SBVS148D October   2010  – January 2015 TLV704

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Regulator Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation and Junction Temperature
    4. 10.4 Estimating Junction Temperature
    5. 10.5 Package Mounting
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBV|5
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from C Revision (August, 2011) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed fourth bullet in Features list Go
  • Changed Applications list Go
  • Changed front-page figure; removed pinoutGo
  • Changed Pin Configuration and Functions section; updated table format, renamed pin package to meet new standards Go
  • Changed "free-air" to "junction" temperature in condition statement for Absolute Maximum RatingsGo
  • Changed "free-air" to "junction" temperature in condition statement for Recommended Operating ConditionsGo
  • Deleted Power Dissipation Rating tableGo
  • Changed "TA" to "TJ" in condition statement for Electrical CharacteristicsGo
  • Changed parametric symbol for line regulation Go
  • Changed parametric symbol for load regulation Go

Changes from B Revision (November, 2010) to C Revision

  • Revised document to reflect PK package option removalGo
  • Removed SOT89 (PK) package from front-page figureGo
  • Deleted PK package information from Pin Functions table Go
  • Revised Thermal Information table and Power Dissipation Rating table Go
  • Added load regulation specifications for VOUT ≥ 3.3 VGo
  • Removed Figure 15 and Figure 16Go

Changes from A Revision (October, 2010) to B Revision

  • Updated document to reflect availability of PK package optionGo
  • Corrected typo in front-page figureGo
  • Changed Pin Functions table to correct pin numbering for PK package optionGo
  • Revised Typical Characteristics section; added and removed graphsGo
  • Updated format of Application Information sectionGo