SBVS148D October   2010  – January 2015 TLV704

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Regulator Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation and Junction Temperature
    4. 10.4 Estimating Junction Temperature
    5. 10.5 Package Mounting
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TLV704 family of LDOs are designed for power-sensitive applications and feature low quiescent current. These devices pair well with low-power microcontrollers, such as the MSP430.

8.2 Typical Application

fbd_front_bvs148.gifFigure 15. Typical Application

8.2.1 Design Requirements

Select the desired device based on the output voltage.

Provide an input supply with adequate headroom to account for dropout and output current to account for the GND terminal current, and power the load.

8.2.2 Detailed Design Procedure

8.2.2.1 Input and Output Capacitor Requirements

The TLV704 requires a 1-µF or larger capacitor connected between OUT and GND for stability. Ceramic or tantalum capacitors can be used. Larger value capacitors result in better transient and noise performance.

Although an input capacitor is not required for stability, when a 0.1-µF or larger capacitor is placed between IN and GND, it counteracts reactive input sources and improves transient and noise performance. Higher value capacitors are necessary if large, fast rise time load transients are anticipated.

8.2.3 Application Curves

tc_psrr_fqcy_bvs148.gif
Figure 16. Power-Supply Ripple Rejection vs Frequency
tc_pupd_bvs148.gif
Figure 17. Power Up/Power Down