ZHCSJX8J August   2018  – May 2021 TLV803E , TLV809E , TLV810E

PRODMIX  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Voltage (VDD)
      2. 8.3.2 VDD Hysteresis
      3. 8.3.3 VDD Glitch Immunity
      4. 8.3.4 Manual Reset (MR) Input for X2SON (DPW) Package Only
      5. 8.3.5 Output Logic
        1. 8.3.5.1 RESET Output, Active-Low
        2. 8.3.5.2 RESET Output, Active-High
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation (VDD > VDD(min))
      2. 8.4.2 VDD Between VPOR and VDD(min)
      3. 8.4.3 Below Power-On-Reset (VDD < VPOR)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application - Voltage Rail Monitoring
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application - Overvoltage Monitoring
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision I (Feb 2021) to Revision J (May 2021)

  • Updated Device Naming Nomenclature figure by adding Pinout Indicator (DBZ Package Only) from Pinout Indicator Go
  • Updated pin numbering of Figure 6-5 (X2SON) package and updated Pin Functions TableGo
  • Updated X2SON (DPW) Layout ExampleGo

Changes from Revision H (December 2020) to Revision I (February 2021)

  • Remove duplicate package.Go

Changes from Revision G (October 2020) to Revision H (December 2020)

  • Added Reset time delay variant F specificationGo

Changes from Revision F (June 2020) to Revision G (October 2020)

  • 更新了整个文档中的表格、图和交叉参考的编号格式。Go
  • 添加了附加阈值电压 (VIT-) 和新封装的信息Go
  • Updated Device Naming Nomenclature figure to include (DBZ) V pinout option Go
  • Added new (DBZ) package option (Pin 3 = GND, V pinout) and updated Pin Functions TableGo
  • Added layout example for (DBZ) V pinout packageGo
  • Modified Device Naming Convention table to include additional threshold voltages (VIT-), reset time delay options and pinout indicator optionsGo

Changes from Revision E (April 2020) to Revision F (June 2020)

  • 将 DPW 封装从“预告信息”更改为“量产数据”Go
  • Changed DPW package Information Go

Changes from Revision D (February 2020) to Revision E (April 2020)

  • Added X2SON (DPW) package option Go

Changes from Revision C (November 2019) to Revision D (February 2020)

  • Added device nomenclature figure Go
  • Added timing diagram for TLV810E Go
  • Added Figure 6, Figure 23, Figure 24 Go
  • Added typical application for TLV810E Go

Changes from Revision B (July 2019) to Revision C (November 2019)

  • 将器件状态从“预告信息”更改为“量产数据”Go

Changes from Revision A (June 2019) to Revision B (July 2019)

  • 更新了预告信息数据表Go

Changes from Revision * (August 2018) to Revision A (June 2019)