DRV883x 低压 H 桥驱动器

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1 特性

H 桥电机驱动器
- 驱动直流电机或其他负载
- 低 MOSFET 导通电阻：HS + LS 280mΩ
1.8A 最大驱动电流
独立的电机和逻辑电源引脚：
- 电机 VM：0 至 11 V
- 逻辑 VCC：1.8 至 7 V
PWM 或 PH-EN 接口
- DRV8837: PWM、IN1 和 IN2
- DRV8838：PH 和 EN
低功耗休眠模式，休眠电流最大值仅为 120nA
- nSLEEP 引脚
小型封装尺寸
- 带有散热焊盘的 8 引脚 WSON 封装
- 2.0mm × 2.0mm
保护特性
- VCC 欠压闭锁 (UVLO)
- 过流保护 (OCP)
- 热关断 (TSD)

2 应用范围

摄像头
数字单镜头反光 (DSLR) 镜头
消费类产品
玩具
机器人技术
医疗设备

3 说明

DRV883x 器件系列为摄像机、消费类产品、玩具和其他低电压或者电池供电的运动控制类应用提供了一个集成的电机驱动器解决方案。此器件能够驱动一个直流电机或其他器件（如螺线管）。输出驱动器模块由配置为 H 桥的 N 沟道功率 MOSFET 组成，用以驱动电机绕组。一个内部电荷泵被用来生成所需的栅极驱动电压。

DRV883x 器件系列能够提供高达
1.8A 的输出电流。它运行在 0 至 11V 之间的电机电源电压，以及 1.8V 至 7 V 范围内的器件电源电压上。

DRV8837 具有一个 PWM (IN/IN) 输入接口；DRV8838 器件具有一个 PH-EN 输入接口。这两个接口都与行业标准器件兼容。

还提供了用于过流保护、短路保护、欠压锁定和过热保护的内部关断功能。

器件信息⁽¹⁾

器件型号	封装	封装尺寸（标称值）
DRV8837	WSON (8)	2.00mm × 2.00mm
DRV8838	WSON (8)	2.00mm × 2.00mm

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。

DRV883x 简化图

4 Revision History

Changes from Revision E (June 2016) to Revision F (April 2021)

更新了整个文档中的表格、图和交叉参考的编号格式Go
Added in the Independent Half-Bridge Control sectionGo

Changes from Revision D (December 2015) to Revision E (June 2016)

Changed the threshold type to the input logic voltage parameters in the Electrical Characteristics tableGo
Changed the units for the input logic hysteresis parameter from mV to V in the Electrical Characteristics tableGo
Added the Receiving Notification of Documentation Updates section Go

Changes from Revision C (February 2014) to Revision D (December 2015)

在说明部分中对每个器件的输入接口进行了说明Go
Added CDM and HBM ESD ratings to the ESD Ratings table Go

Changes from Revision B (December 2013) to Revision C (February 2014)

添加了 DRV8838 器件信息、规格和时序图Go
添加了“器件信息”表Go
添加了 PWM 接口图Go
Added more information to the Detailed Description and moved information from the Functional Description Go
Added functional block diagram for DRV8838 Go
Added the Application and Implementation section Go
Added Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo

Changes from Revision A (August 2012) to Revision B (December 2013)

更改了“特性”部分Go
Changed Recommended Operating ConditionsGo
Changed Electrical Characteristics sectionGo
Changed Timing Requirements sectionGo
Changed Power Supplies and Input Pins sectionGo

5 Pin Configuration and Functions

Figure 5-1 DSG Package8-Pin WSON With Thermal PadDRV8837 Top View

Figure 5-2 DSG Package8-Pin WSON With Thermal PadDRV8838 Top View

Pin Functions

PIN			I/O	DESCRIPTION
NAME	NO.
NAME	DRV8837	DRV8838
POWER AND GROUND
GND	4	4	—	Device ground This pin must be connected to ground.
VCC	8	8	I	Logic power supply Bypass this pin to the GND pin with a 0.1-µF ceramic capacitor rated for VCC.
VM	1	1	I	Motor power supply Bypass this pin to the GND pin with a 0.1-µF ceramic capacitor rated for VM.
CONTROL
EN	—	5	I	ENABLE input
IN1	6	—	I	IN1 input See the Section 7 section for more information.
IN2	5	—	I	IN2 input See the Section 7 section for more information.
PH	—	6	I	PHASE input See the Section 7 section for more information.
nSLEEP	7	7	I	Sleep mode input When this pin is in logic low, the device enters low-power sleep mode. The device operates normally when this pin is logic high. Internal pulldown
OUTPUT
OUT1	2	2	O	Motor output Connect these pins to the motor winding.
OUT2	3	3	O	Motor output Connect these pins to the motor winding.

5.1 Dapper Pin Functions

PIN			I/O	DESCRIPTION
NAME	DRV8837 NO.	DRV8838 NO.	I/O	DESCRIPTION
GND	4	4	—	Device ground This pin must be connected to ground.
VCC	8	8	I	Logic power supply Bypass this pin to the GND pin with a 0.1-µF ceramic capacitor rated for VCC.
VM	1	1	I	Motor power supply Bypass this pin to the GND pin with a 0.1-µF ceramic capacitor rated for VM.
EN	—	5	I	ENABLE input
IN1	6	—	I	IN1 input See the Section 7 section for more information.
IN2	5	—	I	IN2 input See the Section 7 section for more information.
PH	—	6	I	PHASE input See the Section 7 section for more information.
nSLEEP	7	7	I	Sleep mode input When this pin is in logic low, the device enters low-power sleep mode. The device operates normally when this pin is logic high. Internal pulldown
OUT1	2	2	O	Motor output Connect these pins to the motor winding.
OUT2	3	3	O	Motor output Connect these pins to the motor winding.

6 Specifications

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)⁽¹⁾⁽²⁾

		MIN	MAX	UNIT
Motor power-supply voltage	VM	–0.3	12	V
Logic power-supply voltage	VCC	–0.3	7	V
Control pin voltage	IN1, IN2, PH, EN, nSLEEP	–0.5	7	V
Peak drive current	OUT1, OUT2	Internally limited		A
Operating virtual junction temperature, T_J		–40	150	°C
Storage temperature, T_stg		–60	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to network ground pin.

6.2 ESD Ratings

over operating ambient temperature range (unless otherwise noted)

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±3000	V
V_(ESD)	Electrostatic discharge	Charged device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±1500	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)⁽¹⁾

		MIN	MAX	UNIT
VM	Motor power supply voltage	0	11	V
VCC	Logic power supply voltage	1.8	7	V
I_OUT	Motor peak current	0	1.8	A
f_PWM	Externally applied PWM frequency	0	250	kHz
V_LOGIC	Logic level input voltage	0	5.5	V
T_A	Operating ambient temperature	–40	85	°C

(1) Power dissipation and thermal limits must be observed.