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  • AMC3302 具有集成直流/直流转换器的高精度、±50mV 输入、增强型隔离放大器

    • ZHCSLS4B August   2020  – July 2021 AMC3302

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  • AMC3302 具有集成直流/直流转换器的高精度、±50mV 输入、增强型隔离放大器
  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Timing Diagram
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Data Isolation Channel Signal Transmission
      3. 7.3.3 Analog Output
      4. 7.3.4 Isolated DC/DC Converter
      5. 7.3.5 Diagnostic Output
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Shunt Resistor Sizing
        2. 8.2.2.2 Input Filter Design
        3. 8.2.2.3 Differential to Single-Ended Output Conversion
      3. 8.2.3 Application Curve
    3. 8.3 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information
  13. 重要声明
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DATA SHEET

AMC3302 具有集成直流/直流转换器的高精度、±50mV 输入、增强型隔离放大器

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

1 特性

  • 3.3V 或 5V 单电源，具有集成直流/直流转换器
  • ±50mV 输入电压范围，针对使用分流电阻器测量电流进行了优化
  • 固定增益：41
  • 低直流误差：
    • 失调电压：±50μV（最大值）
    • 温漂：±0.5µV/°C（最大值）
    • 增益误差：±0.2%（最大值）
    • 增益误差漂移：±35ppm/°C（最大值）
    • 非线性度：±0.03%（最大值）
  • 高 CMTI：95 kV/µs（最小值）
  • 系统级诊断功能
  • 符合 CISPR-11 和 CISPR-25 EMI 标准
  • 安全相关认证：
    • 符合 DIN VDE V 0884-11 标准的 6000V<sub>1PK</sub>2 增强型隔离
    • 符合 UL1577 标准且长达 1 分钟的 4250VRMS 隔离
  • 可在工业级工作温度范围内正常工作：–40°C 至 +125°C

2 应用

  • 可用于以下应用的隔离式电流感应：
    • 保护继电器
    • 电机驱动器
    • 电源
    • 光电逆变器

3 说明

AMC3302 是一款精密的隔离放大器，针对基于分流器的电流测量进行了优化。这款完全集成的隔离式直流/直流转换器可实现器件低侧的单电源运行，使该器件成为空间受限应用的独特解决方案。增强型电容式隔离栅已通过 VDE V 0884-11 和 UL1577 认证，并支持高达 1.2kVRMS 的工作电压。

该隔离栅可将系统中以不同共模电压电平运行的各器件隔开，并保护电压较低的器件免受高电压冲击。

AMC3302 的输入针对直接连接低阻抗分流电阻器或另一个具有低信号电平的低阻抗电压源的情况进行了优化。出色的直流精度和低温漂支持在 –40°C 至 +125°C 的扩展工业温度范围内进行精确的电流测量。

AMC3302 的集成直流/直流转换器故障检测和诊断输出引脚可简化系统级设计和诊断。

器件信息(1)
器件型号 封装 封装尺寸（标称值）
AMC3302 SOIC (16) 10.30mm × 7.50mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。
GUID-20201216-CA0I-RL6S-RZL3-FJQ6Q6RMWNMH-low.gif典型应用

4 Revision History

Changes from Revision A (February 2021) to Revision B (July 2021)

  • 更改了光伏逆变器的链接地址Go
  • Changed LDO_OUT pin description in Pin Functions table to include that no external load is allowed on the LDO_OUT pinGo
  • Changed overvoltage category for rated mains voltage ≤ 600 V from I-IV to I-III and for rated mains voltage ≤1000 V from I-III to I-II Go
  • Changed CIO from ~3.5 pF to ~4.5 pFGo
  • Changed output bandwidth (BW) minimum value from 300 kHz to 290 kHzGo
  • Changed CMTI limits from 85 kV/µs (min), 135 kV/µs (typ) to 95 kV/µs (min), 155 kV/µs (typ)Go
  • Deleted histograms from Typical Characteristics sectionGo
  • Changed first bullet in Isolated DC/DC Converter section to include that the low-side LDO does not output a constant output voltage and is not intended for driving any external loadGo
  • Added discussion of high-side and low-side LDO to What to Do and What Not to Do sectionGo
  • Added information on reducing radiated emission to Power Supply Recommendations section, changed Recommended External Components tableGo
  • Added ferrite beads to Recommended Layout of the AMC3302 figureGo
  • Added EMI application note to Related Documentation sectionGo

Changes from Revision * (August 2020) to Revision A (February 2021)

  • 将文档状态从预告信息更改为量产数据Go
  • Added VDDUV and VDDPOR specificationsGo

5 Pin Configuration and Functions

GUID-20201216-CA0I-8ZPH-C6HC-6VQML9PKTK7K-low.gif Figure 5-1 DWE Package, 16-Pin SOIC, Top View
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1 DCDC_OUT Power High-side output of the isolated DC/DC converter; connect this pin to the HLDO_IN pin.(1)
2 DCDC_HGND High-side power ground High-side ground reference for the isolated DC/DC converter; connect this pin to the HGND pin.
3 HLDO_IN Power Input of the high-side LDO; connect this pin to the DCDC_OUT pin(1)
4 NC — No internal connection; connect this pin to HGND or leave this pin unconnected.
5 HLDO_OUT Power Output of the high-side LDO.(1)
6 INP Analog input Noninverting analog input. Either INP or INN must have a DC current path to HGND to define the common-mode input voltage.(2)
7 INN Analog input Inverting analog input. Either INP or INN must have a DC current path to HGND to define the common-mode input voltage.(2)
8 HGND High-side signal ground High-side analog ground; connect this pin to the DCDC_HGND pin.
9 GND Low-side signal ground Low-side analog ground; connect this pin to the DCDC_GND pin.
10 OUTN Analog output Inverting analog output.
11 OUTP Analog output Noninverting analog output.
12 VDD Low-side power Low-side power supply.(1)
13 LDO_OUT Power Output of the low-side LDO; connect this pin to the DCDC_IN pin. The output of the LDO must not be loaded by external circuitry.(1)
14 DIAG Digital output Active-low, open-drain status indicator output; connect this pin to the pullup supply (for example, VDD) using a resistor or leave this pin floating if not used.
15 DCDC_GND Low-side power ground Low-side ground reference for the isolated DC/DC converter; connect this pin to the GND pin.
16 DCDC_IN Power Low-side input of the isolated DC/DC converter; connect this pin to the LDO_OUT pin.(1)
(1) See the Section 9 section for power-supply decoupling recommendations.
(2) See the Section 10 section for details.

6 Specifications

6.1 Absolute Maximum Ratings

see (1)
MIN MAX UNIT
Power-supply voltage VDD to GND –0.3 6.5 V
Analog input voltage INP, INN HGND – 6 VHLDO_OUT + 0.5 V
Analog output voltage OUTP, OUTN GND – 0.5 VDD + 0.5 V
Digital output voltage DIAG GND – 0.5 6.5 V
Input current Continuous, any pin except power-supply pins –10 10 mA
Temperature Junction, TJ 150 °C
Storage, Tstg –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under  Recommended Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 V
Charged device model (CDM), per JESD22-C101 (2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)
MIN NOM MAX UNIT
POWER SUPPLY
VDD Low-side power supply VDD to GND 3 3.3 5.5 V
ANALOG INPUT
VClipping Differential input voltage before clipping output VIN = VINP – VINN ±64 mV
VFSR Specified linear differential full-scale voltage VIN = VINP – VINN –50 50 mV
Absolute common-mode input voltage (1) (VINP + VINN) / 2 to HGND –2                VHLDO_OUT V
VCM Operating common-mode input voltage (VINP + VINN) / 2 to HGND –0.032 1 V
TEMPERATURE RANGE
TA Specified ambient temperature –40 125 °C
(1) Steady-state voltage supported by the device in case of a system failure. See specified common-mode input voltage VCM for normal operation. Observe analog input voltage range as specified in the  Absolute Maximum Ratings table.

6.4 Thermal Information

THERMAL METRIC(1) AMC3302  UNIT
DWE (SOIC)
16 PINS
RθJA Junction-to-ambient thermal resistance 73.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 31 °C/W
RθJB Junction-to-board thermal resistance 44 °C/W
YJT Junction-to-top characterization parameter 16.7 °C/W
YJB Junction-to-board characterization parameter 42.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Power Ratings

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PD Maximum power dissipation VDD = 5.5 V 231 mW
VDD = 3.6 V 151

 
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