DRV1098312V 至 24V 三相无传感器 BLDC 电机驱动器
- ZHCSDA7G July 2014 – February 2018 DRV10983
  
  PRODUCTION DATA.

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DATA SHEET

DRV1098312V 至 24V 三相无传感器 BLDC 电机驱动器

本资源的原文使用英文撰写。为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

1 特性

输入电压范围：8 至 28V
总驱动器 H + L r_DS(on)：250mΩ
驱动电流：2A 持续绕组电流（峰值 3A）
无传感器专有反电动势 (BEMF) 控制方案
连续正弦 180° 换向
无需外部感测电阻
用户可通过添加外部感应电阻以灵活监视为电机提供的功率
灵活的用户接口选项：
- I²C 接口：访问命令和反馈寄存器
- 专用的 SPEED 引脚：接受模拟或 PWM 输入
- 专用的 FG 引脚：提供 TACH 反馈
- 可通过 EEPROM 定制旋转曲线
- 使用 DIR 引脚进行正向/反向控制
集成了降压稳压器，可高效地为内部和外部电路提供电压 (5V 或 3.3V)
电源电流为 3mA 待机型号 (DRV10983)
电源电流为 180 μA 睡眠型号 (DRV10983Z)
过流保护
锁定检测
电压浪涌保护
欠压闭锁 (UVLO) 保护
热关断保护
耐热增强型 24 引脚散热薄型小外形尺寸 (HTSSOP)

2 应用

设备风扇
制热、通风与空调控制 (HVAC)

3 说明

DRV10983 器件是一款具有集成功率 MOSFET 的三相无传感器电机驱动器，可提供高达 2A 的持续驱动电流。该器件专为成本敏感型、低噪声、低外部组件数量应用而设计低功耗是一个关键问题。

DRV10983 器件采用专有无传感器控制方案来提供持续正弦驱动，可大幅降低换向过程中通常会产生的纯音。该器件的接口设计简单而灵活。可直接通过 PWM、模拟、或 I²C 输入控制电机。可通过 FG 引脚或 I²C 提供电机速度反馈。

DRV10983器件安全功能包括一个集成降压稳压器，可高效地将电源电压降至 5V 或 3.3V，从而为内外部电路供电。该器件提供睡眠模式和待机模式两种型号，可在电机停止运转时实现节能。待机模式 (3mA) 型号会使稳压器保持运行，而休眠模式 (180μA) 型号会使稳压器停止工作。在使用稳压器为外部微控制器供电的应用中使用待机模式型号。

器件信息⁽¹⁾

器件型号	封装	封装尺寸（标称值）
DRV10983	散热薄型小外形尺寸封装 (HTSSOP) (24)	7.80mm × 6.40mm
DRV10983Z	散热薄型小外形尺寸封装 (HTSSOP) (24)	7.80mm × 6.40mm

要了解所有可用封装，请参阅数据表末尾的可订购产品附录。

Device Images

应用电路原理图

DRV10983 DRV10983Z typ-app-83_SLVSCP6.gif

4 修订历史记录

Changes from F Revision (December 2017) to G Revision

Added timing information for entering and exiting sleep mode and standby modeGo
Added BEMF COMPARATOR hysteresis specificationGo
Updated Start the Motor Under Different Initial Conditions figureGo
Changed the default value for register address 0x27 from 0xFC to 0xF4 in the Default EEPROM Value tableGo
Deleted the "TI recommends..." sentence from the description for address 0x27, bit 3Go
Added constraints to recommended external inductorGo

Changes from E Revision (May 2017) to F Revision

Added the internal SPEED pin pulldown resistance to ground parameter to the Electrical Characteristics tableGo
Changed the Step-Down Regulator sectionGo
Updated the Motor Phase Resistance sectionGo
Deleted the Inductive AVS Function sectionGo
Changed the default value for register address 0x29 from 0xB7 to 0xB9 in the Default EEPROM Value tableGo
Added application information for the sleep mode device Go

Changes from D Revision (May 2017) to E Revision

Changed pin numbering in the Pin Functions table Go

Changes from C Revision (May 2016) to D Revision

在数据表标题和器件信息表中添加了 DRV10983Z 器件型号Go
Added DRV10983Z part numberGo
Corrected the link to the DRV10983 and DRV10975 Tuning GuideGo
Added text to the PWM Output sectionGo
Changed Figure 37Go
Changed "FGOLSet[1:0]" to "FGOLsel[1:0]" in Register Map address 0x2BGo
Added recommended minimum dead time to SysOpt7 registerGo
Added External Components table Go
Changed the link to the DRV10983 and DRV10975 Tuning GuideGo
Changed the layout exampleGo

Changes from B Revision (February 2015) to C Revision

Added "phase to phase" clarification for overcurrent protectionGo
Added more accurate description to clarify overcurrent protection operationGo

Changes from A Revision (October 2014) to B Revision

更新了数据表以包含 DRV10983Z 睡眠型号Go

Changes from * Revision (July 2014) to A Revision

更新了输入电压范围：8V 至 28VGo
删除了 DRV10983Z 睡眠型号部分并更新了待机模式电源电流Go
Updated pin information for SW, SWGND, VREG, SDA, FG, and VCC pinsGo
Added DIR, SW, and VREG pins to Absolute Maximum RatingsGo
Updated max supply voltage and voltage range ratings for VCC and U, V, W in Recommended Operating ConditionsGo
changed Functional Block DiagramGo
Changed "hardware current limit" to "lock detection current limit" and "software current" to "acceleration current limit" throughout data sheetGo
Updated max value for open to closed loop threshold Go
Corrected description to "velocity constant of the motor" for Equation 2Go
Corrected register name in Start-Up Current SettingGo
Updated Equation 3Go
Updated Figure 20Go
Updated caption name for Figure 24Go
Corrected max speed command setting for SpdCtrl[8:0] Go
Updated register description for status register. Go
Updated the data in the examples for MotorSpeed1 and MotorPeriod1 Go
Updated IPDPosition description in Register MapGo
Increased max motor voltage for Recommended Application Range Go
Updated graph callout for Figure 41Go

5 说明（续）

用户可通过 I²C 接口对寄存器中的特定电机参数进行重新编程并可对 EEPROM 进行编程，以帮助优化既定应用的性能。DRV10983 器件采用带有外露散热焊盘的高效散热型 HTSSOP 24 引脚封装。额定工作温度为 –40°C 至 125°C。

6 Pin Configuration and Functions

PWP PowerPAD™ Package

24-Pin HTSSOP

Top View

Pin Functions

PIN		TYPE⁽¹⁾	DESCRIPTION
NAME	NO.	TYPE⁽¹⁾	DESCRIPTION
VCP	1	P	Charge pump output.
CPN	3	P	Charge pump pin 1, use a ceramic capacitor between CPN and CPP.
CPP	2	P	Charge pump pin 2, use a ceramic capacitor between CPN and CPP.
DIR	14	I	Direction
FG	12	O	FG signal output.
GND	8	—	Digital and analog ground
PGND	15, 16	—	Power ground
SCL	10	I	I²C clock signal
SDA	11	I/O	I²C data signal
SPEED	13	I	Speed control signal for PWM or analog input speed command
SW	4	O	Step-down regulator switching node output
SWGND	5	P	Step-down regulator ground
U	17, 18	O	Motor U phase
V	19, 20	O	Motor V phase
V1P8	7	P	Internal 1.8-V digital core voltage. V1P8 capacitor must connect to GND. This is an output, but not specified to drive external loads.
V3P3	9	P	Internal 3.3-V supply voltage. V3P3 capacitor must connect to GND. This is an output and may drive external loads not to exceed I_{V3P3_MAX}.
V_CC	23, 24	P	Device power supply
VREG	6	P	Step-down regulator output and feedback point
W	21, 22	O	Motor W phase
thermal pad (GND)	—	—	The exposed thermal pad must be electrically connected to ground plane through soldering to PCB for proper operation and connected to bottom side of PCB through vias for better thermal spreading.

(1) I = input, O = output, I/O = input/output, P = power

7 Specifications

7.1 Absolute Maximum Ratings

over operating ambient temperature (unless otherwise noted)⁽¹⁾

		MIN	MAX	UNIT
Input voltage⁽²⁾	VCC	–0.3	30	V
	SPEED	–0.3	4
	GND	–0.3	0.3
	SCL, SDA	–0.3	4
	DIR	–0.3	4
Output voltage⁽²⁾	U, V, W	–1	30	V
	SW	–1	30
	VREG	–0.3	7
	FG	–0.3	4
	VCP	–0.3	V_(VCC) + 6
	CPN	–0.3	30
	CPP	–0.3	V_(VCC) + 6
	V3P3	–0.3	4
	V1P8	–0.3	2.5
Maximum junction temperature, T_{J_MAX}		–40	150	°C
Storage temperature, T_stg		–55	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to the network ground terminal unless otherwise noted.

7.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾	±2500	V
V_(ESD)	Electrostatic discharge	Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾	±1500	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

		MIN	NOM	MAX	UNIT
Supply voltage	VCC	8	24	28	V
Voltage	U, V, W	–0.7		29	V
	SCL, SDA, FG, SPEED, DIR	–0.1	3.3	3.6
	PGND, GND	–0.1		0.1
Current	Step-down regulator output current (buck mode)			100	mA
	Step-down regulator output current (linear mode)			0
	V3P3 LDO output current			5
Operating junction temperature, T_J		–40		125	°C

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		DRV10983, DRV10983Z	UNIT
		PWP (HTSSOP)
		24 PINS
R_θJA	Junction-to-ambient thermal resistance	36.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	17.4	°C/W
R_θJB	Junction-to-board thermal resistance	14.8	°C/W
ψ_JT	Junction-to-top characterization parameter	0.4	°C/W
ψ_JB	Junction-to-board characterization parameter	14.5	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	1.1	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.5 Electrical Characteristics

over operating ambient temperature range (unless otherwise noted)

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
SUPPLY CURRENT (DRV10983)
I_Vcc	Supply current	T_A = 25°C; sleepDis = 1; SPEED = 0 V; V_(VCC) = 24 V; buck regulator		3.5	5	mA
I_Vcc	Supply current	T_A = 25°C; sleepDis = 1; SPEED = 0 V; V_(VCC) = 24 V; linear regulator		11		mA
I_VccSTBY	Standby current	T_A = 25°C; SPEED = 0 V; V_(VCC) = 24 V; standby mode device; buck regulator		3	4	mA
I_VccSTBY	Standby current	T_A = 25°C; SPEED = 0 V; V_(VCC) = 24 V; standby mode device; linear regulator		9		mA
SUPPLY CURRENT (DRV10983Z)
I_Vcc	Supply current	T_A = 25°C; sleepDis = 1; SPEED = 0 V; V_(VCC) = 24 V; buck regulator		3.5	5	mA
I_Vcc	Supply current	T_A = 25°C; sleepDis = 1; SPEED = 0 V; V_(VCC) = 24 V; linear regulator		11		mA
I_VccSLEEP	Sleep current	T_A = 25°C; SPEED = 0 V; V_(VCC) = 24 V; sleep mode device; buck regulator		160	200	µA
UVLO
V_{UVLO_R}	UVLO threshold voltage	Rise threshold, T_A = 25°C	7	7.4	8	V
V_{UVLO_F}	UVLO threshold voltage	Fall threshold, T_A = 25°C	6.7	7.1	7.5	V
V_{UVLO_HYS}	UVLO threshold voltage hysteresis	T_A = 25°C	200	300	400	mV
LDO OUTPUT
V3P3		V_(VCC) = 24 V, T_A = 25°C, VregSel = 0, 5-mA load	3	3.3	3.6	V
		V_(VCC) = 24 V, T_A = 25°C, VregSel = 1, V_(VREG)< 3.3 V, 5-mA load	V_(VREG) – 0.3	V_(VREG) – 0.1	V_(VREG)
		V_(VCC) = 24 V, T_A = 25°C, VregSel = 1, V_(VREG) ≥ 3.3 V, 5-mA load	3	3.3	3.6
I_{V3P3_MAX}	Maximum load from V3P3	V_(VCC) = 24 V, T_A = 25°C		5		mA
V1P8		V_(VCC) = 24 V, T_A = 25°C, VregSel = 0	1.6	1.78	2	V
V1P8		V_(VCC) = 24 V, T_A = 25°C, VregSel = 1	1.6	1.78	2	V
STEP-DOWN REGULATOR
V_REG	Regulator output voltage	T_A = 25˚C; VregSel = 0, L_SW = 47 µH, C_SW = 10 µF, I_load = 50 mA	4.5	5	5.5	V
V_REG	Regulator output voltage	T_A = 25˚C; VregSel = 1, L_SW = 47 µH, C_SW = 10 µF, I_load = 50 mA	3.06	3.4	3.6	V
V_{REG_L}	Regulator output voltage (linear mode)	T_A = 25°C, VregSel = 0, R_SW = 39 Ω, C_SW = 10 µF		5		V
V_{REG_L}	Regulator output voltage (linear mode)	T_A = 25°C, VregSel = 1, R_SW = 39 Ω, C_SW = 10 µF		3.4		V
I_{REG_MAX}	Maximum load from V_REG	T_A = 25°C, L_SW = 47 µH, C_SW = 10 µF		100		mA
INTEGRATED MOSFET
r_DS(on)	Series resistance (H + L)	T_A = 25˚C; V_(VCC) = 24 V; V_(VCP) = 29 V; Iout = 1 A		0.25	0.4	Ω
r_DS(on)	Series resistance (H + L)	T_A = 85˚C; V_(VCC) = 24 V; V_(VCP) = 29 V; Iout = 1 A		0.325		Ω
SPEED – ANALOG MODE
V_{AN/A_FS}	Analog full speed voltage			V_(V3P3) × 0.9		V
V_{AN/A_ZS}	Analog zero speed voltage			100		mV
t_SAM	Analog speed sample period			320		µs
V_{AN/A_RES}	Analog voltage resolution			5.8		mV
SPEED – PWM DIGITAL MODE
V_{DIG_IH}	PWM input high voltage		2.2			V
V_{DIG_IL}	PWM input low voltage				0.6	V
ƒ_PWM	PWM input frequency		1		100	kHz

STANDBY MODE (DRV10983)
V_{EN_SB}	Analog voltage-to-enter standby mode	SpdCtrlMd = 0 (analog mode)	30			mV
V_{EX_SB}	Analog voltage-to-exit standby	SpdCtrlMd = 0 (analog mode)		120		mV
t_{EX_SB_ANA}	Time-to-exit from standby mode	SpdCtrlMd = 0 (analog mode) SPEED > V_{EX_SB}		700		ms
t_{EX_SB_DR_ANA}	Time taken to drive motor after exiting from standby mode	SpdCtrlMd = 0 (analog mode) SPEED > V_{EX_SL}; ISDen = 0; BrkDoneThr[2:0] = 0		1		µs
t_{EX_SB_PWM}	Time-to-exit from standby mode	SpdCtrlMd = 1 (PWM mode) SPEED > V_{DIG_IH}		1		µs
t_{EX_SB_DR_PWM}	Time taken to drive motor after exiting from standby mode	SpdCtrlMd = 1 (PWM mode) SPEED > V_{DIG_IH; ISDen = 0; BrkDoneThr[2:0] = 0}		55		ms
t_{EN_SB_ANA}	Time-to-enter sleep mode	SpdCtrlMd = 0 (analog mode) SPEED < V_{EN_SL}; AvSIndEn = 0		5		ms
t_{EN_SB_PWM}	Time-to-enter sleep mode	SpdCtrlMd = 1 (PMW mode) SPEED < V_{DIG_IL}; AvSIndEn = 0		60		ms
SLEEP MODE (DRV10983Z)
V_{EN_SL}	Analog voltage-to-enter sleep	SpdCtrlMd = 0 (analog mode)	30			mV
V_{EX_SL}	Analog voltage-to-exit sleep	SpdCtrlMd = 0 (analog mode)	2.2	3.3		V
t_{EX_SL_ANA}	Time-to-exit from sleep mode	SpdCtrlMd = 0 (analog mode) SPEED > V_{EX_SL}		1		µs
t_{EX_SL_DR_ANA}	Time taken to drive motor after exiting from sleep mode	SpdCtrlMd = 0 (analog mode) SPEED > V_{EX_SL}; ISDen = 0; BrkDoneThr[2:0] = 0		350		µs
t_{EX_SL_PWM}	Time-to-exit from sleep mode	SpdCtrlMd = 1 (PWM mode) SPEED > V_{DIG_IH}		1		µs
t_{EX_SL_DR_PWM}	Time taken to drive motor after exiting from sleep mode	SpdCtrlMd = 1 (PWM mode) SPEED > V_{DIG_IH; ISDen = 0; BrkDoneThr[2:0] = 0}		350		ms
t_{EN_SL_ANA}	Time-to-enter sleep mode	SpdCtrlMd = 0 (analog mode) SPEED < V_{EN_SL}; AvSIndEn = 0		5.2		ms
t_{EN_SL_PWM}	Time-to-enter sleep mode	SpdCtrlMd = 1 (PMW mode) SPEED < V_{DIG_IL}; AvSIndEn = 0		58		ms
R_{PD_SPEED_SL}	Internal SPEED pin pulldown resistance to ground	V_SPEED = 0 (sleep mode)	55			kΩ
DIGITAL I/O (DIR INPUT AND FG OUTPUT)
V_{DIR_H}	Input high		2.2			V
V_{DIR_L}	Input low				0.6	V
I_{FG_SINK}	Output sink current	Vout = 0.3 V	5			mA
I²C SERIAL INTERFACE
V_{I2C_H}	Input high		2.2			V
V_{I2C_L}	Input low				0.6	V
LOCK DETECTION RELEASE TIME
t_{LOCK_OFF}	Lock release time			5		s
t_{LCK_ETR}	Lock enter time			0.3		s
OVERCURRENT PROTECTION
I_{OC_limit}	Overcurrent protection	T_A = 25˚C; phase to phase	3	4		A
THERMAL SHUTDOWN
T_SDN	Shutdown temperature threshold	Shutdown temperature		150		°C
T_{SDN_HYS}	Shutdown temperature threshold	Hysteresis		10		°C
BEMF COMPARATOR
BEMF_HYS	BEMF comparator hysteresis	bemfHsyEn = 1		50		mV

7.6 Typical Characteristics

Figure 1. Supply Current vs Power Supply

Figure 3. Step-down Regulator Output vs Power Supply
(VregSel = 1)

Figure 2. Step-down Regulator Output vs Power Supply
(VregSel = 0)

8 Detailed Description

8.1 Overview

The DRV10983 is a three-phase sensorless motor driver with integrated power MOSFETs, which provide drive current capability up to 2 A continuous. The device is specifically designed for low-noise, low external component count, 12- to 24-V motor drive applications. The device is configurable through a simple I²C interface to accommodate different motor parameters and spin-up profiles for different customer applications.

A 180° sensorless control scheme provides continuous sinusoidal output voltages to the motor phases to enable ultra-quiet motor operation by keeping the electrically induced torque ripple small.

The DRV10983 features extensive protection and fault detect mechanisms to ensure reliable operation. Voltage surge protection prevents the input Vcc capacitor from overcharging, which is typical during motor deceleration. The devices provides phase to phase overcurrent protection without the need for an external current sense resistor. Rotor lock detect is available through several methods. These methods can be configured with register settings to ensure reliable operation. The device provides additional protection for undervoltage lockout (UVLO) and for thermal shutdown.

The commutation control algorithm continuously measures the motor phase current and periodically measures the VCC supply voltage. The device uses this information for BEMF estimation, and the information is also provided through the I²C register interface for debug and diagnostic use in the system, if desired.

A buck step-down regulator efficiently steps down the supply voltage. The output of this regulator provides power for the internal circuits and can also be used to provide power for an external circuit such as a microcontroller. If providing power for an external circuit is not necessary (and to reduce system cost), configure the buck step-down regulator as a linear regulator by replacing the inductor with resistor.

TI designed the interfacing to the DRV10983 to be flexible. In addition to the I²C interface, the system can use the discrete FG pin, DIR pin, and SPEED pin. SPEED is the speed command input pin. It controls the output voltage amplitude. DIR is the direction control input pin. FG is the speed indicator output, which shows the frequency of the motor commutation.

EEPROM is integrated in the DRV10983 as memory for the motor parameter and operation settings. EEPROM data transfers to the register after power on and exit from sleep mode.

The DRV10983 device can also operate in register mode. If the system includes a microcontroller communicating through the I²C interface, the device can dynamically update the motor parameter and operation settings by writing to the registers. In this configuration, the EEPROM data is bypassed by the register settings.