Data Sheet
FDC1004-Q1 适用于电容式感应应用的 4 通道电容数字转换器
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1 特性
- 符合汽车应用要求
- 具有符合 AEC-Q100 标准的下列特性
- 器件温度等级 1：–40°C 至 125°C 环境工作温度范围
- 器件 HBM ESD 分类等级 2
- 器件 CDM ESD 分类等级 C5
- 输入范围：±15pF
- 测量分辨率：0.5fF
- 最大偏移电容：100pF
- 可编程输出速率：100/200/400S/s
- 最大屏蔽负载：400pF
- 电源电压：3.3V
- 温度范围：–40° 至 125°C
- 电流消耗：
- 有效：750µA
- 待机：29µA
- 接口：I2C
- 通道数量：4
2 应用
- 接近传感器
- 手势识别
- 汽车车门/脚踢传感器
- 汽车雨滴传感器
- 远程和直接液位传感器
- 高分辨率金属分析
- 雨/雾/冰/雪传感器
- 材料尺寸检测
3 说明
采用接地电容传感器的电容式感应是一种具有超低功耗、低成本和高分辨率的非接触式感应技术，适用于接近感应、手势识别、材料分析和远程液位感应等各类应用。电容式感应系统中的传感器可以采用任意金属或导体，因此可实现高度灵活的低成本系统设计。
FDC1004-Q1 是一款面向电容式传感解决方案的高分辨率 4 通道电容数字转换器，并且符合 AEC-Q100 标准。每个通道的满量程范围均为 ±15pF，可处理高达 100pF 的传感器偏移电容，该偏移电容既可以在内部编程，也可以是一个外部电容，用于跟踪环境随时间和温度的变化。凭借高偏移电容，可以使用远程传感器。
此外，FDC1004-Q1 还包含用于实现传感器屏蔽的屏蔽驱动器，不但可降低电磁干扰 (EMI)，而且有助于聚焦电容传感器的感应方向。FDC1004-Q1 外形小巧，非常适合空间受限类应用。FDC1004-Q1 采用 10 引脚 VSSOP 封装，支持在量产过程中进行光学检测，并且具有一个用于连接 MCU 的 I2C 接口。
(1) 有关所有可用封装，请参阅节 10
(2) 封装尺寸（长 × 宽）为标称值，并包括引脚（如适用）。
典型应用4 Pin Configuration and Functions
Figure 4-1 DGS Package10 Pin VSSOPTop ViewTable 4-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| SHLD1 | 1 | A | Capacitive Input Active AC Shielding. |
| CIN1 | 2 | A | Capacitive Input. The measured capacitance is connected between the CIN1 pin and GND. If not used, leave this pin as an open circuit. |
| CIN2 | 3 | A | Capacitive Input. The measured capacitance is connected between the CIN2 pin and GND. If not used, leave this pin as an open circuit. |
| CIN3 | 4 | A | Capacitive Input. The measured capacitance is connected between the CIN3 pin and GND. If not used, leave this pin as an open circuit. |
| CIN4 | 5 | A | Capacitive Input. The measured capacitance is connected between the CIN4 pin and GND. If not used, leave this pin as an open circuit. |
| SHLD2 | 6 | A | Capacitive Input Active AC Shielding. |
| GND | 7 | G | Ground |
| VDD | 8 | P | Power Supply Voltage. Decouple this pin to GND, using a low impedance capacitor, for example in combination with a 1μF tantalum and a 0.1μF multilayer ceramic. |
| SCL | 9 | I | Serial Interface Clock Input. Connects to the controller clock line. Requires pullup resistor if not already provided elsewhere in the system. |
| SDA | 10 | I/O | Serial Interface Bidirectional Data. Connects to the controller data line. Requires a pullup resistor if not provided elsewhere in the system. |
(1) P=Power, G=Ground, I=Input, O=Output, A=Analog,
I/O=Bidirectional Input/Output
5 Specifications
5.1 Absolute Maximum Ratings
See (1)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Input voltage | VDD | –0.3 | 6 | V |
| SCL, SDA | –0.3 | 6 | V | |
| at any other pin | –0.3 | VDD+0.3 | V | |
| Input current | at any pin | 3 | mA | |
| Junction temperature(2) | 150 | °C | ||
| Storage Temperature | TSTG | -65 | 150 | °C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum power dissipation is a function of TJ(MAX), RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board.
5.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | ±2000 | V |
| Charged-device model (CDM), per AEC Q100-011 | ±750 | |||
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
5.3 Recommended Operating Conditions
Over operating temperature range (unless otherwise noted)
| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| Supply voltage (VDD-GND) | 3 | 3.3 | 3.6 | V | |
| Temperature | –40 | 125 | °C | ||
5.4 Thermal Information
| THERMAL METRIC(1) | FDC1004-Q1 | UNIT | |
|---|---|---|---|
| VSSOP (DGS) | |||
| 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 46.8 | °C/W |
| RθJC | Junction-to-case(top) thermal resistance | 48.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 70.6 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
note.
5.5 Electrical Characteristics
Over recommended operating temperature range, VDD = 3.3V, for TA = 25°C
(unless otherwise noted). (1)
| PARAMETER | TEST CONDITION | MIN(2) | TYP(3) | MAX(2) | UNIT | |
|---|---|---|---|---|---|---|
| POWER SUPPLY | ||||||
| IDD | Supply current | Conversion mode; Digital input to VDD or GND | 750 | 950 | µA | |
| Standby; Digital input to VDD or GND | 29 | 70 | µA | |||
| CAPACITIVE INPUT | ||||||
| ICR | Input conversion range | ±15 | pF | |||
| COMAX | Max input offset capacitance | per channel, Series resistance at CINn n=1.4 = 0 Ω | 100 | pF | ||
| RES | Effective resolution (5) | Sample rate = 100S/s (4) | 16 | bit | ||
| EON | Output noise | Sample rate = 100S/s (4) | 33.2 | aF/√Hz | ||
| ERR | Absolute error | after offset calibration | ±6 | fF | ||
| TcCOFF | Offset deviation over temperature | -40°C < T < 125°C | 46 | fF | ||
| GERR | Gain error | 0.2% | ||||
| tcG | Gain drift vs temperature | -40°C < T < 125°C | -37.5 | ppm/°C | ||
| PSRR | DC power supply rejection | 3V < VDD < 3.6V, single-ended mode (channel vs GND) | 13.6 | fF/V | ||
| CAPDAC | ||||||
| FRCAPDAC | Full-scale range | 96.9 | pF | |||
| TcCOFFCAPDAC | Offset drift vs temperature | -40°C < T < 125°C | 30 | fF | ||
| EXCITATION | ||||||
| ƒ | Frequency | 25 | kHz | |||
| VAC | AC voltage across capacitance | 2.4 | Vpp | |||
| VDC | Average DC voltage across capacitance | 1.2 | V | |||
| SHIELD | ||||||
| DRV | Driver capability | ƒ = 25kHz, SHLDn to GND, n = 1,2 | 400 | pF | ||
(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ=TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ>TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device can be permanently degraded, either mechanically or electrically.
(2) Limits are ensured by testing, design, or statistical analysis at 25Degree C. Limits over the operating temperature range are ensured through correlations using statistical quality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time
of characterization. Actual typical values can vary over time and also depend on
the application and configuration. The typical values are not tested and are not
guaranteed on shipped production material.
(4) No external capacitance connected.
(5) Effective resolution is the ratio of converter full scale range to RMS measurement noise.
