I | An active high logic input enables the devices. Pull this pin low to enter low power sleep state. |
FLT1 | 22 | O | Open-drain fault indicator. Connect to V5D with a resistor to create an active low fault signal output. |
FLT2 | 27 | O | |
FSET | 25 | I | Frequency select input. Connect to V5D to operate at nominal frequency of 440 kHz. Connect to GND to operate at nominal frequency of 2.1 MHz. |
GND | 7, 10 | G | Signal ground. Return for the internal voltage reference and analog circuits. Connect to circuit ground to complete return path. |
IADJ1 | 23 | I | Analog adjust input. Input below 100 mV disables the channel. The analog input can be varied between 140 mV to 2.4 V to set current reference from 10 mV to 173 mV. Connect a 0.1-μF capacitor from pin to GND. |
IADJ2 | 26 | I | |
PGND | 3, 4, 13, 14 | G | Ground returns for low-side MOSFETs |
SW1 | 20, 21 | P | Switching output of the regulator. Internally connected to both power MOSFETs. Connect to the power inductor. |
SW2 | 28, 29 | P | |
UDIM1 | 15 | I | Undervoltage lockout and external PWM dimming input. Connect to VIN through a resistor divider to implement input undervoltage protection. Diode couple external PWM signal to enable dimming. Locally decouple to GND using a 1-nF ceramic capacitor. Do not float. |
UDIM2 | 2 | I | |
V5A | 8 | P | Analog supply voltage. Locally decouple to GND using a 100-nF to 1-µF ceramic capacitor located close to the controller. |
V5D | 9 | P | Digital supply voltage. Locally decouple to GND using a 2.2-µF to 4.7-µF ceramic capacitor located close to the controller. |
VIN1 | 11, 12 | P | Power inputs and connections to high-side MOSFET drain node. Connect to the power supply and bypass capacitors CIN. The path from the VIN pin to high frequency bypass CIN and PGND must be as short as possible. |
VIN2 | 5, 6 | P |
MIN | MAX | UNIT | ||
---|---|---|---|---|
Supply Voltage | V5A, V5D to GND | –0.3 | 5.5 | V |
Boot voltage | BSTx to SWx | –0.3 | 5.5 | V |
BSTx to PGND | –0.3 | 70 | V | |
Switch node voltage | SWx to PGND | –0.5 | 65 | V |
SWx to PGND (< 10ns) | –3.5 | V | ||
Drain node voltage | VINx to PGND | –0.3 | 65 | V |
Current | CSNx to VINx (< 10µs) | 1.5 | A | |
GND to CSPx, GND to CSNx (< 10µs) | 430 | mA | ||
Inputs | CSNx - VINx | 0.5 | V | |
CSPx, CSNx to GND | –0.5 | 65 | V | |
CSPx to CSNx | –0.3 | 0.3 | V | |
UDIMx to GND | –0.3 | 65 | V | |
COMPx, IADJx, FSET, EN to GND | –0.3 | 5.5 | V | |
Outputs | FLTx to GND | –0.3 | 5.5 | V |
Junction temperature | TJ | 150 | °C | |
Lead temperature | Soldering, 10 s | 260 | °C | |
Storage temperature | Tstg | –65 | 150 | °C |
VALUE | UNIT | ||||
---|---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human body model (HBM), per AEC Q100-002(1) | ±2000 | V | |
Charged device model (CDM), per AEC Q100-011 | Corner pins (1, 16, 17, and 32) | ±750 | |||
Other pins | ±500 |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
VIN | Input voltage | 4.5 | 63 | V | |
V5A, V5D | Bias supply | 4.5 | 5 | 5.3 | V |
dV5x/dt | Bias supply slew-rate | 20 | V/s | ||
∆V(CSP-CSN) | Sensed inductor current ripple | 20 | mV | ||
dvCSP/dt | CSP slew-rate | 10 | V/µs | ||
ILED | LED current | 2 | A | ||
fUDIM | External PWM dimming frequency | 1000 | Hz | ||
TA | Ambient temperature | –40 | 125 | °C | |
TJ | Junction temperature | –40 | 150 | °C |