ZHCSIZ6C October   2018  – June 2019 ADS125H02

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     功能方框图
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input Range
      2. 9.3.2 Analog Inputs
        1. 9.3.2.1 ESD Diodes
        2. 9.3.2.2 Input Multiplexer
          1. 9.3.2.2.1 Analog Inputs (AIN0, AIN1, AINCOM)
          2. 9.3.2.2.2 High-Voltage Power Supply Readback
          3. 9.3.2.2.3 Internal VCOM Connection (Default)
          4. 9.3.2.2.4 Temperature Sensor
      3. 9.3.3 Programmable Gain Amplifier (PGA)
        1. 9.3.3.1 PGA Operating Range
        2. 9.3.3.2 PGA Monitor
      4. 9.3.4 Reference Voltage
        1. 9.3.4.1 Internal Reference
        2. 9.3.4.2 External Reference
        3. 9.3.4.3 AVDD Power-Supply Reference
        4. 9.3.4.4 Reference Monitor
      5. 9.3.5 Current Sources (IDAC1 and IDAC2)
      6. 9.3.6 General-Purpose Inputs and Outputs (GPIOs)
      7. 9.3.7 ADC Modulator
      8. 9.3.8 Digital Filter
        1. 9.3.8.1 Sinc Filter Mode
          1. 9.3.8.1.1 Sinc Filter Frequency Response
        2. 9.3.8.2 FIR Filter
        3. 9.3.8.3 50-Hz and 60-Hz Normal Mode Rejection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Conversion Control
        1. 9.4.1.1 Continuous-Conversion Mode
        2. 9.4.1.2 Pulse-Conversion Mode
        3. 9.4.1.3 Conversion Latency
        4. 9.4.1.4 Start-Conversion Delay
      2. 9.4.2 Auto-Zero Mode
      3. 9.4.3 Clock Mode
      4. 9.4.4 Reset
        1. 9.4.4.1 Power-On Reset
        2. 9.4.4.2 Reset by Pin
        3. 9.4.4.3 Reset by Command
      5. 9.4.5 Calibration
        1. 9.4.5.1 Offset and Full-Scale Calibration
          1. 9.4.5.1.1 Offset Calibration Registers
          2. 9.4.5.1.2 Full-Scale Calibration Registers
        2. 9.4.5.2 Offset Calibration (OFSCAL)
        3. 9.4.5.3 Full-Scale Calibration (GANCAL)
        4. 9.4.5.4 Calibration Command Procedure
        5. 9.4.5.5 User Calibration Procedure
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Chip-Select Pins (CS1 and CS2)
        2. 9.5.1.2 Serial Clock (SCLK)
        3. 9.5.1.3 Data Input (DIN)
        4. 9.5.1.4 Data Output/Data Ready (DOUT/DRDY)
      2. 9.5.2 Data Ready (DRDY)
        1. 9.5.2.1 DRDY in Continuous-Conversion Mode
        2. 9.5.2.2 DRDY in Pulse-Conversion Mode
        3. 9.5.2.3 Data Ready by Software Polling
      3. 9.5.3 Conversion Data
        1. 9.5.3.1 Status Byte (STATUS0)
        2. 9.5.3.2 Conversion Data Format
      4. 9.5.4 Cyclic Redundancy Check (CRC)
      5. 9.5.5 Commands
        1. 9.5.5.1  General Command Format
        2. 9.5.5.2  NOP Command
        3. 9.5.5.3  RESET Command
        4. 9.5.5.4  START Command
        5. 9.5.5.5  STOP Command
        6. 9.5.5.6  RDATA Command
        7. 9.5.5.7  OFSCAL Command
        8. 9.5.5.8  GANCAL Command
        9. 9.5.5.9  RREG Command
        10. 9.5.5.10 WREG Command
        11. 9.5.5.11 LOCK Command
        12. 9.5.5.12 UNLOCK Command
    6. 9.6 Register Map
      1. 9.6.1  Device Identification (ID) Register (address = 00h) [reset = 6xh]
        1. Table 30. ID Register Field Descriptions
      2. 9.6.2  Main Status (STATUS0) Register (address = 01h) [reset = 01h]
        1. Table 31. STATUS0 Register Field Descriptions
      3. 9.6.3  Mode 0 (MODE0) Register (address = 02h) [reset = 24h]
        1. Table 32. MODE0 Register Field Descriptions
      4. 9.6.4  Mode 1 (MODE1) Register (address = 03h) [reset = 01h]
        1. Table 33. MODE1 Register Field Descriptions
      5. 9.6.5  Mode 2 (MODE2) Register (address = 04h) [reset = 00h]
        1. Table 34. MODE2 Register Field Descriptions
      6. 9.6.6  Mode 3 (MODE3) Register (address = 05h) [reset = 00h]
        1. Table 35. MODE3 Register Field Descriptions
      7. 9.6.7  Reference Configuration (REF) Register (address = 06h) [reset = 05h]
        1. Table 36. REF Register Field Descriptions
      8. 9.6.8  Offset Calibration (OFCALx) Registers (address = 07h, 08h, 09h) [reset = 00h, 00h, 00h]
        1. Table 37. OFCAL0, OFCAL1, OFCAL2 Registers Field Description
      9. 9.6.9  Full-Scale Calibration (FSCALx) Registers (address = 0Ah, 0Bh, 0Ch) [reset = 00h, 00h, 40h]
        1. Table 38. FSCAL0, FSCAL1, FSCAL2 Registers Field Description
      10. 9.6.10 Current Source Multiplexer (I_MUX) Register (address = 0Dh) [reset = FFh]
        1. Table 39. I_MUX Register Field Descriptions
      11. 9.6.11 Current Source Magnitude (I_MAG) Register (address = 0Eh) [reset = 00h]
        1. Table 40. I_MAG Register Field Descriptions
      12. 9.6.12 Reserved (RESERVED) Register (address = 0Fh) [reset = 00h]
        1. Table 41. RESERVED Register Field Descriptions
      13. 9.6.13 MODE4 (MODE4) Register (address = 10h) [reset = 50h]
        1. Table 42. MODE4 Register Field Descriptions
      14. 9.6.14 PGA Alarm (STATUS1) Register (address = 11h) [reset = xxh]
        1. Table 43. STATUS1 Register Field Descriptions
      15. 9.6.15 Status 2 (STATUS2) Register (address = 12h) [reset = 0xh]
        1. Table 44. STATUS2 Register Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Input Range
      2. 10.1.2 Input Overload
        1. 10.1.2.1 Input Signal Rate of Change (dV/dt)
      3. 10.1.3 Unused Inputs and Outputs
    2. 10.2 Typical Applications
      1. 10.2.1 ±10-V Analog Input Module
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Thermocouple Input With High Common-Mode Voltage
    3. 10.3 Initialization Setup
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Decoupling
    2. 11.2 Analog Power-Supply Clamp
    3. 11.3 Power-Supply Sequencing
    4. 11.4 5-V to ±15-V DC-DC Converter
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档
    2. 13.2 接收文档更新通知
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

1 特性

  • ±20V 输入、24 位 Δ-Σ ADC
  • 可编程数据速率：2.5SPS 至 40000SPS
  • 高压高阻抗 PGA：
    • 差分输入范围：高达 ±20V
    • 可编程增益：0.125 至 128
    • 共模输入电压：高达 ±15.5V
    • 输入阻抗：1GΩ（最小值）
  • 高性能 ADC：
    • 输入噪声：45nVRMS (20SPS)
    • CMRR：105dB
    • 在 50Hz、60Hz 下的常规模式抑制：95dB
    • 温漂：5nV/°C
    • 增益漂移：1ppm/°C
    • 积分非线性 (INL)：2ppm
  • 集成 特性 和诊断功能：
    • 2.5V 基准：3ppm/°C 漂移
    • 时钟振荡器：2.5% 误差（最大值）
    • 激励电流源
    • GPIO 可驱动外部多路复用器
    • 信号和基准电压监控器
    • 循环冗余校验 (CRC)
  • 电源：
    • AVDD：4.75V 至 5.25V
    • DVDD：2.7V 至 5.25V
    • HVDD：±5V 至 ±18V
  • 工作温度：–40°C 至 +125°C
  • 5mm × 5mm VQFN 封装