ZHCSI22F October   2017  – December 2021 TPS2662

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Undervoltage Lockout (UVLO)
      2. 9.3.2 Overvoltage Protection (OVP)
      3. 9.3.3 Hot Plug-In and Inrush Current Control
      4. 9.3.4 Reverse Polarity Protection
        1. 9.3.4.1 Input Side Reverse Polarity Protection
        2. 9.3.4.2 Output Side Reverse Polarity Protection
      5. 9.3.5 Overload and Short-Circuit Protection
        1. 9.3.5.1 Overload Protection
        2.       28
        3. 9.3.5.2 Short-Circuit Protection
          1. 9.3.5.2.1 Start-Up With Short-Circuit On Output
      6. 9.3.6 Reverse Current Protection
      7. 9.3.7 FAULT Response
      8. 9.3.8 IN, OUT, RTN, and GND Pins
      9. 9.3.9 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Low Current Shutdown Control (SHDN)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Step-by-Step Design Procedure
        2. 10.2.2.2 Programming the Current Limit Threshold R(ILIM) Selection
        3. 10.2.2.3 Undervoltage Lockout and Overvoltage Set Point
        4. 10.2.2.4 Setting Output Voltage Ramp Time—(tdVdT)
          1. 10.2.2.4.1 Case 1: Start-Up Without Load—Only Output Capacitance C(OUT) Draws Current During Start-Up
          2. 10.2.2.4.2 Case 2: Start-Up With Load —Output Capacitance C(OUT) and Load Draws Current During Start-Up
          3. 10.2.2.4.3 Support Component Selections – R FLT and C(IN)
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
      1. 10.3.1 Field Supply Protection in PLC, DCS I/O Modules
      2. 10.3.2 Simple 24-V Power Supply Path Protection
      3. 10.3.3 Power Stealing in Smart Thermostat
    4. 10.4 Do's and Don'ts
  11. 11Power Supply Recommendations
    1. 11.1 Transient Protection
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

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FAULT Response

The FLT open-drain output asserts (active low) under the following conditions:

  • Fault events such as undervoltage, overvoltage, over load, reverse current and thermal shutdown conditions
  • The device enters low current shutdown mode when SHDN is pulled low
  • During start-up when the internal FET GATE is not fully enhanced
The device is designed to eliminate false reporting by using an internal de-glitch circuit for fault conditions without the need for an external circuitry.

The FLT signal can also be used as a Power Good indicator to the downstream loads like DC/DC converters. An internal Power Good (PGOOD) signal is ORd with the fault logic. During start-up, when the device is operating in dVdT mode, PGOOD and FLT it remains low and is de-asserted after the dVdT mode is completed and the internal FET is fully enhanced. The PGOOD signal has deglitch time incorporated to ensure that internal FET is fully enhanced before heavy load is applied by the downstream converters. Rising deglitch delay is determined by tPGOOD(degl) = Maximum {(750 + 573× C(dVdT)), tPGOODR}, where C(dVdT) is in nF and tPGOOD(degl) is in µs. FLT can be left open or connected to RTN when not used. V(IN) falling below 3.4 V resets FLT.