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  • ADS101x具有内部基准、振荡器和可编程比较器且兼容 I2C 的超小型、低功耗 3.3kSPS、12 位 ADC

    • ZHCSHA6F May   2009  – January 2025 ADS1013 , ADS1014 , ADS1015

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  • ADS101x具有内部基准、振荡器和可编程比较器且兼容 I2C 的超小型、低功耗 3.3kSPS、12 位 ADC
  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements: I2C
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Multiplexer
      2. 7.3.2 Analog Inputs
      3. 7.3.3 Full-Scale Range (FSR) and LSB Size
      4. 7.3.4 Voltage Reference
      5. 7.3.5 Oscillator
      6. 7.3.6 Output Data Rate and Conversion Time
      7. 7.3.7 Digital Comparator (ADS1014 and ADS1015 Only)
      8. 7.3.8 Conversion Ready Pin (ADS1014 and ADS1015 Only)
      9. 7.3.9 SMbus Alert Response
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset and Power-Up
      2. 7.4.2 Operating Modes
        1. 7.4.2.1 Single-Shot Mode
        2. 7.4.2.2 Continuous-Conversion Mode
      3. 7.4.3 Duty Cycling For Low Power
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 I2C Address Selection
        2. 7.5.1.2 I2C General Call
        3. 7.5.1.3 I2C Speed Modes
      2. 7.5.2 Target Mode Operations
        1. 7.5.2.1 Receive Mode
        2. 7.5.2.2 Transmit Mode
      3. 7.5.3 Writing To and Reading From the Registers
      4. 7.5.4 Data Format
  9. 8 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Basic Connections
      2. 9.1.2 Single-Ended Inputs
      3. 9.1.3 Input Protection
      4. 9.1.4 Unused Inputs and Outputs
      5. 9.1.5 Analog Input Filtering
      6. 9.1.6 Connecting Multiple Devices
      7. 9.1.7 Quick-Start Guide
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Shunt Resistor Considerations
        2. 9.2.2.2 Operational Amplifier Considerations
        3. 9.2.2.3 ADC Input Common-Mode Considerations
        4. 9.2.2.4 Resistor (R1, R2, R3, R4) Considerations
        5. 9.2.2.5 Noise and Input Impedance Considerations
        6. 9.2.2.6 First-Order RC Filter Considerations
        7. 9.2.2.7 Circuit Implementation
        8. 9.2.2.8 Results Summary
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power-Supply Sequencing
      2. 9.3.2 Power-Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
  14. 重要声明
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Data Sheet

ADS101x具有内部基准、振荡器和可编程比较器
且兼容 I2C 的超小型、低功耗 3.3kSPS、12 位 ADC

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

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1 特性

  • 超小型封装：
    • X2QFN：1.5mm × 2mm × 0.4mm
    • SOT：2.9mm × 2.8mm × 0.6mm
  • 无噪声分辨率：12 位
  • 宽电源电压范围：2.0V 至 5.5V
  • 低电流消耗：150μA
    （连续转换模式）
  • 可编程数据速率：
    128SPS 至 3.3kSPS
  • 单周期稳定
  • 内部低漂移电压基准
  • 内部振荡器
  • I2C 接口：四个引脚可选地址
  • 工作温度范围：
    -40°C 至 +125°C
  • 器件系列：
    • ADS1013：1 个单端 (SE) 或差分 (DE) 输入
    • ADS1014：1 个单端或差分输入，具有比较器和 PGA
    • ADS1015：4 个单端输入或 2 个差分输入，具有比较器和 PGA

2 应用

  • 便携式仪表
  • 电池电压和电流监测
  • 温度测量系统
  • 消费类电子产品
  • 工厂自动化和过程控制

3 说明

ADS1013、ADS1014 和 ADS1015 (ADS101x) 是采用、无引线 X2QFN-10、SOT-10 和 VSSOP-10 封装，兼容 I2C 的 12 位低功耗精密模数转换器 (ADC)。ADS101x 采用了低漂移电压基准和振荡器。ADS1014 和 ADS1015 还包含一个可编程增益放大器 (PGA) 和一个数字比较器。除了这些特性，这些器件还具有宽工作电源电压范围，因而非常适用于功率受限型和空间受限型传感器测量应用。

ADS101x 可在数据速率高达 33008 个样本/秒 (SPS) 的情况下执行转换。PGA 可提供从 ±256mV 到 ±6.144V 的输入范围，从而实现精准的大小信号测量。ADS1015 具有一个输入多路复用器 (MUX)，可实现双路差分输入或四路单端输入测量。在 ADS1014 和 ADS1015 中使用数字比较器可进行欠压和过压检测。

封装信息
器件型号 封装(1) 封装尺寸(2)
ADS101x RUG（X2QFN，10） 1.5mm × 2mm
DYN（SOT，10） 2.9mm × 2.8mm
DGS（VSSOP，10） 3mm × 4.9mm
(1) 如需更多信息，请参阅机械、封装和可订购信息。
(2) 封装尺寸（长 × 宽）为标称值，并包括引脚（如适用）。
器件信息
器件型号 输入通道 特性(1)
ADS1013 1 个差分（1 个单端） —
ADS1014 1 个差分（1 个单端） PGA、比较器
ADS1015 2 个差分（4 个单端） PGA、比较器
(1) 有关详细信息，请参阅器件比较表。
ADS1013 ADS1014 ADS1015 简化的方框图简化的方框图

4 Device Comparison Table

DEVICE RESOLUTION
(Bits)		 MAXIMUM SAMPLE RATE
(SPS)		 INPUT CHANNELS
Differential
(Single-Ended)		 PGA INTERFACE SPECIAL FEATURES
ADS1015 12 3300 2 (4) Yes I2C Comparator
ADS1014 12 3300 1 (1) Yes I2C Comparator
ADS1013 12 3300 1 (1) No I2C None
ADS1115 16 860 2 (4) Yes I2C Comparator
ADS1114 16 860 1 (1) Yes I2C Comparator
ADS1113 16 860 1(1) No I2C None
ADS1018 12 3300 2 (4) Yes SPI Temperature sensor
ADS1118 16 860 2 (4) Yes SPI Temperature sensor

5 Pin Configuration and Functions

ADS1013 ADS1014 ADS1015 RUG Package,10-Pin(Top View)Figure 5-1 RUG Package,
10-Pin(Top View)
ADS1013 ADS1014 ADS1015 DYN and DGS Packages,10-Pin(Top View)Figure 5-2 DYN and DGS Packages,
10-Pin(Top View)
Table 5-1 Pin Functions: RUG, DYN, and DGS Packages
PIN TYPE DESCRIPTION(1)
NAME ADS1013 ADS1014 ADS1015
ADDR 1 1 1 Digital input I2C target address select
AIN0 4 4 4 Analog input Analog input 0
AIN1 5 5 5 Analog input Analog input 1
AIN2 — — 6 Analog input Analog input 2 (ADS1015 only)
AIN3 — — 7 Analog input Analog input 3 (ADS1015 only)
ALERT/RDY — 2 2 Digital output Comparator output or conversion ready (ADS1014 and ADS1015 only)
Open-drain output. Connect to VDD using a pullup resistor.
GND 3 3 3 Analog Ground
NC 2, 6, 7 6, 7 — — No connect. Leave pin floating or connect to GND.
SCL 10 10 10 Digital input Serial clock input. Connect to VDD using a pullup resistor.
SDA 9 9 9 Digital I/O Serial data input and output. Connect to VDD using a pullup resistor.
VDD 8 8 8 Analog Power supply. Connect a 0.1μF, power-supply decoupling capacitor to GND.
(1) See the Unused Inputs and Outputs section for unused pin connections.

6 Specifications

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Power-supply voltage VDD to GND –0.3 7 V
Analog input voltage AIN0, AIN1, AIN2, AIN3 GND – 0.3 VDD + 0.3 V
Digital input voltage SDA, SCL, ADDR, ALERT/RDY GND – 0.3 5.5 V
Input current, continuous Any pin except power supply pins –10 10 mA
Temperature Operating ambient, TA –40 125 °C
Junction, TJ –40 150
Storage, Tstg –60 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±2000V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)±500
(1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
POWER SUPPLY
Power supply (VDD to GND) 2 5.5 V
ANALOG INPUTS(1)
FSR Full-scale input voltage range(2) (VIN = V(AINP) – V(AINN)) ±0.256 ±6.144 V
V(AINx) Absolute input voltage GND VDD V
DIGITAL INPUTS
VDIG Digital input voltage GND 5.5 V
TEMPERATURE
TA Operating ambient temperature –40 125 °C
(1) AINP and AINN denote the selected positive and negative inputs. AINx denotes one of the four available analog inputs.
(2) This parameter expresses the full-scale range of the ADC scaling. No more than VDD + 0.3V must be applied to the analog inputs of the device. See Table 7-1 for more information.

6.4 Thermal Information

THERMAL METRIC(1) RUG (X2QFN) DYN (SOT) DGS (VSSOP) UNIT
10 PINS 10 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 245.2 147.1 182.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 69.3 59.3 67.2 °C/W
RθJB Junction-to-board thermal resistance 172.0 71.3 103.8 °C/W
ψJT Junction-to-top characterization parameter 8.2 2.8 10.2 °C/W
ψJB Junction-to-board characterization parameter 170.8 70.4 102.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.

6.5 Electrical Characteristics

at VDD = 3.3V, data rate = 128SPS, and full-scale input-voltage range (FSR) = ±2.048V (unless otherwise noted); maximum and minimum specifications apply from TA = –40°C to +125°C; typical specifications are at TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ANALOG INPUT
Common-mode input impedance FSR = ±6.144V(1) 10 MΩ
FSR = ±4.096V(1), FSR = ±2.048V 6
FSR = ±1.024V 3
FSR = ±0.512V, FSR = ±0.256V 100
Differential input impedance FSR = ±6.144V(1) 22 MΩ
FSR = ±4.096V(1) 15
FSR = ±2.048V 4.9
FSR = ±1.024V 2.4
FSR = ±0.512V, ±0.256V 710 kΩ
SYSTEM PERFORMANCE
Resolution (no missing codes) 12 Bits
DR Data rate 128, 250, 490, 920, 1600, 2400, 3300 SPS
Data rate variation All data rates –10% 10%
INL Integral nonlinearity DR = 128SPS, FSR = ±2.048V(2) 0.5 LSB
Offset error FSR = ±2.048V, differential inputs -0.5 0 0.5 LSB
FSR = ±2.048V, single-ended inputs ±0.25
Offset drift over temperature FSR = ±2.048V 0.005 LSB/°C
Long-term offset drift FSR = ±2.048V, TA = 125°C, 1000 hrs ±1 LSB
Offset channel match Match between any two inputs 0.25 LSB
Gain error(3) FSR = ±2.048V, TA = 25°C 0.05% 0.25%
Gain drift over temperature(3) FSR = ±0.256V 7 ppm/°C
FSR = ±2.048V 5 40
FSR = ±6.144V(1) 5
Long-term gain drift FSR = ±2.048V, TA = 125°C, 1000 hrs ±0.05 %
Gain match(3) Match between any two gains 0.02% 0.1%
Gain channel match Match between any two inputs 0.05% 0.1%
DIGITAL INPUT/OUTPUT
VIH High-level input voltage 0.7 VDD 5.5 V
VIL Low-level input voltage GND 0.3 VDD V
VOL Low-level output voltage IOL = 3mA GND 0.15 0.4 V
Input leakage current GND < VDIG < VDD –10 10 μA
POWER-SUPPLY
IVDD Supply current Power-down TA = 25°C 0.5 2 μA
5
Operating TA = 25°C 150 200
300
PD Power dissipation VDD = 5.0V 0.9 mW
VDD = 3.3V 0.5
VDD = 2.0V 0.3
(1) This parameter expresses the full-scale range of the ADC scaling. No more than VDD + 0.3V must be applied to the analog inputs of the device. See Table 7-1 for more information.
(2) Best-fit INL; covers 99% of full-scale.
(3) Includes all errors from onboard PGA and voltage reference.

6.6 Timing Requirements: I2C

over operating ambient temperature range and VDD = 2.0V to 5.5V (unless otherwise noted)
FAST MODE HIGH-SPEED MODE UNIT
MIN MAX MIN MAX
fSCL SCL clock frequency 0.01 0.4 0.01 3.4 MHz
tBUF Bus free time between START and STOP condition 600 160 ns
tHDSTA Hold time after repeated START condition.
After this period, the first clock is generated.		 600 160 ns
tSUSTA Setup time for a repeated START condition 600 160 ns
tSUSTO Setup time for STOP condition 600 160 ns
tHDDAT Data hold time 0 0 ns
tSUDAT Data setup time 100 10 ns
tLOW Low period of the SCL clock pin 1300 160 ns
tHIGH High period for the SCL clock pin 600 60 ns
tF Fall time for both SDA and SCL signals(1) 300 160 ns
tR Rise time for both SDA and SCL signals(1) 300 160 ns
(1) For high-speed mode maximum values, the capacitive load on the bus line must not exceed 400pF.

6.7 Timing Diagram

ADS1013 ADS1014 ADS1015 I2C Interface Timing Figure 6-1 I2C Interface Timing

 
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