ZHCS821F February   2012  – October 2021 TPD1E10B06

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—JEDEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision E (June 2021) to Revision F (October 2021)

  • 更新了应用原理图 Go
  • Updated the Description of Pin 1 and pin 2 in the Pin Configuration and Functions sectionGo
  •  Changed HBM spec to per JS-001Go
  • Changed CDM spec to per JESD22-C101 Go
  • Changed HBM spec to Q101-001Go
  • Changed CDM spec to Q101-005 Go
  • Updated the Typical Application Schematic figureGo
  • Changed the system-level ESD protection from: ±20 kV Contact/± 25 kV Air-Gap to: ±8 kV Contact/± 15 kV Air-Gap Go

Changes from Revision D (Novemeber 2015) to Revision E (June 2021)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 添加了 DYA 封装Go
  • 更新了特性 部分Go
  • 更新了应用 部分Go
  • 更新了描述 部分Go
  • Added Thermal information for DYA packageGo
  • Updated the Overview sectionGo
  • Updated the Functional Block Diagram sectionGo
  • Updated the Feature Description sectionGo

Changes from Revision C (April 2015) to Revision D (November 2015)

  • Added  frequency test condition to capacitance specificationGo

Changes from Revision B (October 2012) to Revision C (April 2015)

  • 添加了引脚配置和功能 部分、ESD 等级 表、特性说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go

Changes from Revision A (March 2012) to Revision B (October 2012)

  • Added THERMAL INFORMATION tableGo

Changes from Revision * (February 2011) to Revision A (March 2012)

  • Added graphs to TYPICAL CHARACTERISTICS section.Go
  • Added APPLICATION INFORMATION section.Go