ZHCSJ20C August   2018  – March 2019 UCC21530-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     功能方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety-Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Propagation Delay and Pulse Width Distortion
    2. 7.2 Rising and Falling Time
    3. 7.3 Input and Enable Response Time
    4. 7.4 Programable Dead Time
    5. 7.5 Power-Up UVLO Delay to OUTPUT
    6. 7.6 CMTI Testing
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VDD, VCCI, and Under Voltage Lock Out (UVLO)
      2. 8.3.2 Input and Output Logic Table
      3. 8.3.3 Input Stage
      4. 8.3.4 Output Stage
      5. 8.3.5 Diode Structure in UCC21530-Q1
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable Pin
      2. 8.4.2 Programmable Dead Time (DT) Pin
        1. 8.4.2.1 DT Pin Tied to VCC
        2. 8.4.2.2 DT Pin Connected to a Programming Resistor between DT and GND Pins
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Designing INA/INB Input Filter
        2. 9.2.2.2 Select Dead Time Resistor and Capacitor
        3. 9.2.2.3 Gate Driver Output Resistor
        4. 9.2.2.4 Estimate Gate Driver Power Loss
        5. 9.2.2.5 Estimating Junction Temperature
        6. 9.2.2.6 Selecting VCCI, VDDA/B Capacitor
          1. 9.2.2.6.1 Selecting a VCCI Capacitor
        7. 9.2.2.7 Other Application Example Circuits
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Component Placement Considerations
      2. 11.1.2 Grounding Considerations
      3. 11.1.3 High-Voltage Considerations
      4. 11.1.4 Thermal Considerations
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 相关链接
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 术语表
  13. 13机械、封装和可订购信息
    1. 13.1 Package Option Addendum
      1. 13.1.1 Packaging Information
      2. 13.1.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.12 Typical Characteristics

VDDA = VDDB = 15 V, VCCI = 3.3 V, TA = 25°C, No load. (unless otherwise noted)
UCC21530-Q1 D003_SLUSDC0.gif
Figure 4. Per Channel Current Consumption vs. Frequency (No Load, VDD = 15 V or 25 V)
UCC21530-Q1 D005_SLUSDC0.gif
Figure 6. Per Channel Current Consumption (IVDDA/B) vs. Frequency (10-nF Load, VDD = 15 V or 25 V)
UCC21530-Q1 D006_SLUSDC0.gif
Figure 8. Per Channel (IVDDA/B) Quiescent Supply Current vs Temperature (No Load, Input Low, No Switching)
UCC21530-Q1 RF_LOAD_NU.gif
A.
Figure 10. Rising and Falling Times vs. Load
UCC21530-Q1 PD_T_NU.gif
Figure 12. Propagation Delay vs. Temperature
UCC21530-Q1 PWD.gif
A.
Figure 14. Pulse Width Distortion vs. Temperature
UCC21530-Q1 TDM_TEMP_NU.gif
Figure 16. Propagation Delay Matching (tDM) vs. Temperature
UCC21530-Q1 D014_SLUSCO3.gif
Figure 18. UVLO Threshold vs. Temperature
UCC21530-Q1 D006_SLUSCO3.gif
Figure 20. INA/B Low Threshold
UCC21530-Q1 D004_SLUSCO3.gif
Figure 22. EN Threshold Hysteresis vs. Temperature
UCC21530-Q1 D002_SLUSCO3.gif
Figure 24. EN High Threshold
UCC21530-Q1 DTM_TEMP_NU.gif
Figure 26. Dead Time Matching vs. Temperature (with RDT = 20 kΩ and 100 kΩ)
UCC21530-Q1 D004_SLUSDC0.gif
Figure 5. Per Channel Current Consumption (IVDDA/B) vs. Frequency (1-nF Load, VDD = 15 V or 25 V)
UCC21530-Q1 IVDD_TEMP_5_17.gif
Figure 7. Per Channel (IVDDA/B) Supply Current Vs. Temperature (VDD=15V, No Load, Different Switching Frequencies)
UCC21530-Q1 Iq_IVCCI.gif
A.
Figure 9. IVCCI Quiescent Supply Current vs Temperature (No Load, Input Low, No Switching)
UCC21530-Q1 OUTR_5_17.gif
Figure 11. Output Resistance vs. Temperature
UCC21530-Q1 PDVCC_NUNU.gif
Figure 13. Propagation Delay vs. VCCI
UCC21530-Q1 TDM_VDD_NU.gif
Figure 15. Propagation Delay Matching (tDM) vs. VDD
UCC21530-Q1 D016_SLUSCO3.gif
Figure 17. UVLO Hysteresis vs. Temperature
UCC21530-Q1 D020_SLUSCO3.gif
Figure 19. INA/B Hysteresis vs. Temperature
UCC21530-Q1 D005_SLUSCO3.gif
Figure 21. INA/B High Threshold
UCC21530-Q1 D003_SLUSCO3.gif
Figure 23. EN Low Threshold
UCC21530-Q1 DT_TEMP_NU.gif
Figure 25. Dead Time vs. Temperature (with RDT = 20 kΩ and 100 kΩ)