SFFSAF9 December   2025 ISO6441

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 DW-16 Wide-SOIC Package
    2. 2.2 DFP-16 Wide-SSOP Package
    3. 2.3 DBQ-16 SSOP Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 DW-16 Wide-SOIC, DFP-16 Wide-SSOP, and DBQ-16 SSOP Packages
  7. 5Revision History

2.2 DFP-16 Wide-SSOP Package

This section provides functional safety failure in time (FIT) rates for the DFP-16 Wide-SSOP package of the ISO6441 based on two different industry-wide used reliability standards:

  • Table 2-5 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-6 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-3 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262FIT (Failures Per 109 Hours)
Total component FIT rate19
Die FIT rate4
Package FIT rate15

The failure rate and mission profile information in Table 2-5 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission profile: Motor control from table 11 or figure 16
  • Power dissipation: 262.2mW
  • Climate type: World-wide table 8 or figure 13
  • Package factor (lambda 3): From table 17b or figure 15
  • Substrate material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-4 Component Failure Rates per Siemens Norm SN 29500-2
TableCategoryReference FIT RateReference Virtual TJ
5CMOS, BICMOS
Digital, analog, or mixed		25 FIT55°C

The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-6 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.