SLVS346D September   2003  – December 2019 TPS723

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Enable
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Capacitor Selection for Stability
        2. 8.2.1.2 Output Noise
        3. 8.2.1.3 Power-Supply Rejection
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Dissipation
      2. 10.1.2 Thermal Protection
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from C Revision (September 2014) to D Revision

  • Added DRV package to document Go
  • Changed Applications section to link to end equipment Go

Changes from B Revision (July 2007) to C Revision

  • Changed format to meet latest data sheet standards; added new sections, and moved existing sections Go
  • Added bullet item for DDC package to Features list Go
  • Revised Device Information table to include SOT-5 packageGo
  • Updated Typical Application Circuit to show SOT-5 (DDC) package pin configurationGo
  • Added pin configuration drawings Go
  • Deleted Dissipation Ratings table; see Thermal InformationGo
  • Changed y-axis title in Figure 11 to Feedback Current from Supply CurrentGo
  • Reworded second paragraph in Current Limit subsection.Go

Changes from A Revision (June 2007) to B Revision

Changes from * Revision (September 2003) to A Revision

  • Changed document format to correspond to current product line standardsGo
  • Removed Output Voltage vs Output Current graph (original Fig 2) Go