ZHCSJC1E April   2019  – December 2024 CC3235S , CC3235SF

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 应用
4. 3 说明
5. 4 功能方框图
6. 5 Device Comparison
   1. 5.1 Related Products
7. 6 Pin Configuration and Functions
   1. 6.1 Pin Diagram
   2. 6.2 Pin Attributes
      1.      11
   3. 6.3 Signal Descriptions
      1.      13
   4. 6.4 Pin Multiplexing
   5. 6.5 Drive Strength and Reset States for Analog and Digital Multiplexed Pins
   6. 6.6 Pad State After Application of Power to Device, Before Reset Release
   7. 6.7 Connections for Unused Pins
8. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Power-On Hours (POH)
   4. 7.4  Recommended Operating Conditions
   5. 7.5  Current Consumption Summary (CC3235S)
      1.      24
      2.      25
   6. 7.6  Current Consumption Summary (CC3235SF)
      1.      27
      2.      28
   7. 7.7  TX Power Control for 2.4 GHz Band
   8. 7.8  TX Power Control for 5 GHz
   9. 7.9  Brownout and Blackout Conditions
   10. 7.10 Electrical Characteristics for GPIO Pins
       1.      33
       2.      34
   11. 7.11 Electrical Characteristics for Pin Internal Pullup and Pulldown
   12. 7.12 WLAN Receiver Characteristics
       1.      37
       2.      38
   13. 7.13 WLAN Transmitter Characteristics
       1.      40
       2.      41
   14. 7.14 WLAN Transmitter Out-of-Band Emissions
       1.      43
       2.      44
   15. 7.15 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
   16. 7.16 Thermal Resistance Characteristics for RGK Package
   17. 7.17 Timing and Switching Characteristics
       1. 7.17.1 Power Supply Sequencing
       2. 7.17.2 Device Reset
       3. 7.17.3 Reset Timing
          1. 7.17.3.1 nRESET (32kHz Crystal)
          2.       52
          3.       53
          4. 7.17.3.2 nRESET (External 32kHz Clock)
             1.        55
       4. 7.17.4 Wakeup From HIBERNATE Mode
       5. 7.17.5 Clock Specifications
          1. 7.17.5.1 Slow Clock Using Internal Oscillator
          2. 7.17.5.2 Slow Clock Using an External Clock
             1.        60
          3. 7.17.5.3 Fast Clock (Fref) Using an External Crystal
             1.        62
          4. 7.17.5.4 Fast Clock (Fref) Using an External Oscillator
             1.        64
       6. 7.17.6 Peripherals Timing
          1. 7.17.6.1  SPI
             1. 7.17.6.1.1 SPI Master
                1.         68
             2. 7.17.6.1.2 SPI Slave
                1.         70
          2. 7.17.6.2  I2S
             1. 7.17.6.2.1 I2S Transmit Mode
                1.         73
             2. 7.17.6.2.2 I2S Receive Mode
                1.         75
          3. 7.17.6.3  GPIOs
             1. 7.17.6.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3V)
                1.         78
             2. 7.17.6.3.2 GPIO Input Transition Time Parameters
                1.         80
          4. 7.17.6.4  I2C
             1.        82
          5. 7.17.6.5  IEEE 1149.1 JTAG
             1.        84
          6. 7.17.6.6  ADC
             1.        86
          7. 7.17.6.7  Camera Parallel Port
             1.        88
          8. 7.17.6.8  UART
          9. 7.17.6.9  SD Host
          10. 7.17.6.10 Timers
9. 8 Detailed Description
   1. 8.1  Overview
   2. 8.2  Arm® Cortex®-M4 Processor Core Subsystem
   3. 8.3  Wi-Fi® Network Processor Subsystem
      1. 8.3.1 WLAN
      2. 8.3.2 Network Stack
   4. 8.4  Security
   5. 8.5  FIPS 140-2 Level 1 Certification
   6. 8.6  Power-Management Subsystem
   7. 8.7  Low-Power Operating Mode
   8. 8.8  Memory
      1. 8.8.1 External Memory Requirements
      2. 8.8.2 Internal Memory
         1. 8.8.2.1 SRAM
         2. 8.8.2.2 ROM
         3. 8.8.2.3 Flash Memory
         4. 8.8.2.4 Memory Map
   9. 8.9  Restoring Factory Default Configuration
   10. 8.10 Boot Modes
       1. 8.10.1 Boot Mode List
   11. 8.11 Hostless Mode
10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
       1. 9.1.1 BLE/2.4GHz Radio Coexistence
       2. 9.1.2 Antenna Selection
       3. 9.1.3 Typical Application
    2. 9.2 PCB Layout Guidelines
       1. 9.2.1 General PCB Guidelines
       2. 9.2.2 Power Layout and Routing
          1. 9.2.2.1 Design Considerations
       3. 9.2.3 Clock Interface Guidelines
       4. 9.2.4 Digital Input and Output Guidelines
       5. 9.2.5 RF Interface Guidelines
11. 10Device and Documentation Support
    1. 10.1  第三方产品免责声明
    2. 10.2  Tools and Software
    3. 10.3  Firmware Updates
    4. 10.4  Device Nomenclature
    5. 10.5  Documentation Support
    6. 10.6  Related Links
    7. 10.7  支持资源
    8. 10.8  Trademarks
    9. 10.9  静电放电警告
    10. 10.10 Export Control Notice
    11. 10.11 术语表
12. 11Revision History
13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information
       1. 12.1.1 Packaging Option Addendum

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