ZHCSKB0 October   2019 TMP63

ADVANCE INFORMATION for pre-production products; subject to change without notice.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      典型实施电路
      2.      典型电阻与环境温度间的关系
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Thermistor Biasing Circuits
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Thermal Protection With Comparator
          2. 8.2.1.2.2 Thermal Foldback
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

THERMAL METRIC (1) TMP63 Units
DEC (X1SON)
2 PINS
RθJA Junction-to-ambient thermal resistance(2)(3) 443.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 195.7 °C/W
RθJB Junction-to-board thermal resistance 254.6 °C/W
ΨJT Junction-to-top characterization parameter 19.9 °C/W
ΨJB Junction-to-board characterization parameter 254.5 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
The junction to ambient thermal resistance (RθJA ) under natural convection is obtained in a simulation on a JEDEC-standard, High-K board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are included in the PCB, per JESD 51-5.
Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.