SCES531L December   2003  – May 2017 SN74AVC2T45

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: VCCA = 1.2 V
    7. 6.7  Switching Characteristics: VCCA = 1.5 V ±0.1 V
    8. 6.8  Switching Characteristics: VCCA = 1.8 V ±0.15 V
    9. 6.9  Switching Characteristics: VCCA = 2.5 V ±0.2 V
    10. 6.10 Switching Characteristics: VCCA = 3.3 V ±0.3 V
    11. 6.11 Operating Characteristics
    12. 6.12 Typical Characteristics
      1. 6.12.1 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 1.2 V
      2. 6.12.2 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 1.5 V
      3. 6.12.3 Typical Propagation Delay (A-to-B) vs Load Capacitance, TA = 25°C, VCCA = 1.8 V
      4. 6.12.4 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 2.5 V
      5. 6.12.5 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 3.3 V
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VCC Isolation
      2. 8.3.2 2-Rail Design
      3. 8.3.3 IO Ports are 4.6-V Tolerant
      4. 8.3.4 Partial-Power-Down Mode
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Unidirectional Logic Level-Shifting Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Bidirectional Logic Level-Shifting Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Enable Times
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Layout

Layout Guidelines

To ensure reliability of the device, following common printed-circuit board layout guidelines is recommended.

  • Bypass capacitors should be used on power supplies. Place the capacitors as close as possible to the VCCA, VCCB pin and GND pin.
  • Short trace lengths should be used to avoid excessive loading.

Layout Example

SN74AVC2T45 layoutYZP.gif Figure 16. Layout Example for YZP Package