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  • 具有 AB 类输出的 LMT87 2.7V、SC70/TO-92/TO-92S 模拟温度传感器

    • ZHCSCH2E January   2014  – October 2017 LMT87

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  • 具有 AB 类输出的 LMT87 2.7V、SC70/TO-92/TO-92S 模拟温度传感器
  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Tables
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Accuracy Characteristics
    6. 7.6 Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 LMT87 Transfer Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Mounting and Thermal Conductivity
      2. 8.4.2 Output Noise Considerations
      3. 8.4.3 Capacitive Loads
      4. 8.4.4 Output Voltage Shift
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Connection to ADC
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Conserving Power Dissipation With Shutdown
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息
  14. 重要声明
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DATA SHEET

具有 AB 类输出的 LMT87 2.7V、SC70/TO-92/TO-92S 模拟温度传感器

本资源的原文使用英文撰写。 为方便起见,TI 提供了译文;由于翻译过程中可能使用了自动化工具,TI 不保证译文的准确性。 为确认准确性,请务必访问 ti.com 参考最新的英文版本(控制文档)。

1 特性

  • LMT87LPG(TO-92S 封装)具有快速热时间常量,典型值为 10s(气流速度为 1.2m/s)
  • 非常精确:典型值 ±0.4°C
  • 2.7V 低压运行
  • -13.6mV/°C 的平均传感器增益
  • 5.4µA 低静态电流
  • 宽温度范围:–50°C 至 150°C
  • 输出受到短路保护
  • 具有 ±50µA 驱动能力的推挽输出
  • 封装尺寸兼容符合行业标准的 LM20/19 和 LM35 温度传感器
  • 具有成本优势的热敏电阻替代产品

2 应用

  • 汽车
  • 信息娱乐系统与仪表组
  • 动力传动系统
  • 烟雾和热量探测器
  • 无人机
  • 电器

3 说明

LMT87 器件是一款精密 CMOS 温度传感器,其典型精度为 ±0.4°C(最大值为 ±2.7°C),且线性模拟输出电压与温度成反比关系。2.7V 工作电源电压、5.4μA 静态电流和 0.7ms 开通时间可实现有效的功率循环架构,以最大限度地降低无人机和传感器节点等电池供电 应用 的功耗。LMT87LPG 穿孔 TO-92S 封装快速热时间常量支持非板载时间温度敏感型 应用, 例如烟雾和热量探测器。 得益于宽工作范围内的精度和其他 特性, 使得 LMT87 成为热敏电阻的优质替代产品。

对于具有不同平均传感器增益和类似精度的器件,请参阅 类似替代器件 了解 LMT8x 系列中的替代器件。

器件信息(1)

器件型号 封装 封装尺寸(标称值)
LMT87 SOT (5) 2.00mm × 1.25mm
TO-92 (3) 4.30mm × 3.50mm
TO-92S (3) 4.00mm × 3.15mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附录。

热时间常量

LMT87 D003_SNIS167.gif
* 快速热响应 NTC

输出电压与温度间的关系

LMT87 celsius_temp_NEW_SNIS170.gif

4 修订历史记录

Changes from D Revision (June 2017) to E Revision

  • 将汽车器件移到了单独的数据表 (SNIS202) Go
  • Changed TO-92 GND pin number from: 1 to: 3 Go
  • Changed TO-92 VDD pin number from: 3 to: 1 Go

Changes from C Revision (October 2015) to D Revision

  • 将数据表文本更新为最新的文档和翻译标准Go
  • 将 AEC-Q100 汽车标准项目符号添加到了 特性Go
  • 添加了时间常量图Go
  • 将磁盘驱动器、游戏、无线收发器和手机从“应用”中进行了删除Go
  • Added LPG (TO-92S) packageGo
  • Added Figure 10 to Typical CharacteristicsGo

Changes from B Revision (May 2014) to C Revision

  • Deleted 所有涉及 TO-126 封装的内容Go
  • Added TO-92 LPM pin configuration graphicGo
  • Changed Handling Ratings to ESD Ratings and moved Storage Temperature to Absolute Maximum Ratings tableGo
  • Changed KV to V Go
  • Added layout recommendation for TO-92 LP and LPM packagesGo

Changes from A Revision (June 2013) to B Revision

  • Added 数据表流程和布局,以符合 TI 新标准。添加了以下部分:应用和实施;电源建议;布局;器件和文档支持;机械、封装和可订购信息Go
  • Added TO-92 和 TO-126 封装信息。Go
  • Changed from 450°C/W to 275 °C/W. New specification is derived using TI ' s latest methodology. Go
  • Deleted Note: The input current is leakage only and is highest at high temperature. It is typically only 0.001 μA. The 1 μA limit is solely based on a testing limitation and does not reflect the actual performance of the part.Go

5 Device Comparison Tables

Table 1. Available Device Packages

ORDER NUMBER(1) PACKAGE PIN BODY SIZE (NOM) MOUNTING TYPE
LMT87DCK SOT (AKA(2): SC70, DCK) 5 2.00 mm × 1.25 mm Surface Mount
LMT87LP TO-92 (AKA(2): LP) 3 4.30 mm × 3.50 mm Through-hole; straight leads
LMT87LPG TO-92S (AKA(2): LPG) 3 4.00 mm × 3.15 mm Through-hole; straight leads
LMT87LPM TO-92 (AKA(2): LPM) 3 4.30 mm × 3.50 mm Through-hole; formed leads
LMT87DCK-Q1 SOT (AKA(2): SC70, DCK) 5 2.00 mm × 1.25 mm Surface Mount
(1) For all available packages and complete order numbers, see the Package Option addendum at the end of the data sheet.
(2) AKA = Also Known As

Table 2. Comparable Alternative Devices

DEVICE NAME AVERAGE OUTPUT SENSOR GAIN POWER SUPPLY RANGE
LMT84 –5.5 mV/°C 1.5 V to 5.5 V
LMT85 –8.2 mV/°C 1.8 V to 5.5 V
LMT86 –10.9 mV/°C 2.2 V to 5.5 V
LMT87 –13.6 mV/°C 2.7 V to 5.5 V

6 Pin Configuration and Functions

DCK Package
5-Pin SOT (SC70)
Top View
LMT87 top_view_see_NS_package_number_MAA05A_nis170.gif
LPG Package
3-Pin TO-92S
(Top View)
LMT87 LPG-3_Iso_SNIS167.gif
LP Package
3-Pin TO-92
(Top View)
LMT87 LP-3_Iso_SNIS167.gif
LPM Package
3-Pin TO-92
(Top View)
LMT87 LPM-3_Iso_SNIS167.gif

Pin Functions

PIN TYPE DESCRIPTION
NAME SOT (SC70) TO-92 TO-92S EQUIVALENT CIRCUIT FUNCTION
GND 2(1) 3 2 Ground N/A Power Supply Ground
OUT 3 2 1 Analog
Output
LMT87 pin_descrip_table_row_two_nis167.gif Outputs a voltage that is inversely proportional to temperature
VDD 1, 4, 5 1 3 Power N/A Positive Supply Voltage
(1) Direct connection to the back side of the die

7 Specifications

7.1 Absolute Maximum Ratings

See (1)(3)
MIN MAX UNIT
Supply voltage –0.3 6 V
Voltage at output pin –0.3 (VDD + 0.5) V
Output current –7 7 mA
Input current at any pin(2) –5 5 mA
Maximum junction temperature (TJMAX) 150 °C
Storage temperature Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V), the current at that pin should be limited to 5 mA.
(3) Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.

7.2 ESD Ratings

VALUE UNIT
LMT87LP in TO-92 package
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(3) ±2500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
LMT87DCK in SC70 package
V(ESD) Electrostatic discharge Human-body model (HBM), per JESD22-A114(3) ±2500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) The human-body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.

7.3 Recommended Operating Conditions

MIN MAX UNIT
Specified temperature TMIN ≤ TA ≤ TMAX  °C
−50 ≤ TA ≤ 150 °C
Supply voltage (VDD) 2.7 5.5 V

7.4 Thermal Information(1)

THERMAL METRIC(2) LMT87 LMT87LP LMT87LPG UNIT
DCK (SOT/SC70) LP/LPM (TO-92) LPG (TO-92S)
5 PINS 3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance (3)(4) 275 167 130.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 84 90 64.2 °C/W
RθJB Junction-to-board thermal resistance 56 146 106.2 °C/W
ψJT Junction-to-top characterization parameter 1.2 35 14.6 °C/W
ψJB Junction-to-board characterization parameter 55 146 106.2 °C/W
(1) For information on self-heating and thermal response time see section Mounting and Thermal Conductivity.
(2) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
(3) The junction to ambient thermal resistance (RθJA) under natural convection is obtained in a simulation on a JEDEC-standard, High-K board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are included in the PCB, per JESD 51-5.
(4) Changes in output due to self-heating can be computed by multiplying the internal dissipation by the thermal resistance.

7.5 Accuracy Characteristics

These limits do not include DC load regulation. These stated accuracy limits are with reference to the values in Table 3.
PARAMETER CONDITIONS MIN(1) TYP MAX(1) UNIT
Temperature accuracy(2) 70°C to 150°C; VDD = 3.0 V to 5.5 V –2.7 ±0.4 2.7 °C
20°C to 40°C; VDD = 2.7 V to 5.5 V ±0.6 °C
20°C to 40°C; VDD = 3.4 V to 5.5 V ±0.3 °C
0°C; VDD = 3.0 V to 5.5 V –2.7 ±0.6 2.7 °C
0°C; VDD = 3.6 V to 5.5 V ±0.3 °C
–50°C; VDD = 3.6 V to 5.5 V –2.7 ±0.6 2.7 °C
–50°C; VDD = 4.2 V to 5.5 V ±0.3 °C
(1) Limits are specific to TI's AOQL (Average Outgoing Quality Level).
(2) Accuracy is defined as the error between the measured and reference output voltages, tabulated in the Transfer Table at the specified conditions of supply gain setting, voltage, and temperature (expressed in °C). Accuracy limits include line regulation within the specified conditions. Accuracy limits do not include load regulation; they assume no DC load.

7.6 Electrical Characteristics

Unless otherwise noted, these specifications apply for +VDD = 2.7 V to 5.5 V. MIN and MAX limits apply for TA = TJ = TMIN to TMAX ; typical limits apply for TA = TJ = 25°C.
PARAMETER TEST CONDITIONS MIN(2) TYP (1) MAX (2) UNIT
Sensor gain (output transfer function slope) –13.6 mV/°C
Load regulation(3) Source ≤ 50 μA, (VDD – VOUT) ≥ 200 mV –1 –0.22 mV
Sink ≤ 50 μA, VOUT ≥ 200 mV 0.26 1 mV
Line regulation(4) 200 μV/V
IS Supply current TA = 30°C to 150°C, (VDD – VOUT) ≥ 100 mV 5.4 8.1 μA
TA = –50°C to 150°C, (VDD – VOUT) ≥ 100 mV 5.4 9 μA
CL Output load capacitance 1100 pF
Power-on time(5) CL= 0 pF to 1100 pF 0.7 1.9 ms
Output drive TA = TJ = 25°C –50 50 μA
(1) Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
(2) Limits are specific to TI's AOQL (Average Outgoing Quality Level).
(3) Source currents are flowing out of the LMT87. Sink currents are flowing into the LMT87.
(4) Line regulation (DC) is calculated by subtracting the output voltage at the highest supply voltage from the output voltage at the lowest supply voltage. The typical DC line regulation specification does not include the output voltage shift discussed in Output Voltage Shift.
(5) Specified by design and characterization.

7.7 Typical Characteristics

LMT87 temp_error_vs_temp_nis170.gif Figure 1. Temperature Error vs Temperature
LMT87 supply_current_vs_temp_nis170.gif Figure 3. Supply Current vs Temperature
LMT87 load_reg_sourcing_current_nis170.gif Figure 5. Load Regulation, Sourcing Current
LMT87 change_in_vout_vs_overhead_voltage_nis170.gif Figure 7. Change in VOUT vs Overhead Voltage
LMT87 output_voltage_vs_supply_voltage_nis170.gif Figure 9. Output Voltage vs Supply Voltage
LMT87 C002_SNIS170.png Figure 2. Minimum Operating Temperature vs
Supply Voltage
LMT87 supply_current_vs_supply_voltage_nis170.gif Figure 4. Supply Current vs Supply Voltage
LMT87 load_reg_sinking_current_nis170.gif Figure 6. Load Regulation, Sinking Current
LMT87 supply_noise_gain_vs_freq_nis170.gif Figure 8. Supply-Noise Gain vs Frequency
LMT87 D003_SNIS167.gif Figure 10. LMT87LPG Thermal Response vs Common Leaded Thermistor With 1.2-m/s Airflow

8 Detailed Description

8.1 Overview

The LMT87 is an analog output temperature sensor. The temperature-sensing element is comprised of a simple base emitter junction that is forward biased by a current source. The temperature-sensing element is then buffered by an amplifier and provided to the OUT pin. The amplifier has a simple push-pull output stage thus providing a low impedance output source.

8.2 Functional Block Diagram

Full-Range Celsius Temperature Sensor (−50°C to +150°C)
LMT87 FBD_01_SNIS170.gif

8.3 Feature Description

8.3.1 LMT87 Transfer Function

The output voltage of the LMT87, across the complete operating temperature range, is shown in Table 3. This table is the reference from which the LMT87 accuracy specifications (listed in the Accuracy Characteristics section) are determined. This table can be used, for example, in a host processor look-up table. A file containing this data is available for download at the LMT87 product folder under Tools and Software Models.

Table 3. LMT87 Transfer Table

TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
–50 3277 –10 2767 30 2231 70 1679 110 1115
–49 3266 –9 2754 31 2217 71 1665 111 1101
–48 3254 –8 2740 32 2204 72 1651 112 1087
–47 3243 –7 2727 33 2190 73 1637 113 1073
–46 3232 –6 2714 34 2176 74 1623 114 1058
–45 3221 –5 2700 35 2163 75 1609 115 1044
–44 3210 –4 2687 36 2149 76 1595 116 1030
–43 3199 –3 2674 37 2136 77 1581 117 1015
–42 3186 –2 2660 38 2122 78 1567 118 1001
–41 3173 –1 2647 39 2108 79 1553 119 987
–40 3160 0 2633 40 2095 80 1539 120 973
–39 3147 1 2620 41 2081 81 1525 121 958
–38 3134 2 2607 42 2067 82 1511 122 944
–37 3121 3 2593 43 2054 83 1497 123 929
–36 3108 4 2580 44 2040 84 1483 124 915
–35 3095 5 2567 45 2026 85 1469 125 901
–34 3082 6 2553 46 2012 86 1455 126 886
–33 3069 7 2540 47 1999 87 1441 127 872
–32 3056 8 2527 48 1985 88 1427 128 858
–31 3043 9 2513 49 1971 89 1413 129 843
–30 3030 10 2500 50 1958 90 1399 130 829
–29 3017 11 2486 51 1944 91 1385 131 814
–28 3004 12 2473 52 1930 92 1371 132 800
–27 2991 13 2459 53 1916 93 1356 133 786
–26 2978 14 2446 54 1902 94 1342 134 771
–25 2965 15 2433 55 1888 95 1328 135 757
–24 2952 16 2419 56 1875 96 1314 136 742
–23 2938 17 2406 57 1861 97 1300 137 728
–22 2925 18 2392 58 1847 98 1286 138 713
–21 2912 19 2379 59 1833 99 1272 139 699
–20 2899 20 2365 60 1819 100 1257 140 684
–19 2886 21 2352 61 1805 101 1243 141 670
–18 2873 22 2338 62 1791 102 1229 142 655
–17 2859 23 2325 63 1777 103 1215 143 640
–16 2846 24 2311 64 1763 104 1201 144 626
–15 2833 25 2298 65 1749 105 1186 145 611
–14 2820 26 2285 66 1735 106 1172 146 597
–13 2807 27 2271 67 1721 107 1158 147 582
–12 2793 28 2258 68 1707 108 1144 148 568
–11 2780 29 2244 69 1693 109 1130 149 553
150 538

Although the LMT87 is very linear, the response does have a slight umbrella parabolic shape. This shape is very accurately reflected in Table 3. The transfer table can be calculated by using the parabolic equation (Equation 1).

Equation 1. LMT87 ParaEq_G11_SNIS170.gif

The parabolic equation is an approximation of the transfer table and the accuracy of the equation degrades slightly at the temperature range extremes. Equation 1 can be solved for T resulting in:

Equation 2. LMT87 ParEqSol_SNIS170.gif

For an even less accurate linear transfer function approximation, a line can easily be calculated over the desired temperature range from Table 3 using the two-point equation (Equation 3):

Equation 3. LMT87 equation_1_nis170.gif

where

  • V is in mV,
  • T is in °C,
  • T1 and V1 are the coordinates of the lowest temperature,
  • and T2 and V2 are the coordinates of the highest temperature.

For example, if the user wanted to resolve this equation, over a temperature range of 20°C to 50°C, they would proceed as follows:

Equation 4. LMT87 equation_2_nis170.gif
Equation 5. LMT87 equation_3_nis170.gif
Equation 6. LMT87 equation_4_nis170.gif

Using this method of linear approximation, the transfer function can be approximated for one or more temperature ranges of interest.

8.4 Device Functional Modes

8.4.1 Mounting and Thermal Conductivity

The LMT87 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface.

To ensure good thermal conductivity, the backside of the LMT87 die is directly attached to the GND pin. The temperatures of the lands and traces to the other leads of the LMT87 will also affect the temperature reading.

Alternatively, the LMT87 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LMT87 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. If moisture creates a short circuit from the output to ground or VDD, the output from the LMT87 will not be correct. Printed-circuit coatings are often used to ensure that moisture cannot corrode the leads or circuit traces.

The thermal resistance junction to ambient (RθJA or θJA) is the parameter used to calculate the rise of a device junction temperature due to its power dissipation. Use Equation 7 to calculate the rise in the LMT87 die temperature:

Equation 7. LMT87 equation_5_nis170.gif

where

  • TA is the ambient temperature,
  • IS is the supply current,
  • ILis the load current on the output,
  • and VO is the output voltage.

For example, in an application where TA = 30°C, VDD = 5 V, IS = 5.4 μA, VOUT = 2231 mV, and IL = 2 μA, the junction temperature would be 30.014°C, showing a self-heating error of only 0.014°C. Because the junction temperature of the LMT87 is the actual temperature being measured, take care to minimize the load current that the LMT87 is required to drive. Thermal Information shows the thermal resistance of the LMT87.

8.4.2 Output Noise Considerations

A push-pull output gives the LMT87 the ability to sink and source significant current. This is beneficial when, for example, driving dynamic loads like an input stage on an analog-to-digital converter (ADC). In these applications the source current is required to quickly charge the input capacitor of the ADC. The LMT87 is ideal for this and other applications which require strong source or sink current.

The LMT87 supply-noise gain (the ratio of the AC signal on VOUT to the AC signal on VDD) was measured during bench tests. The typical attenuation is shown in Figure 8 found in the Typical Characteristics section. A load capacitor on the output can help to filter noise.

For operation in very noisy environments, some bypass capacitance should be present on the supply within approximately 5 centimeters of the LMT87.

8.4.3 Capacitive Loads

The LMT87 handles capacitive loading well. In an extremely noisy environment, or when driving a switched sampling input on an ADC, it may be necessary to add some filtering to minimize noise coupling. Without any precautions, the LMT87 can drive a capacitive load less than or equal to 1100 pF, as shown in Figure 11. For capacitive loads greater than 1100 pF, a series resistor may be required on the output, as shown in Figure 12.

LMT87 no_decoupling_cap_loads_less_nis170.gif Figure 11. LMT87 No Decoupling Required for Capacitive Loads Less Than 1100 pF
LMT87 series_resister_cap_loads_greater_nis170.gif Figure 12. LMT87 with Series Resistor for Capacitive Loading Greater Than 1100 pF

Table 4. Recommended Series Resistor Values

CLOAD MINIMUM RS
1.1 nF to 99 nF 3 kΩ
100 nF to 999 nF 1.5 kΩ
1 μF 800 Ω

8.4.4 Output Voltage Shift

The LMT87 is very linear over temperature and supply voltage range. Due to the intrinsic behavior of an NMOS/PMOS rail-to-rail buffer, a slight shift in the output can occur when the supply voltage is ramped over the operating range of the device. The location of the shift is determined by the relative levels of VDD and VOUT. The shift typically occurs when VDD- VOUT = 1 V.

This slight shift (a few millivolts) takes place over a wide change (approximately 200 mV) in VDD or VOUT. Because the shift takes place over a wide temperature change of 5°C to 20°C, VOUT is always monotonic. The accuracy specifications in the Accuracy Characteristics table already include this possible shift.

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

9.1 Application Information

The LMT87 features make it suitable for many general temperature-sensing applications. It can operate down to 2.7-V supply with 5.4-µA power consumption. Package options like the through-hole TO-92 package also allow the LMT87 to be mounted onboard, off-board, to a heat sink, or on multiple unique locations in the same application.

9.2 Typical Applications

9.2.1 Connection to ADC

LMT87 suggested_conn_sampling_analog_to_digital_nis170.gif Figure 13. Suggested Connection to a Sampling Analog-to-Digital Converter Input Stage

9.2.1.1 Design Requirements

Most CMOS ADCs found in microcontrollers and ASICs have a sampled data comparator input structure. When the ADC charges the sampling cap, it requires instantaneous charge from the output of the analog source such as the LMT87 temperature sensor and many op amps. This requirement is easily accommodated by the addition of a capacitor (CFILTER).

9.2.1.2 Detailed Design Procedure

The size of CFILTER depends on the size of the sampling capacitor and the sampling frequency. Because not all ADCs have identical input stages, the charge requirements will vary. This general ADC application is shown as an example only.

9.2.1.3 Application Curve

LMT87 C001_SNIS170.png Figure 14. Analog Output Transfer Function

9.2.2 Conserving Power Dissipation With Shutdown

LMT87 conversing_power_dissipation_with_shutdown_nis170.gif Figure 15. Simple Shutdown Connection of the LMT87

9.2.2.1 Design Requirements

Because the power consumption of the LMT87 is less than 9 µA, it can simply be powered directly from any logic gate output and therefore not require a specific shutdown pin. The device can even be powered directly from a microcontroller GPIO. In this way, it can easily be turned off for cases such as battery-powered systems where power savings are critical.

9.2.2.2 Detailed Design Procedure

Simply connect the VDD pin of the LMT87 directly to the logic shutdown signal from a microcontroller.

9.2.2.3 Application Curves

LMT87 LMT87_SNIS170_3p3_nl_resptim.png

INDENT:

Time: 500 μs/div; Top trace: VDD 1 V/div;
Bottom trace: OUT 1 V/div
Figure 16. Output Turnon Response Time Without a Capacitive Load and VDD = 3.3 V
LMT87 LMT87_SNIS170_5p0_nl_resptim.png

INDENT:

Time: 500 μs/div; Top trace: VDD 2 V/div;
Bottom trace: OUT 1 V/div
Figure 18. Output Turnon Response Time Without a Capacitive Load and VDD = 5 V
LMT87 LMT87_SNIS170_3p3_1NF_resptim.png

INDENT:

Time: 500 μs/div; Top trace: VDD 1 V/div;
Bottom trace: OUT 1 V/div
Figure 17. Output Turnon Response Time With a 1.1-nF Capacitive Load and VDD = 3.3 V
LMT87 LMT87_SNIS170_5p0_1NF_resptim.png

INDENT:

Time: 500 μs/div; Top trace: VDD 2 V/div;
Bottom trace: OUT 1 V/div
Figure 19. Output Turnon Response Time With a 1.1-nF Capacitive Load and VDD = 5 V

10 Power Supply Recommendations

The low supply current and supply range (2.7 V to 5.5 V) of the LMT87 allow the device to easily be powered from many sources. Power supply bypassing is optional and is mainly dependent on the noise on the power supply used. In noisy systems it may be necessary to add bypass capacitors to lower the noise that is coupled to the output of the LMT87.

11 Layout

11.1 Layout Guidelines

The LMT87 is extremely simple to layout. If a power-supply bypass capacitor is used, it should be connected as shown in the Layout Example.

11.2 Layout Example

LMT87 Layout_SNIS170.gif Figure 20. SC70 Package Recommended Layout
LMT87 lmt8x_layout_straightleads_snis170.gif Figure 21. TO-92 LP Package Recommended Layout
LMT87 lmt8x_layout_formedleads_snis170.gif Figure 22. TO-92 LPM Package Recommended Layout

12 器件和文档支持

12.1 接收文档更新通知

要接收文档更新通知,请导航至 TI.com 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。

12.2 社区资源

下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅 TI 的 《使用条款》。

    TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在 e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
    设计支持 TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。

12.3 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损伤。

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 机械、封装和可订购信息

以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。这些数据如有变更,恕不另行通知和修订此文档。如欲获取此数据表的浏览器版本,请参阅左侧的导航。



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