ZHCSLW2C September   2021  – April 2022 ISOW7740 , ISOW7741 , ISOW7742 , ISOW7743 , ISOW7744

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. 说明(接续)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics - Power Converter
    10. 7.10 Supply Current Characteristics - Power Converter
    11. 7.11 Electrical Characteristics Channel Isolator - VIO, VISOIN = 5-V
    12. 7.12 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 5-V
    13. 7.13 Electrical Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
    14. 7.14 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
    15. 7.15 Electrical Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
    16. 7.16 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
    17. 7.17 Electrical Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
    18. 7.18 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
    19. 7.19 Switching Characteristics - 5-V Supply
    20. 7.20 Switching Characteristics - 3.3-V Supply
    21. 7.21 Switching Characteristics - 2.5-V Supply
    22. 7.22 Switching Characteristics - 1.8-V Supply
    23. 7.23 Insulation Characteristics Curves
    24. 7.24 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
      1. 9.1.1 Power Isolation
      2. 9.1.2 Signal Isolation
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 9.3.2 Power-Up and Power-Down Behavior
      3. 9.3.3 Protection Features
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
      4. 10.2.4 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 支持资源
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
  • DFM|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 100 Mbps 数据速率
  • 低辐射、低噪声的集成式直流/直流转换器
    • 辐射经过优化,符合 CISPR 32 和 EN 55032 B 类标准,在 2 层电路板上的裕度 >5dB
    • 25 MHz 的低频电源转换器可实现低噪声性能
    • 低输出波纹:24 mV
  • 高效率输出功率
    • 最大负载时的效率:46%
    • 高达 0.55W 的输出功率
    • VISOOUT 精度为 5%
    • 5V 至 5V:最大可用负载电流 = 110 mA
    • 5V 至 3.3V:最大可用负载电流 = 140 mA
    • 3.3V 至 3.3V:最大可用负载电流 = 60 mA
  • 用于通道隔离器和电源转换器的独立电源
    • 逻辑电源 (VIO):1.71V 至 5.5V
    • 电源转换器电源 (VDD):3V 至 5.5V
  • 优异的电磁兼容性 (EMC)
    • 系统级 ESD、EFT 和浪涌抗扰性
    • 在整个隔离栅具有 ±8kV IEC 61000-4-2 接触放电保护
  • 增强型和基础型隔离选项
  • 高 CMTI:100 kV/µs(典型值)
  • 安全相关认证:
    • 符合 DIN VDE V 0884-11:2017-01 标准的 VDE 增强型和基础型绝缘
    • UL 1577 组件认证计划
    • IEC 62368-1、IEC 61010-1、IEC 60601-1 和 GB 4943.1-2011 认证
    • ISOW774xB 器件已列入计划
  • 扩展温度范围:–40°C 至 +125°C
  • 20 引脚宽体 SOIC 封装