SFFSB46 March   2026 ISO6440

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 DW-16 Wide-SOIC Package
    2. 2.2 DFP-16 Wide-SSOP Package
    3. 2.3 DBQ-16 SSOP Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 DW-16 Wide-SOIC, DFP-16 Wide-SSOP, and DBQ-16 SSOP Packages
  7. 5Revision History

3 Failure Mode Distribution (FMD)

The failure mode distribution estimation for the ISO6440 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity, and from best engineering judgment.

The failure modes listed in this section reflect random failure events and do not include failures resulting from misuse or overstress.

Table 3-1 Die Failure Modes and Distribution
Die Failure Modes Failure Mode Distribution (%)
OUTx state is undetermined 20
OUTx is stuck to default state 38
OUTx is stuck to non-default state 12
OUTx is not in timing or voltage specification 14
OUTx is stuck high 8
OUTx is stuck low 8