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  • CC2642R SimpleLink™ 低功耗 Bluetooth ® 5.2 无线 MCU

    • ZHCSHI2J January   2018  – November 2023 CC2642R

      PRODUCTION DATA  

  • CONTENTS
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  • CC2642R SimpleLink™ 低功耗 Bluetooth ® 5.2 无线 MCU
  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1 Reset Timing
      2. 8.12.2 Wakeup Timing
      3. 8.12.3 Clock Specifications
        1. 8.12.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.12.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.12.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 8.12.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 8.12.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.12.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.12.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       35
      5. 8.12.5 UART
        1. 8.12.5.1 UART Characteristics
    13. 8.13 Peripheral Characteristics
      1. 8.13.1 ADC
        1. 8.13.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.13.2 DAC
        1. 8.13.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.13.3 Temperature and Battery Monitor
        1. 8.13.3.1 Temperature Sensor
        2. 8.13.3.2 Battery Monitor
      4. 8.13.4 Comparators
        1. 8.13.4.1 Low-Power Clocked Comparator
        2. 8.13.4.2 Continuous Time Comparator
      5. 8.13.5 Current Source
        1. 8.13.5.1 Programmable Current Source
      6. 8.13.6 GPIO
        1. 8.13.6.1 GPIO DC Characteristics
    14. 8.14 Typical Characteristics
      1. 8.14.1 MCU Current
      2. 8.14.2 RX Current
      3. 8.14.3 TX Current
      4. 8.14.4 RX Performance
      5. 8.14.5 TX Performance
      6. 8.14.6 ADC Performance
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  12. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information
  14. 重要声明
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Data Sheet

CC2642R SimpleLink™ 低功耗 Bluetooth ® 5.2 无线 MCU

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

1 特性

  • 微控制器
    • 功能强大的 48MHz Arm® Cortex®-M4F 处理器
    • EEMBC CoreMark® 评分：148
    • 352 kB 系统内可编程闪存
    • 256 kB ROM，用于协议和库函数
    • 8 kB 缓存 SRAM（也可作为通用 RAM 提供）
    • 80 kB 超低泄漏 SRAM。SRAM 通过奇偶校验得到保护，从而确保高度可靠运行。
    • 2 引脚 cJTAG 和 JTAG 调试
    • 支持无线 (OTA) 升级
  • 具有 4 kB SRAM 的超低功耗传感器控制器
    • 采样、存储和处理传感器数据
    • 独立于系统 CPU 运行
    • 快速唤醒进入低功耗运行
  • TI-RTOS、驱动程序、引导加载程序、低功耗 Bluetooth® 5.2 控制器嵌入在 ROM 中，优化了应用尺寸
  • 符合 RoHS 标准的封装
    • 7mm × 7mm RGZ VQFN48（31 个 GPIO）
  • 外设
    • 数字外设可连接至任何 GPIO
    • 4 个 32 位或 8 个 16 位通用计时器
    • 12 位 ADC、200ksps、8 通道
    • 2 个具有内部基准 DAC 的比较器
      （1 个连续时间比较器、1 个超低功耗比较器）
    • 可编程电流源
    • 2 个异步收发器 (UART)
    • 2 个同步串行接口 (SSI)（SPI、MICROWIRE 和 TI）
    • I2C 和 I2S
    • 实时时钟 (RTC)
    • AES 128 位和 256 位加密加速计
    • ECC 和 RSA 公钥硬件加速器
    • SHA2 加速器（包括至 SHA-512 的全套装）
    • 真随机数发生器 (TRNG)
    • 电容式检测，最多 8 通道
    • 集成温度和电池监控器
  • 外部系统
    • 片上降压直流/直流转换器
  • 低功耗
    • 有源模式 RX：6.9mA
    • 有源模式 TX (0dBm)：7.0mA
    • 有源模式 TX (5dBm)：9.2mA
    • 有源模式 MCU 48MHz (CoreMark)：
      3.4mA (71μA/MHz)
    • 传感器控制器（低功耗模式、2MHz、运行无限环路）：30.1μA
    • 传感器控制器，有源模式，24MHz，运行无限循环：808μA
    • 待机：0.94μA（RTC 运行，80 kB RAM 和 CPU 保持）
    • 关断电流：150nA（发生外部事件时唤醒）
  • 无线电部分
    • 2.4GHz 射频收发器，兼容低功耗蓝牙 5.2 与早期 LE 规范
    • 3 线、2 线、1 线 PTA 共存机制
    • 出色的接收器灵敏度：
      蓝牙 125kbps 时（LE 编码 PHY）为 -105 dBm
      1Mbps (PHY) 时为 -97dBm
    • 高达 +5dBm 的输出功率，具有温度补偿
    • 适用于符合各项全球射频规范的系统
      • EN 300 328、（欧洲）
      • EN 300 440 类别 2
      • FCC CFR47 第 15 部分
      • ARIB STD-T66（日本）
  • 开发工具和软件
    • CC26x2R LaunchPad™ 开发套件
    • SimpleLink™ LOWPOWER F2 软件开发套件 (SDK)
    • 用于简单无线电配置的 SmartRF™ Studio
    • 用于构建低功耗检测应用的 Sensor Controller Studio

2 应用

  • 手机 - 手机电池包
  • 医疗
  • 楼宇自动化
    • 楼宇安防系统 – 运动检测器、电子智能锁、门窗传感器、车库门系统、网关
    • HVAC – 恒温器、无线环境传感器、HVAC 系统控制器、网关
    • 防火安全系统 – 烟雾和热量探测器、火警控制面板 (FACP)
    • 视频监控 – IP 网络摄像头
  • 工厂自动化和控制
  • 电子销售终端 (EPOS) - RFID 读取器
  • 电网基础设施
    • 智能仪表 – 水表、燃气表、电表和热量分配表
    • 电网通信 – 无线通信 – 远距离传感器应用
    • 其他替代能源 – 能量收集
  • 通信设备
    • 有线网络 – 无线 LAN 或 Wi-Fi 接入点、边缘路由器
  • 个人电子产品
    • 便携式电子产品 – 射频智能遥控器
    • 家庭影院和娱乐 – 智能扬声器、智能显示器、机顶盒
    • 联网外设 – 消费类无线模块、指点设备、键盘
    • 游戏 – 电子玩具和机器人玩具
    • 可穿戴设备（非医用）- 智能追踪器、智能服装

     

3 说明

SimpleLink™ CC2642R 器件是一款 2.4GHz 无线微控制器 (MCU)，支持低功耗 Bluetooth® 5.2 和专有 2.4GHz 应用。该器件经过优化，可用于楼宇安防系统、HVAC、资产跟踪、医疗、有线网络、便携式电子产品、家庭影院和娱乐和联网外设市场以及需要工业性能的应用中的低功耗无线通信和高级检测。该器件的突出特性包括：

  • 支持 Bluetooth® 5.2 特性：LE 编码 PHY（远距离）、LE 2Mbit PHY（高速）、广播扩展、多个广播集、CSA#2、方向查找以及对 Bluetooth® 4.2 和早期低功耗规范的向后兼容性和支持。
  • 完全合格的 Bluetooth® 5.2 软件协议栈（SimpleLink™ LOWPOWER F2 软件开发套件 (SDK) 随附）。
  • 延长无线应用的电池寿命，完全 RAM 保持时低待机电流为 0.94µA。
  • 支持工业温度，在 105°C 下最低待机电流为 11µA。
  • 通过可编程、自主式超低功耗传感器控制器 CPU 实现高级感应，具有快速唤醒功能。例如，传感器控制器能够在系统电流为 1µA 时进行 1Hz ADC 采样。
  • 低 SER（软错误率）FIT（时基故障），可延长运行寿命，不会对工业市场造成干扰，SRAM 奇偶校验功能始终开启，可防止潜在辐射事件导致的损坏。
  • 软件控制的专用无线电控制器 (Arm® Cortex®-M0) 提供灵活的低功耗射频收发器功能，支持多个物理层和射频标准（如实时定位 (RTLS) 技术）。
  • 出色的无线电灵敏度和稳健性（选择性与阻断）性能，适用于低功耗 Bluetooth®（对于 125kbps LE 编码 PHY 为 -105dBm）。

CC2642R 器件是 SimpleLink™ MCU 平台的一部分，包括 Wi-Fi®、低功耗蓝牙、Thread、Zigbee、Sub-1GHz MCU 和主机 MCU。CC2642R 是可扩展产品系列（闪存为 32kB 至 704kB）的一部分，具有引脚对引脚兼容的封装选项，并共用一个简单易用的通用开发环境，其中包含单个核心软件开发套件 (SDK) 和丰富的工具集。借助一次性集成的 SimpleLink™ 平台，用户可以将产品组合中器件的任意组合添加到自己的设计中，从而在设计要求变更时实现代码的完全重复使用。如需更多信息，请访问 SimpleLink™ MCU 平台。

器件信息
器件型号(1) 封装 封装尺寸（标称值）
CC2642R1FRGZ VQFN (48) 7.00mm × 7.00mm
(1) 如需所有可用器件的最新器件、封装和订购信息，请参阅节 12中的“封装选项附录”或访问 TI 网站。

4 功能方框图

GUID-20231009-SS0I-GSBT-LB3L-0SFMNKP3VMC9-low.png 图 4-1 CC2642R 方框图

5 Revision History

Changes from June 12, 2023 to November 28, 2023 (from Revision I (June 2023) to Revision J (November 2023))

  • 更新了“无线电功耗”（TX 电流）Go
  • 根据新的命名约定更新了 SDK，并通篇更新了 URLGo
  • 通篇更新了单位格式Go
  • 在节 3 中添加了有关存储器可扩展性的详细信息Go
  • Updated Device Comparison tableGo
  • Updated typical Tx currents in Section 8.6, Power Consumption - Radio Modes Go
  • Added footnote about DAC output impedance in Section 8.13.2.1, Digital-to-Analog Converter (DAC) Characteristics Go
  • Updated Typical TX Current and Output Power Go
  • Added EnergyTrace information to Section 9.11 Go

6 Device Comparison

Device RADIO SUPPORT FLASH (kB) RAM + Cache (kB) GPIO PACKAGE SIZE
Sub-1 GHz Prop. 2.4GHz Prop. Wireless M-Bus mioty Wi-SUN® Sidewalk Bluetooth® LE ZigBee Thread Multiprotocol +20 dBm PA 4 × 4 mm VQFN (24) 4 × 4 mm VQFN (32) 5 × 5 mm VQFN (32) 5 × 5 mm VQFN (40) 7 × 7 mm VQFN (48) 8 × 8 mm VQFN (64)
CC1310 √ √ √ 32-128 16-20 + 8 10-30 √ √ √
CC1311R3 √ √ √ 352 32 + 8 22-30 √ √
CC1311P3 √ √ √ √ 352 32 + 8 26 √
CC1312R √ √ √ √ 352 80 + 8 30 √
CC1312R7 √ √ √ √ √ √ 704 144 + 8 30 √
CC1314R10 √ √ √ √ √ √ 1024 256 + 8 30-46 √ √
CC1352R √ √ √ √ √ √ √ √ √ 352 80 + 8 28 √
CC1354R10 √ √ √ √ √ √ √ √ √ 1024 256 + 8 28-42 √ √
CC1352P √ √ √ √ √ √ √ √ √ √ 352 80 + 8 26 √
CC1352P7 √ √ √ √ √ √ √ √ √ √ √ 704 144 + 8 26 √
CC1354P10 √ √ √ √ √ √ √ √ √ √ √ 1024 256 + 8 26-42 √ √
CC2340R5(1) √ √ √ √ 512 36 12-26 √ √
CC2640R2F √ 128 20 + 8 10-31 √ √ √
CC2642R √ 352 80 + 8 31 √
CC2642R-Q1 √ 352 80 + 8 31 √
CC2651R3 √ √ √ 352 32 + 8 23-31 √ √
CC2651P3 √ √ √ √ 352 32 + 8 22-26 √ √
CC2652R √ √ √ √ √ 352 80 + 8 31 √
CC2652RB √ √ √ √ √ 352 80 + 8 31 √
CC2652R7 √ √ √ √ √ 704 144 + 8 31 √
CC2652P √ √ √ √ √ √ 352 80 + 8 26 √
CC2652P7 √ √ √ √ √ √ 704 144 + 8 26 √
CC2674R10 √ √ √ √ √ 1024 256 + 8 31-45 √ √
CC2674P10 √ √ √ √ √ √ 1024 256 + 8 26-45 √ √
(1) ZigBee and Thread support enabled by future software update

7 Terminal Configuration and Functions

7.1 Pin Diagram – RGZ Package (Top View)

GUID-0F0A9BA7-5F2D-496A-A0C8-CA5BA5AB7487-low.gif Figure 7-1 RGZ (7 mm × 7 mm) Pinout, 0.5 mm Pitch (Top View)

 

The following I/O pins marked in Figure 7-1 in bold have high-drive capabilities:

  • Pin 10, DIO_5
  • Pin 11, DIO_6
  • Pin 12, DIO_7
  • Pin 24, JTAG_TMSC
  • Pin 26, DIO_16
  • Pin 27, DIO_17

The following I/O pins marked in Figure 7-1 in italics have analog capabilities:

  • Pin 36, DIO_23
  • Pin 37, DIO_24
  • Pin 38, DIO_25
  • Pin 39, DIO_26
  • Pin 40, DIO_27
  • Pin 41, DIO_28
  • Pin 42, DIO_29
  • Pin 43, DIO_30

7.2 Signal Descriptions – RGZ Package

Table 7-1 Signal Descriptions – RGZ Package
PIN I/O TYPE DESCRIPTION
NAME NO.
DCDC_SW 33 — Power Output from internal DC/DC converter(1)
DCOUPL 23 — Power For decoupling of internal 1.27 V regulated digital-supply (2)
DIO_0 5 I/O Digital GPIO
DIO_1 6 I/O Digital GPIO
DIO_2 7 I/O Digital GPIO
DIO_3 8 I/O Digital GPIO
DIO_4 9 I/O Digital GPIO
DIO_5 10 I/O Digital GPIO, high-drive capability
DIO_6 11 I/O Digital GPIO, high-drive capability
DIO_7 12 I/O Digital GPIO, high-drive capability
DIO_8 14 I/O Digital GPIO
DIO_9 15 I/O Digital GPIO
DIO_10 16 I/O Digital GPIO
DIO_11 17 I/O Digital GPIO
DIO_12 18 I/O Digital GPIO
DIO_13 19 I/O Digital GPIO
DIO_14 20 I/O Digital GPIO
DIO_15 21 I/O Digital GPIO
DIO_16 26 I/O Digital GPIO, JTAG_TDO, high-drive capability
DIO_17 27 I/O Digital GPIO, JTAG_TDI, high-drive capability
DIO_18 28 I/O Digital GPIO
DIO_19 29 I/O Digital GPIO
DIO_20 30 I/O Digital GPIO
DIO_21 31 I/O Digital GPIO
DIO_22 32 I/O Digital GPIO
DIO_23 36 I/O Digital or Analog GPIO, analog capability
DIO_24 37 I/O Digital or Analog GPIO, analog capability
DIO_25 38 I/O Digital or Analog GPIO, analog capability
DIO_26 39 I/O Digital or Analog GPIO, analog capability
DIO_27 40 I/O Digital or Analog GPIO, analog capability
DIO_28 41 I/O Digital or Analog GPIO, analog capability
DIO_29 42 I/O Digital or Analog GPIO, analog capability
DIO_30 43 I/O Digital or Analog GPIO, analog capability
EGP — — GND Ground – exposed ground pad(3)
JTAG_TMSC 24 I/O Digital JTAG TMSC, high-drive capability
JTAG_TCKC 25 I Digital JTAG TCKC
RESET_N 35 I Digital Reset, active low. No internal pullup resistor
RF_P 1 — RF Positive RF input signal to LNA during RX
Positive RF output signal from PA during TX
RF_N 2 — RF Negative RF input signal to LNA during RX
Negative RF output signal from PA during TX
VDDR 45 — Power Internal supply, must be powered from the internal DC/DC converter or the internal LDO(2)(4)(6)
VDDR_RF 48 — Power Internal supply, must be powered from the internal DC/DC converter or the internal LDO(2)(5)(6)
VDDS 44 — Power 1.8 V to 3.8 V main chip supply(1)
VDDS2 13 — Power 1.8 V to 3.8 V DIO supply(1)
VDDS3 22 — Power 1.8 V to 3.8 V DIO supply(1)
VDDS_DCDC 34 — Power 1.8 V to 3.8 V DC/DC converter supply
X48M_N 46 — Analog 48 MHz crystal oscillator pin 1
X48M_P 47 — Analog 48 MHz crystal oscillator pin 2
X32K_Q1 3 — Analog 32 kHz crystal oscillator pin 1
X32K_Q2 4 — Analog 32 kHz crystal oscillator pin 2
(1) For more details, see technical reference manual listed in Section 11.2.
(2) Do not supply external circuitry from this pin.
(3) EGP is the only ground connection for the device. Good electrical connection to device ground on printed circuit board (PCB) is imperative for proper device operation.
(4) If internal DC/DC converter is not used, this pin is supplied internally from the main LDO.
(5) If internal DC/DC converter is not used, this pin must be connected to VDDR for supply from the main LDO.
(6) Output from internal DC/DC and LDO is trimmed to 1.68 V.

 

7.3 Connections for Unused Pins and Modules

Table 7-2 Connections for Unused Pins
FUNCTION SIGNAL NAME PIN NUMBER ACCEPTABLE PRACTICE(1) PREFERRED
PRACTICE(1)
GPIO DIO_n 5–12
14–21
26–32
36–43 		NC or GND NC
32.768 kHz crystal X32K_Q1 3 NC or GND NC
X32K_Q2 4
DC/DC converter(2) DCDC_SW 33 NC NC
VDDS_DCDC 34 VDDS VDDS
(1) NC = No connect
(2) When the DC/DC converter is not used, the inductor between DCDC_SW and VDDR can be removed. VDDR and VDDR_RF must still be connected and the 22 µF DCDC capacitor must be kept on the VDDR net.

8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN MAX UNIT
VDDS(3) Supply voltage –0.3 4.1 V
Voltage on any digital pin(4)(5) –0.3 VDDS + 0.3, max 4.1 V
Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X48M_N and X48M_P –0.3 VDDR + 0.3, max 2.25 V
Vin Voltage on ADC input Voltage scaling enabled –0.3 VDDS V
Voltage scaling disabled, internal reference –0.3 1.49
Voltage scaling disabled, VDDS as reference –0.3 VDDS / 2.9
Input level, RF pins 5 dBm
Tstg Storage temperature –40 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime
(2) All voltage values are with respect to ground, unless otherwise noted.
(3) VDDS_DCDC, VDDS2 and VDDS3 must be at the same potential as VDDS.
(4) Including analog capable DIOs.
(5) Injection current is not supported on any GPIO pin

8.2 ESD Ratings

VALUE UNIT
VESD Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) All pins ±2000 V
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2) All pins ±500 V
(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process
(2) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Operating junction temperature(2) –40 105 °C
Operating supply voltage (VDDS) 1.8 3.8 V
Rising supply voltage slew rate 0 100 mV/µs
Falling supply voltage slew rate(1) 0 20 mV/µs
(1) For small coin-cell batteries, with high worst-case end-of-life equivalent source resistance, a 22 µF VDDS input capacitor must be used to ensure compliance with this slew rate.
(2) For thermal resistance characteristics refer to Thermal Resistance Characteristics. For application considerations, refer to Junction Temperature. 

8.4 Power Supply and Modules

over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
VDDS Power-on-Reset (POR) threshold 1.1 - 1.55 V
VDDS Brown-out Detector (BOD) (1) Rising threshold 1.77 V
VDDS Brown-out Detector (BOD), before initial boot (2) Rising threshold 1.70 V
VDDS Brown-out Detector (BOD) (1) Falling threshold 1.75 V
(1) For boost mode (VDDR =1.95 V), TI drivers software initialization will trim VDDS BOD limits to maximum (approximately 2.0 V)
(2) Brown-out Detector is trimmed at initial boot, value is kept until device is reset by a POR reset or the RESET_N pin

8.5 Power Consumption - Power Modes

When measured on the CC26x2REM-7ID reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled unless otherwise noted. 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Core Current Consumption
Icore Reset and Shutdown Reset. RESET_N pin asserted or VDDS below power-on-reset threshold 150 nA
Shutdown. No clocks running, no retention 150
Standby
without cache retention		 RTC running, CPU, 80 kB RAM and (partial) register retention.
RCOSC_LF		 0.94 µA
RTC running, CPU, 80 kB RAM and (partial) register retention
XOSC_LF		 1.09 µA
Standby
with cache retention		 RTC running, CPU, 80 kB RAM and (partial) register retention.
RCOSC_LF		 3.2 µA
RTC running, CPU, 80 kB RAM and (partial) register retention.
XOSC_LF		 3.3 µA
Idle Supply Systems and RAM powered
RCOSC_HF		 675 µA
Active MCU running CoreMark at 48 MHz
RCOSC_HF		 3.39 mA
Peripheral Current Consumption, (1), (2)
Iperi Peripheral power domain Delta current with domain enabled 97.7 µA
Serial power domain Delta current with domain enabled 7.2
RF Core Delta current with power domain enabled,
clock enabled, RF core idle		 210.9
µDMA Delta current with clock enabled, module is idle 63.9
Timers Delta current with clock enabled, module is idle(5) 81.0
I2C Delta current with clock enabled, module is idle 10.1
I2S Delta current with clock enabled, module is idle 26.3
SSI Delta current with clock enabled, module is idle 82.9
UART Delta current with clock enabled, module is idle(3) 167.5
CRYPTO (AES) Delta current with clock enabled, module is idle(4)
 25.6
PKA Delta current with clock enabled, module is idle
 84.7
TRNG Delta current with clock enabled, module is idle
 35.6
Sensor Controller Engine Consumption
ISCE Active mode 24 MHz, infinite loop 808.5 µA
Low-power mode 2 MHz, infinite loop 30.1
(1) Adds to core current Icore for each peripheral unit activated.
(2) Iperi is not supported in Standby or Shutdown modes.
(3) Only one UART running
(4) Only one SSI running
(5) Only one GPTimer running

8.6 Power Consumption - Radio Modes

When measured on the  reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Radio receive current 2440 MHz 6.9 mA
Radio transmit current
2.4 GHz PA (BLE) 		0 dBm output power setting
2440 MHz		 7.0 mA
+5 dBm output power setting
2440 MHz		 9.2 mA

 
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