SPRZ436G October   2015  – February 2021 AM5706 , AM5708 , AM5716 , AM5718 , AM5718-HIREL

 

  1. 1Introduction
    1.     Related Documentation
    2.     Trademarks
    3.     Modules Impacted
  2. 2Silicon Advisories
    1.     Revisions SR 2.1, 2.0, 1.0 - Advisories List
    2.     i202
    3.     i378
    4.     i631
    5.     i694
    6.     i698
    7.     i699
    8.     i709
    9.     i727
    10.     i729
    11.     i734
    12.     i767
    13.     i782
    14.     i783
    15.     i802
    16.     i803
    17.     i807
    18.     i808
    19.     i809
    20.     i810
    21.     i813
    22.     i814
    23.     i815
    24.     i818
    25.     i819
    26.     i820
    27.     i824
    28.     i826
    29.     i829
    30.     i834
    31.     i849
    32.     i856
    33.     i862
    34.     i863
    35.     i867
    36.     i868
    37.     i869
    38.     i870
    39.     i871
    40.     i872
    41.     i874
    42.     i875
    43.     i878
    44.     i879
    45.     i880
    46.     i882
    47.     i883
    48.     i887
    49.     i889
    50.     i890
    51.     i893
    52.     i895
    53.     i896
    54.     i897
    55.     i898
    56.     i899
    57.     i900
    58.     i903
    59.     i904
    60.     i906
    61.     i907
    62.     i913
    63.     i916
    64.     i927
    65.     i928
    66.     i929
    67.     i930
    68.     i932
    69.     i933
    70.     i936
    71.     i940
  3. 3Silicon Limitations
    1.     Revisions SR 2.1, 2.0, 1.0 - Limitations List
    2.     i596
    3.     i641
    4.     i833
    5.     i838
    6.     i845
    7.     i848
    8.     i876
    9.     i877
    10.     i892
    11.     i909
    12.     i922
    13.     i925
  4. 4Silicon Cautions
    1.     Revisions SR 2.1, 2.0, 1.0 - Cautions List
    2.     i827
    3.     i832
    4.     i836
    5.     i839
    6.     i864
    7.     i885
    8.     i886
    9.     i912
    10.     i918
    11.     i920
    12.     i921
    13.     i926
    14.     i931
    15.     i934
    16.     i935
  5. 5Revision History

i868

McASP to EDMA Synchronization Level Event Can Be Lost

CRITICALITY

Medium

DESCRIPTION

The McASP FIFO events to the EDMA or System DMA can be lost depending on the timing between the McASP side activity and the DMA side activity. The problem is most likely to occur in a heavily loaded system which can cause the DMA latency to increase and potentially hit the problematic timing window. When an event is lost, the McASP FIFO Rx path will overflow or the Tx path will underflow. Software intervention is required to recover from this condition.

The issue results due to a state machine boundary condition in the McASP FIFO logic. In normal operation, when "Threshold" (set by the RFIFOCTL[15:8] RNUMEVT and WFIFOCTL[15:8] WNUMEVT registers) words of data are read/written by the DMA then the previous event would be cleared. Similarly, when "Threshold" words of data are written/read from the pins, a new event should be set. If these two conditions occur at the same exact time (within a 2 cycle window), then there is a conflict in the set/clear logic and the event is cleared but is not re-asserted to the DMA.

WORKAROUND

Since the McASP is a real time peripheral, any loss of data due to underflow/overflow should be avoided by eliminating the possibility of DMA read/write completing at the same time as a new McASP Event. Software should configure the system to:

  1. Maximize time until the deadline for the McASP FIFO
  2. Minimize DMA service time for McASP related transfers

In order to maximize time until deadline, the RNUMEVT and WNUMEVT should be set to the largest multiple of "number of serializers active" that is less-than-equal-to 32 words. Since the FIFO is 64-Words deep, this gives the maximum time to avoid the boundary condition.

In order to minimize DMA service time for McASP related transfers multiple options are possible. For example, McASP buffers can be placed in OCMCRAM or DSP's L2 SRAM (since on chip memories provide a more deterministic and lower latency path compared to DDR memory). In addition, a dedicated Queue/TC can be allocated to McASP transfers. At minimum, care should be taken to avoid any long transfers on the same Queue/TC to avoid head-of-line blocking latency.

REVISIONS IMPACTED

AM571x SR 1.0

TDA2Ex (23mm): 1.0

AM571x: 1.0

DRA72x: 1.0