• Menu
  • Product
  • Email
  • PDF
  • Order now

  • TUSB211 USB 2.0 高速信号调节器

    • ZHCSDS6D May   2015  – October 2017 TUSB211

      PRODUCTION DATA.  

  • CONTENTS
  • SEARCH
  • TUSB211 USB 2.0 高速信号调节器
  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
      1. 7.3.1 Low Speed (LS) Mode
      2. 7.3.2 Full Speed (FS) Mode
      3. 7.3.3 High Speed (HS) Mode
      4. 7.3.4 Disable Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 For a Host Side Application
        2. 8.2.2.2 For a Device Side Application
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 相关链接
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息
  13. 重要声明
search No matches found.
  • Full reading width
    • Full reading width
    • Comfortable reading width
    • Expanded reading width
  • Card for each section
  • Card with all content

 

DATA SHEET

TUSB211 USB 2.0 高速信号调节器

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

1 特性

  • 与 USB 2.0、OTG 2.0 和 BC 1.2 兼容
  • 支持低速 (LS)、全速 (FS) 和高速 (HS) 信号传输
  • 3.3V 单电源供电运行时的功耗为 55mW（典型值）
  • 可通过外部下拉电阻选择信号增益
  • 不会损坏 DP 和 DM 走线
  • 可扩展解决方案 - 用于高损耗应用的 菊花链器件
  • 紧凑型 1.6mm x 1.6mm QFN 封装

2 应用

  • 笔记本电脑
  • 台式机
  • 扩展坞
  • 手机
  • 有源电缆、电缆扩展器
  • 背板
  • 电视
  • 平板电脑

3 说明

TUSB211 是一款 USB 高速 (HS) 信号调节器，专为补偿传输通道中的 ISI 信号损失而设计。

该器件采用了对 USB 低速 (LS) 和全速 (FS) 信号无感知的设计，该设计正在申请专利。LS 和 FS 信号特征不受 TUSB211 的影响。该器件只能对 HS 信号进行补偿。

该器件具有可编程的信号增益，可精调器件性能，从而对连接器上的高速信号进行优化。这对于通过 USB 高速电气兼容性测试很有帮助。

TUSB211 的封装不会损坏 DP/DM 信号路径的连续性。这样一来，便可以针对完整 USB 通道实现零风险系统设计。

此外，TUSB211 符合 USB On-The-Go (OTG) 和电池充电 (BC) 协议。

器件信息 (1)

部件号 封装 封装尺寸（标称值）
TUSB211 X2QFN (12) 1.60mm x 1.60mm
TUSB211I
  1. 如需了解所有可用封装，请参阅产品说明书末尾的可订购产品附录。

简化电路原理图

TUSB211 TUSB211I fp_schematic_sllseo0.gif

4 修订历史记录

Changes from C Revision (June 2016) to D Revision

  • 从产品说明书中删除了器件 TUSB211-Q1Go
  • 删除了特性：符合汽车应用 标准Go
  • 删除了应用：汽车信息娱乐系统Go

Changes from A Revision (June 2015) to B Revision

  • 将 1 页产品说明书更改成了完整的产品说明书Go
  • 添加了特性：符合汽车应用 标准Go
  • 删除了特性：–40°C 至 85°C 工业温度范围Go
  • 添加了应用：汽车信息娱乐系统Go
  • 更改了简化原理图Go

Changes from * Revision (May 2015) to A Revision

  • 将产品说明书从“产品预览”更改成了“生产”Go

5 Pin Configuration and Functions

RWB Package
12 Pin (X2QFN)
Top View
TUSB211 TUSB211I po_sllso9.gif

Pin Functions

PIN I/O INTERNAL
PULLUP/PULLDOWN		 DESCRIPTION
NAME NO.
VCC 12 P N/A 3.3-V power
VREG 11 O RSTN asserted: 30 kΩ PD 1.8-V LDO output. Only enabled when operating in High Speed mode. Requires 0.1-µF external capacitor to GND to stabilize the core.
FS, LS mode: 30 kΩ PD
HS mode: N/A
GND 10 P N/A Ground
RSTN 5 I 500 kΩ PU Device disable/enable.
Recommend 0.1-µF external capacitor to GND to ensure clean power on reset if not driven.
EQ 6 I N/A USB High Speed boost select via external pull down resistor.
Sampled upon power up.
Auto selects min EQ when left floating.
Does not recognize real time adjustments.
D1P 2 I/O N/A USB High Speed positive port.
Orientation independent – Can face either upstream or downstream.
D1M 1 I/O N/A USB High Speed negative port.
Orientation independent – Can face either upstream or downstream.
D2P 7 I/O N/A USB High Speed positive port.
Orientation independent – Can face either upstream or downstream.
D2M 8 I/O N/A USB High Speed negative port.
Orientation independent – Can face either upstream or downstream.
TEST 3 I RSTN asserted: 500 kΩ PD No function. Leave floating.
ENA_HS 9 O RSTN asserted: 500kΩ PD Flag indicating that channel is in High Speed mode. Asserted upon:
  1. Detection of USB-IF High Speed test fixture from an unconnected state followed by transmission of USB TEST_PACKET pattern.
  2. Squelch detection following USB reset with a successful HS handshake [HS handshake is declared to be successful after single chirp J chirp K pair where each chirp is within 18 µs – 128 µs]

De-asserted upon detection of disconnect or suspend.
Can be left floating if not needed.
CD 4 O RSTN asserted: 500 kΩ PD Flag indicating that a USB device is attached.
Asserted from an unconnected state upon detection of DP or DM pull-up resistor.
De-asserted upon detection of disconnect.
Can be left floating if not needed.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage range VCC –0.3 3.8 V
Voltage range D1P, D1M, D2P, D2M, RSTN, EQ –0.3 3.8 V
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±3000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage 3 3.3 3.6 V
TA Operating free-air temperature [TUSB211] 0 70 °C
Operating free-air temperature [TUSB211I] –40 85

6.4 Thermal Information

THERMAL METRIC (1) RWB UNIT
12 PINS
RθJA Junction-to-ambient thermal resistance 161.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 63.3 °C/W
RθJB Junction-to-board thermal resistance 75.1 °C/W
ψJT Junction-to-top characterization parameter 1.9 °C/W
ψJB Junction-to-board characterization parameter 75.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT
I(ACTIVE_HS) High Speed Active Current USB channel = HS mode. 480 Mbps traffic. VCC supply stable 16 20 mA
I(IDLE_HS) High Speed Idle Current USB channel = HS mode. No traffic. VCC supply stable 12 15 mA
I(SUSPEND_HS) Suspend Current USB channel = Suspend mode. 4.5 5.5 mA
I(FS) Full-Speed Current USB channel = FS mode 4.5 5.5 mA
I(LS) Low-Speed Current USB channel = LS mode 4.5 5.5 mA
I(DISCONN) Disconnect Power Host side application. No device attachment. 4.5 5.5 mA
I(RSTN) Disable Power RSTN driven low; VCC supply stable; VCC = 3.3 V 4.5 5.5 mA
RSTN
VIH High level input voltage 2 VCC V
VIL Low-level input voltage 0 0.8 V
IIH High level input current VIH = 3.6 V, VCC = 3 V, RPU enabled ±2 µA
IIL Low level input current VIL = 0V, VCC = 3.6 V, RPU enabled ±11 µA
EQ
R(EQ) External pulldown resistor Level 0 EQ 0.32 kΩ
Level 1 EQ 1.4 2.2 kΩ
Level 2 EQ [MAX] 3.7 4.1 kΩ
Level 3 EQ [MIN] 6 kΩ
CD, ENA_HS
VOH High level output voltage IO = –50 µA 2.4 V
VOL Low level output voltage IO = 50 µA 0.4 V
DxP, DxM
T(SHRT_GND) DP, DM low voltage short circuit DxP or DxM short circuited to GND continuously for 24 hours
at TA = 25°C only		 0 V
CIO(DXX) Capacitance to GND Measured with LCR meter and device powered down. 1 MHz sinusoid, 30 mVpp ripple 5 pF
(1) (1) All typical values are at VCC = 3.3 V, and TA = 25°C.

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT
DxP, DxM
F(BR_DXX) Bit Rate USB channel = HS mode. 480 Mbps traffic. VCC supply stable 480 Mbps
t(R/F_DXX) Rise/Fall time 100 ps
CD, ENA_HS
t(EN) Enable time 20 µs
t(DIS) Disable time 20 µs
VCC
t(STABLE) VCC stable before RSTN de-assertion 100 µs
t(RAMP) VCC ramp time 0.2 100 ms
(1) (1) All typical values are at VCC = 3.3 V, and TA = 25°C.

7 Detailed Description

7.1 Overview

The TUSB211 is a USB High-Speed (HS) signal conditioner, designed to compensate for ISI signal loss in a transmission channel. TUSB211 has a patent-pending design which is agnostic to USB Low Speed (LS) and Full Speed (FS) signals and does not alter their signal characteristics, while HS signals are compensated. In addition, the design is compatible with USB On-The-Go (OTG) and Battery Charging (BC) specifications.

Programmable signal gain through an external resistor permits fine tuning device performance to optimize signals helping to pass USB HS electrical compliance tests at the connector.

The footprint of TUSB211 allows a board layout using this device such that it does not break the continuity of the DP/DM signal traces. This permits risk free system design of a complete USB channel with flexible use of one or multiple TUSB211 devices as needed for optimal signal integrity. This allows system designers to plan for this device and use it only if signal integrity analysis and/or lab measurements show a need. If such a need is not warranted, the device can be left unpopulated without any board rework.

7.2 Functional Block Diagram

TUSB211 TUSB211I fbd_sllseo0.gif

7.3 Device Functional Modes

7.3.1 Low Speed (LS) Mode

TUSB211 automatically detects a LS connection and does not enable signal compensation. CD pin is asserted high.

7.3.2 Full Speed (FS) Mode

TUSB211 automatically detects a FS connection and does not enable signal compensation. CD pin is asserted high.

7.3.3 High Speed (HS) Mode

TUSB211 automatically detects a HS connection and enables signal compensation as determined by the configuration of the external pulldown resistance on its EQ pin. ENA_HS pin asserted high in addition to the CD pin.

7.3.4 Disable Mode

TUSB211 can be disabled when its RSTN pin is asserted low. The USB channel is still fully operational, but there is neither signal compensation, nor any indication from the CD pin or ENA_HS pin as to the status of the channel.

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

The primary purpose of the TUSB211 is to re-store the signal integrity of a USB High Speed channel up to the USB connector. The loss in signal quality stems from reduced channel bandwidth due to high loss PCB trace and other components that contribute a capacitive load. This can cause the channel to fail the USB near end eye mask. Proper use of the TUSB211 can help to pass this eye mask.

A secondary purpose is to use the CD pin and ENA_HS pin of the TUSB211 to control other blocks on the customer platform if so desired.

8.2 Typical Application

A typical application is shown below. In this setup, D1P and D1M face the USB connector while D2P and D2M face the USB transceiver. If desired, the orientation may be reversed [that is, D1 faces transceiver and D2 faces connector].

Note that CD and ENA_HS are connected to PLDs. This is for platforms where other circuit blocks must be modified based on the status of the USB channel. They could also be connected to LEDs to give a physical indication of current channel status for debug purposes. If neither use is desired, they can be left floating.

TUSB211 TUSB211I typical_application_sllseo0.gif Figure 1. Reference Schematic

8.2.1 Design Requirements

TUSB211 requires a valid reset signal as described in the power supply recommendations section. The capacitor C4 is not required if a microcontroller drives the RSTN pin according to recommendations.

Pin 11 VREG is an internal LDO output that requires a 0.1 μF external capacitor to GND to stabilize the core.

Pin 6 EQ requires an external pulldown resistor if EQ levels 0-2 are needed. If EQ level 3 is needed, then the EQ pin can be left floating.

8.2.2 Detailed Design Procedure

The ideal EQ setting is dependent upon the signal chain loss characteristics of the target platform. The general recommendation is to start with EQ level 0, and then increment to EQ level 1, and so on. if permissible.

In order for the TUSB211 to recognize any change to the EQ setting, the RSTN pin must be toggled. This is because the EQ pin is latched on power up and the pin is ignored thereafter.

In addition, TUSB211 does not compensate for any DC attenuation in the signal path. Therefore, minimizing DC loss (that is, resistance) in the system design, is suggested. As a consequence, this might lead to increased line capacitance. This is acceptable because the TUSB211 can compensate for the additional capacitive load.

Placement of the device is also dependent on the application goal. Table 1 summarizes the recommendations.

Table 1. TUSB211 Platform Placement Guideline

PLATFORM GOAL SUGGESTED TUSB211 PLACEMENT
Pass USB Near End Mask Close to measurement point
Pass USB Far End Eye Mask Close to USB PHY
Cascade multiple 211s to improve device enumeration Midway between each USB interconnect

NOTE

USB-IF certification tests for High Speed eye masks require the mandated use of the USB-IF developed test fixtures. These test fixtures do not require the use of oscilloscope probes. Instead they use SMA cables. More information can be found at the USB-IF Compliance Updates Page. It is located under the ‘Electricals’ section, ID 86 dated March 2013.

The following procedure must be followed before using any oscilloscope compliance software to construct a USB High Speed Eye Mask:

8.2.2.1 For a Host Side Application

  1. Configure the TUSB211 to the desired EQ setting
  2. Power on (or toggle the RSTN pin if already powered on) the TUSB211
  3. Using SMA cables, connect the oscilloscope and the USB-IF host-side test fixture to the TUSB211
  4. Enable the host to transmit USB TEST_PACKET
  5. Execute the oscilloscope’s USB compliance software.
  6. Repeat the above steps in order to re-test TUSB211 with a different EQ setting

8.2.2.2 For a Device Side Application

  1. Configure the TUSB211 to the desired EQ setting
  2. Power on (or toggle the RSTN pin if already powered on) the TUSB211
  3. Connect a USB host, the USB-IF device-side test fixture, and USB device to the TUSB211. Ensure that the USB-IF device test fixture is configured to the ‘INIT’ position
  4. Allow the host to enumerate the device
  5. Enable the device to transmit USB TEST_PACKET
  6. Using SMA cables, connect the oscilloscope to the USB-IF device-side test fixture and ensure that the device-side test fixture is configured to the ‘TEST’ position.
  7. Execute the oscilloscope’s USB compliance software.
  8. Repeat the above steps in order to re-test TUSB211 with a different EQ setting

8.2.3 Application Curves

TUSB211 TUSB211I eye_diagram_bench_sllseo9.gif Figure 2. Eye Diagram Bench Setup
TUSB211 TUSB211I G001_SLLSEO9.gif
Figure 3. TUSB211 Disabled
TUSB211 TUSB211I G003_SLLSEO9.gif
Figure 5. EQ Level 1
TUSB211 TUSB211I G005_SLLSEO9.gif
Figure 7. EQ Level 3
TUSB211 TUSB211I G002_SLLSEO9.gif
Figure 4. EQ Level 0
TUSB211 TUSB211I G004_SLLSEO9.gif
Figure 6. EQ Level 2

9 Power Supply Recommendations

On power up, the interaction of the RSTN pin and power on ramp could result in digital circuits not being set correctly. The device should not be enabled until the power on ramp has settled to 3 V or higher to guarantee a correct power on reset of the digital circuitry. If RSTN cannot be held low by microcontroller or other circuitry until the power on ramp has settled, then an external capacitor from the RSTN pin to GND is required to hold the device in the low power reset state.

The RC time constant should be larger than five times of the power on ramp time (0 to VCC). With a typical internal pullup resistance of 500 kΩ, the recommended minimum external capacitance is calculated as:

Equation 1. [Ramp Time x 5] ÷ [500 kΩ]

10 Layout

10.1 Layout Guidelines

There is no need to break the USB signal trace. Thus, even with the TUSB211 powered down, or not populated, the USB link is still fully operational. To avoid the need for signal vias, routing the High Speed traces directly underneath the TUSB211 package, as illustrated in the PCB land pattern shown in Figure 8, is recommended.

Although the land pattern shown below has matched trace width to pad width, optimal impedance control is based on the user's own PCB stack-up. It is recommended to maintain 90 Ω differential routing underneath the device.

All dimensions are in millimetres (mm).

10.2 Layout Example

TUSB211 TUSB211I layout_sllseo9.gif Figure 8. DP and DM Routing Underneath Device Package

 
Texas Instruments

© Copyright 1995-2025 Texas Instruments Incorporated. All rights reserved.
Submit documentation feedback | IMPORTANT NOTICE | Trademarks | Privacy policy | Cookie policy | Terms of use | Terms of sale