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  • HD3SS460 4 x 6 通道 USB Type-C交替模式 MUX

    • ZHCSDI9D January   2015  – January 2017 HD3SS460

      PRODUCTION DATA.  

  • CONTENTS
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  • HD3SS460 4 x 6 通道 USB Type-C交替模式 MUX
  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 High Speed Port Performance Parameters
    7. 7.7 High Speed Signal Path Switching Characteristics
    8. 7.8 Timing Diagrams
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 High Speed Differential Signal Switching
      2. 8.3.2 Low Speed SBU Signal Switching
      3. 8.3.3 Output Enable and Power Savings
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device High Speed Switch Control Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 USB SS and DP as Alternate Mode
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Critical Routing
      2. 11.1.2 General Routing/Placement Rules
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息
  14. 重要声明
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DATA SHEET

HD3SS460 4 x 6 通道 USB Type-C交替模式 MUX

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

1 特性

  • 提供面向 USB Type-CTM 生态系统的 MUX 解决方案，其中包括交替模式 (AM)
  • 提供多种通道选择选项，其中包括 USBSS、双通道 AM 和四通道 AM
  • 与 5 Gbps USB3.1 第 1 代和包含 5.4 Gbps DisplayPort 1.2a 的 AM 兼容
  • 与源设备/主机和接收设备/设备应用 兼容
  • 针对低速 SBU 引脚提供交叉点 MUX
  • 双向“复用/解复用”差动开关
  • 支持 0V 至 2V 共模电压
  • 功耗较低，关断电流和工作电流分别为 1μA 和 0.6mA
  • 单电源电压 VCC：3.3V±10%
  • 工业温度范围：–40°C 至 85°C

2 应用

  • 可换向 USB Type-CTM 生态系统
  • 平板电脑、笔记本电脑、监视器、电话
  • USB 主机和设备
  • 扩展坞

3 说明

HD3SS460 是一款高速双向无源开关，可采用复用或解复用两种配置。该器件可通过负载点 (POL) 控制引脚进行切换，从而适应连接器换向。该器件还可通过 AMSEL 控制引脚来实现双通道数据/双通道视频与所有四通道视频的复用。

该器件还针对低速引脚提供了交叉点 MUX，可满足可换向连接器实现的需求。

HD3SS460 是一款通用模拟差分无源开关，适用于所有高速接口 应用， 前提条件是该应用在 0V 至 2V 共模电压范围内发生偏置并且具有幅值高达 1800 mVpp 的差分信令。该器件采用自适应跟踪，可确保信道在整个共模电压范围内保持不变。

该器件具有出色的动态特性，可在信号眼图衰减最小的情况下实现高速转换，并且附加抖动极少。该器件在工作模式下的功耗 < 2mW，关断模式下的功耗 < 5µW（可通过 EN 引脚切换模式）。

器件信息(1)

器件型号 封装 封装尺寸（标称值）
HD3SS460 QFN (RHR) (28) 3.50mm x 5.50mm
HD3SS460I
HD3SS460 QFN (RNH) (30) 2.50mm x 4.50mm
HD3SS460I
  1. 要了解所有可用封装，请见数据表末尾的可订购产品附录。

sp

简化电路原理图

HD3SS460 FP_schem_SLLSEM7.gif

应用

HD3SS460 FP_application_SLLSEM7.gif

4 修订历史记录

Changes from C Revision (December 2016) to D Revision

  • Deleted R187 from Figure 16 Go
  • Deleted R187 from Figure 19.Go

Changes from B Revision (June 2016) to C Revision

  • 已将 QFN (RNH) (30) 添加至器件信息表Go
  • Added the RNH package option to the Device Comparison Table tableGo
  • Added the RNH package option to the Pin Configuration and Functions sectionGo
  • Changed the Description of pins LnBn, p, LnCn, p, LnDn, p, SSTXn, p, and SSRXn, p From: positive, negative To: negative, positive in the Pin Functions tableGo
  • Changed the Supply voltage MIN value From: 3.0 V To: 2.7 V in the Recommended Operating Conditions tableGo
  • Added the RNH package option to the Thermal Information table Go
  • Changed VIH to include a separate line entry for POL pin in the Electrical Characteristics tableGo

Changes from A Revision (March 2015) to B Revision

  • Changed text and Figure 3, Figure 4 in the USB SS and DP as Alternate Mode section for clarity. Go
  • Added Figure 5Go
  • Added Figure 6Go
  • Deleted Table Pin Assignments for DP Source Pins and DP Sink Pins in the Detailed Design Procedure sectionGo
  • Added Table 2, Table 3, Table 4, and Table 5 Go
  • Added Figure 8 through Figure 13 Go
  • Changed image for Figure 16 Go
  • Changed image for Figure 19.Go

Changes from * Revision (January 2015) to A Revision

  • Added full data sheet specification complement Go

5 Device Comparison Table(1)

OPERATING TEMPERATURE (°C) PART NUMBER PINS TOP-SIDE MARKING
0 to 70 HD3SS460RHR 28 3SS460
–40 to 85 HD3SS460IRHR 28 3SS460I
0 to 70 HD3SS460RNH 30 460RNH
–40 to 85 HD3SS460IRNH 30 460IRNH
(1) For all available packages, see the orderable addendum at the end of the data sheet. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging

6 Pin Configuration and Functions

RHR Package With Thermal Pad
(28-Pin WQFN)
Top View
HD3SS460 RHR_pinout_SLLSEM7.gif
RNH Package With Thermal Pad
(30-Pin WQFN)
Top View
HD3SS460 RNH_pinout_SLLSEM7.gif

Pin Functions

PIN TYPE(1) DESCRIPTION
NAME RHR
NO.		 RNH
NO.
VCC 22 23 P Power
GND PAD 13, 28, PAD G Ground
POL 3 3 Input Provides MUX control (Table 1)
AMSEL 8 8 3-Level Input Provides MUX configurations (Table 1)
EN 17 18 3-Level Input Enable signal; also provides MUX control (Table 1)
CRX1p, n 1, 2 1, 2 I/O High Speed Signal Port CRX1 positive, negative
CTX1p, n 4, 5 4, 5 I/O High Speed Signal Port CTX1 positive, negative
CTX2p, n 6, 7 6, 7 I/O High Speed Signal Port CTX2 positive, negative
CRX2p, n 9, 10 9, 10 I/O High Speed Signal Port CRX2 positive, negative
LnAn, p 15, 16 16, 17 I/O High Speed Signal Port LnA positive, negative
LnBn, p 18, 19 19, 20 I/O High Speed Signal Port LnB negative, positive
LnCn, p 20, 21 21, 22 I/O High Speed Signal Port LnC negative, positive
LnDn, p 23, 24 24, 25 I/O High Speed Signal Port LnD negative, positive
SSTXn, p 25, 26 26, 27 I/O High Speed Signal Port SSTX negative, positive
SSRXn, p 27, 28 29, 30 I/O High Speed Signal Port SSRX negative, positive
CSBU1, 2 11, 12 11, 12 I/O Low Speed Signal Port CSBU 1, 2
SBU1, 2 13, 14 14, 15 I/O Low Speed Signal Port SBU 1, 2
(1) High speed data ports (CRX[1/2][p/n], Ln[A-D][p,n], and SS[T/R]X[p/n]) incorporate 20kΩ pull down resistors that are switched in when a port is not selected and switched out when the port is selected.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply Voltage, VCC –0.5 4 V
Differential High Speed I/O Voltages, C[R/T]X[1/2][p/n], Ln[A-D][p/n], SS[R/T]X[p/n] –0.5 2.5 V
Low Speed I/O Voltages, CSBU[1/2], SBU[1/2] –0.5 4 V
Control signal voltages, POL, AMSEL, EN –0.5 4 V
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage 2.7 3.3 3.6 V
TA Operating free air temperature HD3SS460 0 25 70 °C
HD3SS460I –40 25 85
VCM High speed port common mode voltage 0 2 V
VIN Low Speed signal voltage 0 VCC
Vdiff High speed port differential voltage 0 1.8 Vpp

7.4 Thermal Information

THERMAL METRIC(1) HD3SS460 UNIT
QFN (RNH) QFN (RHR)
30 PINS 28 PINS
RθJA Junction-to-ambient thermal resistance 51.6 44.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 37.5 34.8 °C/W
RθJB Junction-to-board thermal resistance 17.5 14.7 °C/W
ψJT Junction-to-top characterization parameter 0.7 0.7 °C/W
ψJB Junction-to-board characterization parameter 17.3 24.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.8 6.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.5 Electrical Characteristics

typical values for all parameters are at VDD = 3.3 V and TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIL Input low voltage, control pins POL, AMSEL, EN –0.1 0.4 V
VIH Input high voltage, control pins AMSEL, EN VCC –0.4 VCC +0.1
Input high voltage, control pins POL 1.7 VCC +0.1
VIM Input mid-level voltage, control pins AMSEL, EN VCC/2 –0.3 VCC/2 VCC/2 +0.3
ILK-DIFF-ACTIVE Leakage current on active differential IO pins, VCC = 3.6 V, pin at 0 or 2.4 V. 1 µA
ILK-DIFF-INACTIVE Leakage current on inactive differential IO pins, VCC = 3.6V, pin at 2.4 V. 150
IIH Input high current, control pins POL, AMSEL, EN and signal pins CSBU1/2, SBU1/2 1
IIL Input low current, control pins POL, AMSEL, EN and signal pins CSBU1/2, SBU1/2 1
IIM Input mid-level current, control pins AMSEL, EN 1
IOFF Device shutdown current 1 5
IDD Device active current, EN=H or M 0.6 0.9 mA
RON(HS) Switch ON resistance for high speed differential signals VCC = 3.3 V, VCM = 0-2 V,
IO = - 8 mA		 8 14 Ω
RON(LS) Switch ON resistance for low speed signals VCC = 3.3 V, VCM = 0-2 V,
IO = - 8 mA		 12
RFLAT(ON,HS) High speed differential signals’ ON resistance flatness for a channel (RON(MAX) – RON(MIN)) over VCM range VCC = 3.3 V, VCM = 0-2 V,
IO = - 8 mA		 1.5
CON(HS) High speed differential signals’ input capacitance 1 pF

7.6 High Speed Port Performance Parameters

under recommended operating conditions; RLOAD, RSC = 50 Ω (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
RL Differential return loss 100 Mhz SS Paths –23 dB
2.5 Ghz SS Paths –9
100 MHz AM Paths –23
2. 7GHz AM Paths –13
IL Differential insertion loss 100 Mhz SS Paths –0.7
2.5 Ghz SS Paths –1.6
100 MHz AM Paths –0.7
2.7 GHz AM Paths –1.4
OI Differential off isolation 100 Mhz –50
2.5 Ghz –26
2.7 GHz –25
Xtalk Differential cross talk, Between CRX1/2 and CTX1/2 100 Mhz –80
2.5 Ghz –30
2.7 Ghz –28
Differential cross talk, Between CRX1 and CRX2 or CTX1 and CTX2 100 Mhz –50
2.5 Ghz –26
2.7 Ghz –25
BWSS Differential –3 dB BW SS Paths 4.2 GHz
BWAM Differential –3 dB BW AM Paths 5.4
BWSBU Low-speed switch –3 dB BW 500 MHz

7.7 High Speed Signal Path Switching Characteristics

PARAMETER TEST CONDITION MIN TYP MAX UNIT
tPD Switch propagation delay RSC and RLOAD = 50 Ω, Figure 2 100 ps
tSK(O) Inter-Pair output skew (CH-CH) 50
tSK(b-b) Intra-Pair output skew (bit-bit) 5
tON Control signals POL, AMSEL and EN (H/M toggle) to switch ON time RSC and RLOAD = 50 Ω, Figure 1 3 µs
tOFF Control signals POL, AMSEL and EN (H/M toggle) to switch OFF time 1

7.8 Timing Diagrams

HD3SS460 Switch_on-off_time_SLLSEM7.gif Figure 1. Switch ON/OFF Time
HD3SS460 Prop_delay_skew1_SLLSEM7.gif Figure 2. Propagation Delay and Skew

 
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