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  • PCF8575 具有中断输出的远程 16 位 I2C 和 SMBus I/O 扩展器

    • ZHCSIO3I January   2005  – August 2024 PCF8575

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  • PCF8575 具有中断输出的远程 16 位 I2C 和 SMBus I/O 扩展器
  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Timing Requirements
    7. 5.7 Switching Characteristics
  7. 6 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 I2C Interface
      2. 8.3.2 Interface Definition
      3. 8.3.3 Address Reference
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Minimizing ICC When I/Os Control LEDs
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power-On Reset
      2. 9.3.2 System Impact
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Documentation Support
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
  14. 重要声明
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Data Sheet

PCF8575 具有中断输出的远程 16 位 I2C 和 SMBus I/O 扩展器

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

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1 特性

  • I2C 至并行端口扩展器
  • 开漏中断输出
  • 低待机流耗，最大值为 10μA
  • 兼容大多数微控制器
  • 400kHz 快速 I2C 总线
  • 可通过 3 个硬件地址引脚设置地址，从而可在总线上连接多达 8 个器件
  • 具有高电流驱动能力的锁存输出，用于直接驱动 LED
  • 连接到 VCC 的电流源，用于主动在输出端驱动高电平
  • 闩锁性能超过 100mA，符合 JESD 78 II 类规范的要求
  • ESD 保护性能超过 JESD 22 规范要求
    • 2000V 人体放电模型
    • 200V 机器放电模型
    • 1000V 充电器件模型

2 应用

  • 电信方舱：滤波器单元
  • 服务器
  • 路由器（电信交换设备）
  • 个人计算机
  • 个人电子产品
  • 工业自动化
  • 具有较少 GPIO 的产品

3 说明

这款面向两线制双向总线 (I2C) 的 16 位 I/O 扩展器设计为在 2.5V 至 5.5V VCC 下运行。

PCF8575 器件通过 I2C 接口 [串行时钟 (SCL)、串行数据 (SDA)] 为大多数微控制器系列提供通用远程 I/O 扩展。

该器件具有一个 16 位准双向输入/输出 (I/O) 端口（P07–P00、P17–P10），其中包括具有高电流驱动能力的锁存输出，用于直接驱动 LED。每个准双向 I/O 都可以用作输入或输出（无需使用数据方向控制信号）。在上电时，这些 I/O 处于高电平。在该模式下，仅有一个连接到 VCC 的电流源处于活动状态。

封装信息
器件型号封装(1)封装尺寸(2)
PCF8575SSOP（DB，24）8.2mm × 7.8mm
SSOP（DBQ，24）8.65mm × 6mm
TVSOP（DGV，24）5mm × 6.4mm
SOIC（DW，24）15.5mm × 10.3mm
TSSOP（PW，24）7.8mm × 6.4mm
VQFN（RGV，24）4mm × 4mm
(1) 有关可用封装，请参阅节 12。
(2) 封装尺寸（长 × 宽）为标称值，并包括引脚（如适用）。
PCF8575 简化原理图简化原理图

4 Pin Configuration and Functions

Figure 4-1 DB, DBQ, DGV, DW, or PW Package SSOP, TVSOP, SOIC, TSSOP
(Top View)
PCF8575 RGE Package VQFN (Top View)Figure 4-2 RGE Package VQFN
(Top View)
PINTYPEDESCRIPTION
NAMEDB, DBQ, DGV,
DW, AND PW		RGE
A02118IAddress input 0. Connect directly to VCC or ground. Pull-up resistors are not needed.
A1223IAddress input 1. Connect directly to VCC or ground. Pull-up resistors are not needed.
A2324IAddress input 2. Connect directly to VCC or ground. Pull-up resistors are not needed.
INT122OInterrupt output. Connect to VCC through a pull-up resistor.
P0041I/OP-port input/output. Push-pull design structure.
P0152I/OP-port input/output. Push-pull design structure.
P0263I/OP-port input/output. Push-pull design structure.
P0374I/OP-port input/output. Push-pull design structure.
P0485I/OP-port input/output. Push-pull design structure.
P0596I/OP-port input/output. Push-pull design structure.
P06107I/OP-port input/output. Push-pull design structure.
P07118I/OP-port input/output. Push-pull design structure.
GND129—Ground
P101310I/OP-port input/output. Push-pull design structure.
P111411I/OP-port input/output. Push-pull design structure.
P121512I/OP-port input/output. Push-pull design structure.
P131613I/OP-port input/output. Push-pull design structure.
P141714I/OP-port input/output. Push-pull design structure.
P151815I/OP-port input/output. Push-pull design structure.
P161916I/OP-port input/output. Push-pull design structure.
P172017I/OP-port input/output. Push-pull design structure.
SCL2219ISerial clock line. Connect to VCC through a pull-up resistor
SDA2320I/OSerial data line. Connect to VCC through a pull-up resistor.
VCC2421—Supply voltage

5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VCC Supply voltage range –0.5 6.5 V
VI Input voltage range (2) –0.5 VCC + 0.5 V
VO Output voltage range (2) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –20 mA
IOK Output clamp current VO < 0 –20 mA
IOK Input/output clamp current VO < 0 or VO > VCC –20 mA
IOL Continuous output low current VO = 0 to VCC 50 mA
IOH Continuous output high current VO = 0 to VCC –4 mA
Continuous current through VCC or GND ±100 mA
Tstg Storage temperature range 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Section 5.3is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins 1000

5.3 Recommended Operating Conditions

MIN MAX UNIT
VCC Supply voltage 2.5 5.5 V
VIH High-level input voltage 0.7 × VCC VCC + 0.5 V
VIL Low-level input voltage –0.5 0.3 × VCC V
IOH P-port high-level output current –1 mA
IOHT P-port transient pullup current –10 mA
IOL P-port low-level output current 25 mA
TA Operating free-air temperature –40 85 °C

5.4 Thermal Information

THERMAL METRIC (1) PCF8575 UNIT
DB DBQ DGV DW PW RGE
24 PINS
RθJA Junction-to-ambient thermal resistance 87.8 61 86 75.6 99.7 53.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51.9 47.9 42.5 50.8 °C/W
RθJB Junction-to-board thermal resistance 56.8 50.1 66.1 31.5 °C/W
ΨJT Junction-to-top characterization parameter 14.3 21.1 2.7 3.4 °C/W
ΨJB Junction-to-board characterization parameter 56.2 49.7 65.5 31.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance - - - 14.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

5.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP(1) MAX UNIT
VIK Input diode clamp voltage II = –18 mA 2.5 V to 5.5 V –1.2 V
VPOR Power-on reset voltage VI = VCC or GND, IO = 0 VPOR 1.2 1.8 V
IOH P port VO = GND 2.5 V to 5.5 V –30 –300 μA
IOHT P-port transient pullup current High during ACK, VOH = GND 2.5 V –0.5 –1 mA
IOL SDA VOL = 0.4 V 2.5 V to 5.5 V 3 mA
P port VOL = 0.4 V 5 15
VOL = 1 V 10 25
INT VOL = 0.4 V 1.6
II SCL, SDA VI = VCC or GND 2.5 V to 5.5 V ±5 μA
A0, A1, A2 ±1
IIHL P port -250mV < Vi < GND 2.5 V to 5.5 V ±400 μA
ICC Operating mode VI = VCC or GND, IO = 0,
fscl = 400 kHz		 5.5 V 100 200 μA
3.6 V 30 75
2.7 V 20 50
Standby mode VI = VCC or GND, IO = 0, fscl = 0 kHz 5.5 V 2.5 10
3.6 V 2.5 10
2.7 V 2.5 10
ΔICC Supply current increase One input at VCC – 0.6 V,
Other inputs at VCC or GND		 2.5 V to 5.5 V 200 μA
CI SCL VI = VCC or GND 2.5 V to 5.5 V 3 7 pF
Cio SDA VIO = VCC or GND 2.5 V to 5.5 V 3 7 pF
P port 4 10
(1)
All typical values are at nominal supply voltage (2.5-V, 3.3-V, or 5-V VCC) and TA = 25°C.
 

5.6 I2C Interface Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 6-1)
MIN MAX UNIT
fscl I2C clock frequency 400 kHz
tsch I2C clock high time 0.6 μs
tscl I2C clock low time 1.3 μs
tsp I2C spike time 50 ns
tsds I2C serial data setup time 100 ns
tsdh I2C serial data hold time 0 ns
ticr I2C input rise time 20 + 0.1Cb (1) 300 ns
ticf I2C input fall time 20 + 0.1Cb (1) 300 ns
tocf I2C output fall time 10-pF to 400-pF bus 300 ns
tbuf I2C bus free time between Stop and Start 1.3 μs
tsts I2C start or repeated Start condition setup 0.6 μs
tsth I2C start or repeated Start condition hold 0.6 μs
tsps I2C Stop condition setup 0.6 μs
tvd Valid-data time SCL low to SDA output valid 1.2 μs
Cb I2C bus capacitive load 400 pF
(1) Cb = total bus capacitance of one bus line in pF

5.7 Switching Characteristics

over recommended operating free-air temperature range, CL ≤ 100 pF (unless otherwise noted) (see Figure 6-2 and Figure 6-3)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 MIN MAX UNIT
tiv Interrupt valid time P port INT 4 μs
tir Interrupt reset delay time SCL INT 4 μs
tpv Output data valid SCL P port 4 μs
tsu Input data setup time P port SCL 0 μs
th Input data hold time P port SCL 4 μs

 
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