ZHCSOY9 december   2021 UCC28781

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Detailed Pin Description
      1. 7.3.1  BUR Pin (Programmable Burst Mode)
      2. 7.3.2  FB Pin (Feedback Pin)
      3. 7.3.3  REF Pin (Internal 5-V Bias)
      4. 7.3.4  VDD Pin (Device Bias Supply)
      5. 7.3.5  P13 and SWS Pins
      6. 7.3.6  S13 Pin
      7. 7.3.7  IPC Pin (Intelligent Power Control Pin)
      8. 7.3.8  RUN Pin (Driver and Bias Source for Isolator)
      9. 7.3.9  PWMH and AGND Pins
      10. 7.3.10 PWML and PGND Pins
      11. 7.3.11 SET Pin
      12. 7.3.12 RTZ Pin (Sets Delay for Transition Time to Zero)
      13. 7.3.13 RDM Pin (Sets Synthesized Demagnetization Time for ZVS Tuning)
      14. 7.3.14 XCD Pin
      15. 7.3.15 CS, VS, and FLT Pins
    4. 7.4 Device Functional Modes
      1. 7.4.1  Adaptive ZVS Control with Auto-Tuning
      2. 7.4.2  Dead-Time Optimization
      3. 7.4.3  EMI Dither and Dither Fading Function
      4. 7.4.4  Control Law Across Entire Load Range
      5. 7.4.5  Adaptive Amplitude Modulation (AAM)
      6. 7.4.6  Adaptive Burst Mode (ABM)
      7. 7.4.7  Low Power Mode (LPM)
      8. 7.4.8  First Standby Power Mode (SBP1)
      9. 7.4.9  Second Standby Power Mode (SBP2)
      10. 7.4.10 Startup Sequence
      11. 7.4.11 Survival Mode of VDD (INT_STOP)
      12. 7.4.12 System Fault Protections
        1. 7.4.12.1  Brown-In and Brown-Out
        2. 7.4.12.2  Output Over-Voltage Protection (OVP)
        3. 7.4.12.3  输入过压保护 (IOVP)
        4. 7.4.12.4  FLT 引脚上的过热保护 (OTP)
        5. 7.4.12.5  CS 引脚上的过热保护 (OTP)
        6. 7.4.12.6  可编程过功率保护 (OPP)
        7. 7.4.12.7  峰值功率限制 (PPL)
        8. 7.4.12.8  输出短路保护 (SCP)
        9. 7.4.12.9  过流保护 (OCP)
        10. 7.4.12.10 External Shutdown
        11. 7.4.12.11 Internal Thermal Shutdown
      13. 7.4.13 Pin Open/Short Protections
        1. 7.4.13.1 Protections on CS pin Fault
        2. 7.4.13.2 Protections on P13 pin Fault
        3. 7.4.13.3 Protections on RDM and RTZ pin Faults
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application Circuit
      1. 8.2.1 Design Requirements for a 60-W, 15-V ZVSF Bias Supply Application with a DC Input
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Bulk Capacitance and Minimum Bulk Voltage
        2. 8.2.2.2 Transformer Calculations
          1. 8.2.2.2.1 Primary-to-Secondary Turns Ratio (NPS)
          2. 8.2.2.2.2 Primary Magnetizing Inductance (LM)
          3. 8.2.2.2.3 Primary Winding Turns (NP)
          4. 8.2.2.2.4 Secondary Winding Turns (NS)
          5. 8.2.2.2.5 Auxiliary Winding Turns (NA)
          6. 8.2.2.2.6 Winding and Magnetic Core Materials
        3. 8.2.2.3 Calculation of ZVS Sensing Network
        4. 8.2.2.4 Calculation of BUR Pin Resistances
        5. 8.2.2.5 Calculation of Compensation Network
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1  General Considerations
      2. 10.1.2  RDM and RTZ Pins
      3. 10.1.3  SWS Pin
      4. 10.1.4  VS Pin
      5. 10.1.5  BUR Pin
      6. 10.1.6  FB Pin
      7. 10.1.7  CS Pin
      8. 10.1.8  AGND Pin
      9. 10.1.9  PGND Pin
      10. 10.1.10 Thermal Pad
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Receiving Notification of Documentation Updates
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 静电放电警告
    5. 11.5 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3.2 FB Pin (Feedback Pin)

The FB pin usually connects to the collector of an optocoupler output transistor through an external current-limiting resistor (RFB). A maximum of 20 kΩ for RFB is recommended. The feedback network of UCC28781 is shown in Figure 7-3. A high-quality ceramic by-pass capacitor between FB pin and REF pin (CFB) is required for decoupling IFB from switching noise interference. A minimum of 220 pF is recommended for CFB . An internal 8-kΩ resistor (RFBI) at the FB pin in conjunction with the external CFB forms an effective low-pass filter. Section 8 provides a detailed design guide on the secondary-side compensation network of VO feedback loop, to improve the load transient response and also limit the IFB ripple of ABM mode within the recommended range.

GUID-2261B939-DE29-45DD-97DA-0C340AD4573C-low.gif Figure 7-3 External Feedback Network Connected to the FB Pin

Depending on the operating mode, the controller interprets the current flowing out of the FB pin (IFB) to regulate the output voltage. For AAM and LPM modes based on peak current control, IFB is converted into an internal peak current-sense threshold (VCST) to modulate the amplitude of the current-sense signal on the CS pin. For example, when the output voltage (VO) is lower than the regulation level set by the shunt regulator, the absolute current level of IFB reduces, causing a higher VCST to increase more power to the output load. In ABM, the burst control loop takes over the VO regulation, where VCST is clamped to VCST(BUR) and the ripple component of IFB participates in the modulation of the burst off time.

Figure 7-4 illustrates the operating principle of the ABM. A burst of switching pulses raises the output voltage VO which increases IFB. At the end of the burst, the load current discharges the output capacitor, which decreases VO and IFB. UCC28781 injects a noise-free internal ramp compensation current (ICOMP) superimposed on IFB in order to stabilize the ABM operation. When the RUN pin is high, ICOMP is reset to 0 μA. When the RUN pin goes low, ICOMP is gradually increased to 6 μA with a positive slope of 0.214 A/s. The summation of IFB and ICOMP is compared with ITH(FB) to trigger the next burst event. The magnitude and sharp slope of ICOMP help to push switching ripple and high-frequency noise component of IOPTO away from ITH(FB).

GUID-8390842B-6B8A-4D09-B157-D93F5BC3ECAD-low.gif Figure 7-4 Concept of Burst Control with an Internal Ramp Compensation