The DRA75xP, DRA74xP, DRA77xP, DRA76xP die will be offered with the following characteristics:
- Two available packages:
- Pin compatible ABZ package for DRA75xP and DRA74xP devices
- High performance ACD package for DRA77xP and DRA76xP devices
- Body: 23 × 23mm
- Technology: Ball Grid Array (BGA) package
- Ball pitch: 0.8-mm ball pitch with Via
Channel® Array (VCA) technology
- Pattern: partial grid
- Pins: 760 total device pins (ABZ package), 784 total device pins (ACD package)
For more information refer to device Data Manual.