TXB0304 具有自动方向感应的 4 位双向电平转换器/电压转换器
- ZHCS470G September 2011 – May 2019 TXB0304
  
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TXB0304 具有自动方向感应的 4 位双向电平转换器/电压转换器

本资源的原文使用英文撰写。为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

1 特性

完全对称的电源电压，A 端口和 B 端口上均为 0.9V 到 3.6V
V_CC 隔离特性 – 如果任一 V_CC 输入接地，则所有输出处于高阻态
以 V_CCA 为基准的输出使能 (OE) 输入电路
低功耗，最大 5μA（I_CCA 或 I_CCB）
I_off 支持局部关断模式运行
闩锁性能超出 JESD 78 II 类规范要求的 100mA
静电放电 (ESD) 保护性能超过 JESD 22 规范的要求
- 8000V 人体放电模式 (A114-A)
- 1000V 充电器件模型 (C101)

2 应用

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3 说明

这个 4 位同相转换器使用两个独立的可配置电源轨。A 端口设计用于跟踪 V_CCA。V_CCA可接受从 0.9V 到 3.6V 范围内的任意电源电压。B 端口设计用于跟踪 V_CCB。V_CCB 可接受
0.9V 到 3.6V 范围内的任意电源电压。这可以实现 1V、1.2V、1.5V、1.8V、2.5V 和 3V 电压节点之间的任意低压双向转换。对于 TXB0304，当输出使能 (OE) 输入为低时，所有输出均处于高阻态。为确保在上电或掉电期间均处于高阻态，应将 OE 通过下拉电阻连接至 GND；该电阻的最小值取决于驱动器的拉电流能力。OE 器件控制引脚输入电路由 V_CCA 供电。该器件完全适用于 I_off 为了部分断电的应用。I_off 电路会禁用输出，从而在器件掉电时防止电流回流损坏器件。TXB0304 和 TXBN0304 唯一的区别在于 OE 信号分别为高电平有效和低电平有效。

器件信息^⁽¹⁾

器件编号	封装	封装尺寸（标称值）
TXB0304	RUT UQFN (12)	2.00mm × 1.70mm
TXB0304	RSV UQFN (16)	2.60mm x 1.80mm

如需了解所有可用封装，请参阅产品说明书末尾的可订购产品附录。

Device Images

TCA9406 典型应用(TXB0304)

TXB0304 new_schematic_diagram_SCES831F.gif

4 修订历史记录

Changes from F Revision (May 2016) to G Revision

Changed text in Power Supply Recomendations section. Go

Changes from E Revision (August 2014) to F Revision

已更改说明部分Go
已更改Absolute Maximum Ratings、Recommended Operating Conditions、Switching Characteristics和Electrical Characteristics表。Go

Changes from D Revision (October 2012) to E Revision

Added 添加了 ESD 额定值 表、特性说明部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分。Go
Changed VCCA and VCCB in the ABS MAX table to V_CCA and V_CCB in 3 places Go
Changed in ELEC CHARAC table the 0.9 x V_CCA and 0.9 x V_CCB from MAX column into the MIN column Go
Changed in ELEC CHARAC table 0.2 (2 places) in the MIN column to the MAXGo

Changes from C Revision (May 2012) to D Revision

Added Application Information section Go

Changes from B Revision (September 2011) to C Revision

Added package pin out diagram notes.Go

5 Pin Configuration and Functions

RSV Package

16-Pin UQFN

TXB0304 Top View

RSV Package

16-Pin UQFN

TXBN0304 Top View

A. See Layout Guidelines for notes about package pin out diagrams.

RUT Package

12-Pin UQFN

TXB0304 Top View

RUT Package

12-Pin UQFN

TXBN0304 Top View

Pin Functions

PIN					TYPE	DESCRIPTION
NAME	TXB0304		TXBN0304
NAME	RSV	RUT	RSV	RUT
A1	1	2	1	2	I/O	Input/output 1	Referenced to V_CCA
A2	2	3	2	3	I/O	Input/output 2
A3	3	4	3	4	I/O	Input/output 3
A4	4	5	4	5	I/O	Input/output 4
B1	12	10	12	10	I/O	Input/output 4	Referenced to V_CCB
B2	11	9	11	9	I/O	Input/output 3
B3	10	8	10	8	I/O	Input/output 2
B4	9	7	9	7	I/O	Input/output 1
GND	6, 7	6	6,7	6	GND	Ground
NC	5, 14, 15	—	5, 14, 15	—	—	No connection; not internally connected
OE	8	12	—	—	I	3-state output-mode enable. Pull OE (TXB0304) low to place all outputs in 3-state mode. Referenced to V_CCA.
OE	—	—	8	12	I	3-state output-mode enable. Pull OE (TXBN0304) high to place all outputs in 3-state mode. Referenced to V_CCA.
V_CCA	16	1	16	1	—	A-port supply voltage 0.9 V ≤ V_CCA ≤ 3.6 V
V_CCB	13	11	13	11	—	B-port supply voltage 0.9 V ≤ V_CCB ≤ 3.6 V

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) ⁽¹⁾

			MIN	MAX	UNIT
V_CCA	Supply voltage		–0.5	4.6	V
V_CCB	Supply voltage		–0.5	4.6	V
V_I	Input voltage	A port	–0.5	4.6	V
V_I	Input voltage	B port	–0.5	4.6	V
V_O	Voltage applied to any output in the high-impedance or power-off state	A port	–0.5	4.6	V
V_O		B port	–0.5	4.6	V
V_O	Voltage applied to any output in the high or low state⁽²⁾	A port	–0.5	V_CCA + 0.5	V
V_O	Voltage applied to any output in the high or low state⁽²⁾	B port	–0.5	V_CCB + 0.5	V
I_IK	Input clamp current	V_I < 0		–50	mA
I_OK	Output clamp current	V_O < 0		–50	mA
I_O	Continuous output current			±50	mA
	Continuous current through V_CCA, V_CCB, or GND			±100	mA
T_stg	Storage temperature		–65	150	°C
T_J	Junction temperature		–40	125	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The value of V_CCA and V_CCB are provided in the recommended operating conditions table.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾	±8000	V
V_(ESD)	Electrostatic discharge	Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾	±1000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions⁽¹⁾⁽²⁾

			V_CCA	V_CCB	MIN	MAX	UNIT
V_CCA	Supply voltage				0.9	3.6	V
V_CCB	Supply voltage				0.9	3.6	V
V_IH	High-level input voltage	Data inputs	0.9 V to 3.6 V	0.9 V to 3.6 V	V_CCI × 0.65	V_CCI	V
V_IH	High-level input voltage	OE/OE	0.9 V to 3.6 V	0.9 V to 3.6 V	V_CCA × 0.65	3.6	V
V_IL	Low-level input voltage	Data inputs	0.9 V to 3.6 V	0.9 V to 3.6 V	0	V_CCI × 0.35	V
		OE/OE	0.9 V to 1.2 V	0.9 V to 3.6 V	0	V_CCA × 0.3
		OE/OE	1.2 V to 3.6 V	0.9 V to 3.6 V	0	V_CCA × 0.35
V_O	Voltage range applied to any output in the high-impedance or power-off state	A-port	0.9 V to 3.6 V	0.9 V to 3.6 V	0	3.6	V
V_O		B-port	0.9 V to 3.6 V	0.9 V to 3.6 V	0	3.6	V
Δt/Δv	Input transition rise or fall rate	A-port inputs	0.9 V to 3.6 V	0.9 V to 3.6 V		40	ns/V
Δt/Δv	Input transition rise or fall rate	B-port inputs	0.9 V to 3.6 V	0.9 V to 3.6 V		40	ns/V
T_A	Operating free-air temperature				–40	85	°C

(1) The A and B sides of an unused data I/O pair must be held in the same state, such as, both at V_CCIor both at GND.

(2) V_CCI is the supply voltage associated with the input port.

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TXB0304		UNIT
		RUT (UQFN)	RSV (UQFN)
		12 PINS	16 PINS
R_θJA	Junction-to-ambient thermal resistance	116.4	131.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	45.7	55.8	°C/W
R_θJB	Junction-to-board thermal resistance	46.9	55.3	°C/W
ψ_JT	Junction-to-top characterization parameter	0.6	1.4	°C/W
ψ_JB	Junction-to-board characterization parameter	46.9	55.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER		TEST CONDITIONS		V_CCA	V_CCB	MIN	TYP	MAX	UNIT
V_OHA	High-level output voltage	I_OH = –20 μA	T_A = 25°C	0.9 V to 3.6 V		0.9 x V_CCA			V
V_OLA	Low-level output voltage	I_OL = 20 μA	–40°C to 85°C	0.9 V to 3.6 V				0.2	V
V_OHB	High-level output voltage	I_OH = –20 μA	T_A = 25°C		0.9 V to 3.6 V	0.9 x V_CCB			V
V_OLB	Low-level output voltage	I_OL = 20 μA	–40°C to 85°C		0.9 V to 3.6 V			0.2	V
I_I	OE	V_I = V_CCI or GND	T_A = 25°C	0.9 V to 3.6 V	0.9 V to 3.6 V			±1	μA
I_I	OE	V_I = V_CCI or GND	–40°C to 85°C	0.9 V to 3.6 V	0.9 V to 3.6 V			±2	μA
I_off	A port	V_I or V_O = 0 to 3.6 V	T_A = 25°C	0 V	0 V to 3.6 V			±1	μA
	A port	V_I or V_O = 0 to 3.6 V	–40°C to 85°C	0 V	0 V to 3.6 V			±2
	B port	V_I or V_O = 0 to 3.6 V	T_A = 25°C	0.9 V to 3.6 V	0 V			±1
	B port	V_I or V_O = 0 to 3.6 V	–40°C to 85°C	0.9 V to 3.6 V	0 V			±2
I_OZ	A or B port	OE = GND	T_A = 25°C	0.9 V to 3.6 V	0.9 V to 3.6 V			±1	μA
I_OZ	A or B port	OE = GND	–40°C to 85°C	0.9 V to 3.6 V	0.9 V to 3.6 V			±2	μA
I_CCA		V_I = V_CCIor GND, I_O = 0	–40°C to 85°C	0.9 V to 3.6 V	0.9 V to 3.6 V			5	μA
I_CCB		V_I = V_CCI or GND, I_O = 0	–40°C to 85°C	0.9 V to 3.6 V	0.9 V to 3.6 V			5	μA
I_CCA + I_CCB		V_I = V_CCI or GND, I_O = 0	–40°C to 85°C	0.9 V to 3.6 V	0.9 V to 3.6 V			10	μA
I_CCZA	High-Z state supply current	V_I = V_CCI or GND, I_O = 0, OE = GND	–40°C to 85°C	0.9 V to 3.6 V	0.9 V to 3.6 V			5	μA
I_CCZB	High-Z state supply current	V_I = V_CCI or GND, I_O = 0, OE = GND	–40°C to 85°C	0.9 V to 3.6 V	0.9 V to 3.6 V			5	μA
C_i	OE	T_A = 25°C		0.9 V to 3.6 V	0.9 V to 3.6 V		3		pF
C_io	A port	T_A = 25°C, OE = GND		0.9 V to 3.6 V	0.9 V to 3.6 V		6.7		pF
C_io	B port	T_A = 25°C, OE = GND		0.9 V to 3.6 V	0.9 V to 3.6 V		6.7		pF

6.6 Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted)

	LOAD	V_CCA	V_CCB	MAX	UNIT
Data rate	C_L = 15 pF	0.9 to 3.6 V	0.9 to 3.6 V	50	Mbps
	C_L = 15 pF	1.2 to 3.6 V	1.2 to 3.6 V	100	Mbps
	C_L = 15 pF	1.8 to 3.6 V	1.8 to 3.6 V	140	Mbps
	C_L = 30 pF	0.9 to 3.6 V	0.9 to 3.6 V	40	Mbps
	C_L = 30 pF	1.2 to 3.6 V	1.2 to 3.6 V	90	Mbps
	C_L = 30 pF	1.8 to 3.6 V	1.8 to 3.6 V	130	Mbps
	C_L = 50 pF	1.2 to 3.6 V	1.2 to 3.6 V	80	Mbps
	C_L = 50 pF	1.8 to 3.6 V	1.8 to 3.6 V	120	Mbps
	C_L = 100 pF	1.2 to 3.6 V	1.2 to 3.6 V	70	Mbps
	C_L = 100 pF	1.8 to 3.6 V	1.8 to 3.6 V	100	Mbps

6.7 Switching Characteristics

over operating free-air temperature range (unless otherwise noted). (For parameter descriptions, see Figure 2 and Figure 3.)

PARAMETER	FROM (INPUT)	TO (OUTPUT)	LOAD	V_CCA	V_CCB	TYP⁽¹⁾	MAX	UNIT
t_pd	A	B	C_L = 15	0.9-3.6	0.9-3.6	18.9	30	ns
	A	B	C_L = 15	1.2-3.6	1.2-3.6	7.5	11.5
	A	B	C_L = 15	1.8-3.6	1.8-3.6	3.7	4.8
	A	B	C_L = 30	0.9-3.6	0.9-3.6	19.5	34
	A	B	C_L = 30	1.2-3.6	1.2-3.6	7.8	11.9
	A	B	C_L = 30	1.8-3.6	1.8-3.6	3.8	5.2
	A	B	C_L = 50	1.2-3.6	1.2-3.6	8	12.3
	A	B	C_L = 50	1.8-3.6	1.8-3.6	4	5.4
	A	B	C_L = 100	1.2-3.6	1.2-3.6	8.6	13.5
	A	B	C_L = 100	1.8-3.6	1.8-3.6	4.5	6
	B	A	C_L = 15	0.9-3.6	0.9-3.6	18.9	30	ns
	B	A	C_L = 15	1.2-3.6	1.2-3.6	7.5	11.5
	B	A	C_L = 15	1.8-3.6	1.8-3.6	3.7	5
	B	A	C_L = 30	0.9-3.6	0.9-3.6	19.5	34
	B	A	C_L = 30	1.2-3.6	1.2-3.6	7.8	11.9
	B	A	C_L = 30	1.8-3.6	1.8-3.6	3.8	5.2
	B	A	C_L = 50	1.2-3.6	1.2-3.6	8	12.3
	B	A	C_L = 50	1.8-3.6	1.8-3.6	4	5.4
	B	A	C_L = 100	1.2-3.6	1.2-3.6	8.6	13.5
	B	A	C_L = 100	1.8-3.6	1.8-3.6	4.5	6
t_en	OE	A	C_L = 15	0.9-3.6	0.9-3.6		262	ns
				1.2-3.6	1.2-3.6		64
				1.8-3.6	1.8-3.6		37
		B	C_L = 15	0.9-3.6	0.9-3.6		332
				1.2-3.6	1.2-3.6		76
				1.8-3.6	1.8-3.6		41
t_dis	OE	A	C_L = 15	0.9-3.6	0.9-3.6		172	ns
t_dis	OE	B	C_L = 15	0.9-3.6	0.9-3.6		169	ns
t_rB, t_fB	B-port rise and fall times		C_L = 15	0.9-3.6	0.9-3.6	2.95		ns
t_sA, t_sA	A-port rise and fall times		C_L = 15	0.9-3.6	0.9-3.6	3.1		ns
t_SK(O)	Channel-to-channel skew		C_L = 15	0.9-3.6	0.9-3.6		0.15	ns

(1) T_A = 25°C

6.8 Operating Characteristics

C_pd- power dissipation capacitance measured at T_A = 25°C.

PARAMETER		TEST CONDITIONS	TYP⁽¹⁾	UNIT
C_pdA	A-port input, B-port output	C_L = 0, f = 10 MHz, t_r = t_f= 1 ns, OE = V_CCA (outputs enabled)	34	pF
C_pdA	B-port input, A-port output		34	pF
C_pdB	A-port input, B-port output		34	pF
C_pdB	B-port input, A-port output		34	pF
C_pdA	A-port input, B-port output	C_L = 0, f = 10 MHz, t_r = t_f = 1 ns, OE = GND (outputs disabled)	0.01	pF
C_pdA	B-port input, A-port output		0.01	pF
C_pdB	A-port input, B-port output		0.01	pF
C_pdB	B-port input, A-port output		0.01	pF

(1) V_CCA, V_CCB 0.9 V to 3.6 V

6.9 Typical Characteristics

Figure 1. Input Capacitors for OE Pin (C_I) vs Power Supply (V_CCA)

7 Parameter Measurement Information

A. C_L includes probe and jig capacitance.

B. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z_O = 50 Ω, dv/dt ≥ 1 V/ns.

C. The outputs are measured one at a time, with one transition per measurement.

D. t_PLH and t_PHL are the same as t_pd.

E. V_CCI is the V_CC associated with the input port.

F. V_CCO is the V_CC associated with output port.

G. All parameters and waveforms are not applicable to all devices.

Figure 2. Load Circuits and Voltage Waveforms

1. t_PLZ and t_PHZ are the same as t_dis.

2. t_PZL and t_PZH are the same as t_en.

3. Waveform 1 is for an output with internal such that the output is high, except when OE is high. Waveform 2 is for an output with conditions such that the output is low, except when OE is high.

Figure 3. Enable and Disable Times

8 Detailed Description

8.1 Overview

The TXB0304 and TXBN0304 can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another.