ZHCSNI5 May   2021 ISOS141-SEP

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply 
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  7. Operating Life Deration
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Radiation Tolerance
      2. 9.3.2 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
        1. 10.2.3.1 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 抗辐射
    • 电离辐射总剂量 (TID) 特征值(无 ELDRS)= 30krad(Si)
    • TID RLAT/RHA = 30krad(Si)
    • 单粒子锁定 (SEL) 在 125°C 下对 LET 的抗扰度 = 43MeV⋅cm2/mg
    • 单粒子绝缘击穿 (SEDR) 在 500VDC 下的抗扰度 (43MeV⋅cm2/mg)
  • 增强型航天塑料(航天 EP)
    • 符合 NASA ASTM E595 释气规格要求
    • 供应商项目图 (VID) V62/21610
    • 军用级温度范围(-55°C 至 125°C)
    • 同一晶圆制造场所
    • 同一组装和测试场所
    • 金键合线,NiPdAu 铅涂层
    • 晶圆批次可追溯性
    • 延长了产品生命周期
    • 延长了产品变更通知周期
  • 600VRMS 连续工作电压
  • GUID-XXXXXXXX-SF0T-XXXX-XXXX-000000233615.html
    • DIN VDE V 0884-11:2017-01
    • UL 1577 组件认证计划
  • 100 Mbps 数据速率
  • 宽电源电压范围:2.25V 至 5.5V
  • 2.25V 至 5.5V 电平转换
  • 默认输出
  • 低功耗,1Mbps 时每通道的电流典型值为 1.5mA
  • 低传播延迟:典型值为 10.7ns(5V 电源供电时)
  • 通道间偏斜小:最大 4ns(5V 电源供电时)
  • CMTI 典型值为 ±100kV/μs
  • 系统级 ESD、EFT、浪涌和磁抗扰度
  • 小型 QSOP (DBQ-16) 封装