ZHCSO18A december   2022  – june 2023 TPS281C30

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 SNS Timing Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Device Functional Modes
      1. 9.3.1 Working Mode
    4. 9.4 Feature Description
      1. 9.4.1 Accurate Current Sense
        1. 9.4.1.1 High Accuracy Sense Mode
      2. 9.4.2 Programmable Current Limit
        1. 9.4.2.1 Short-Circuit and Overload Protection
        2. 9.4.2.2 Capacitive Charging
      3. 9.4.3 Inductive-Load Switching-Off Clamp
      4. 9.4.4 Inductive Load Demagnetization
      5. 9.4.5 Full Protections and Diagnostics
        1. 9.4.5.1 Open-Load Detection
        2. 9.4.5.2 Thermal Protection Behavior
        3. 9.4.5.3 Undervoltage Lockout (UVLO) Protection
        4. 9.4.5.4 Overvoltage (OVP) Protection
        5. 9.4.5.5 Reverse Polarity Protection
        6. 9.4.5.6 Protection for MCU I/Os
        7. 9.4.5.7 Diagnostic Enable Function
        8. 9.4.5.8 Loss of Ground
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 IEC 61000-4-5 Surge
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Selecting RILIM
        2. 10.2.2.2 Selecting RSNS
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
        1. 10.4.1.1 EMC Considerations
      2. 10.4.2 Layout Example
        1. 10.4.2.1 PWP Layout without a GND Network
        2. 10.4.2.2 PWP Layout with a GND Network
        3. 10.4.2.3 RGW Layout with a GND Network
      3. 10.4.3 Thermal Considerations
  12. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 静电放电警告
    5. 11.5 术语表
  13. 12Mechanical, Packaging, and Orderable Information

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11.4 静电放电警告

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif 静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。