ZHCSH94F October   2017  – May 2022 TLIN1029-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. 说明(续)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings - IEC
    4. 7.4 Thermal Information
    5. 7.5 Recommended Operating Conditions
    6. 7.6 Electrical Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Requirements
    9. 7.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  LIN (Local Interconnect Network) Bus
        1. 9.3.1.1 LIN Transmitter Characteristics
        2. 9.3.1.2 LIN Receiver Characteristics
          1. 9.3.1.2.1 Termination
      2. 9.3.2  TXD (Transmit Input and Output)
      3. 9.3.3  RXD (Receive Output)
      4. 9.3.4  VSUP (Supply Voltage)
      5. 9.3.5  GND (Ground)
      6. 9.3.6  EN (Enable Input)
      7. 9.3.7  Protection Features
      8. 9.3.8  TXD Dominant Time Out (DTO)
      9. 9.3.9  Bus Stuck Dominant System Fault: False Wake-Up Lockout
      10. 9.3.10 Thermal Shutdown
      11. 9.3.11 Under Voltage on VSUP
      12. 9.3.12 Unpowered Device and LIN Bus
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Sleep Mode
      3. 9.4.3 Standby Mode
      4. 9.4.4 Wake-Up Events
        1. 9.4.4.1 Wake-Up Request (RXD)
        2. 9.4.4.2 Mode Transitions
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 Normal Mode Application Note
        2. 10.2.2.2 Standby Mode Application Note
          1. 10.2.2.2.1 TXD Dominant State Timeout Application Note
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision E (May 2020) to Revision F (May 2022)

  • 将提到的所有旧术语实例更改为“指挥官”和“响应者”。Go

Changes from Revision D (March 2020) to Revision E (May 2020)

  • 添加了:(参阅 SLLA490),位于特性 列表Go
  • Added : See errata TLIN1029-Q1 and TLIN2029-Q1 Duty Cycle Over VSUP Go

Changes from Revision C (July 2019) to Revision D (March 2020)

  • 将 200pF 电容器更改为:220pF,在简化原理图,指挥官模式Go
  • 将 200pF 电容器更改为:220pF,在简化原理图,响应者模式Go
  • Changed VLIN from MIN = –58, MAX = 58 To: MIN = –60, MAX = 60 in the Absolute Maximum RatingsGo
  • Changed CLINPIN from MAX = 45 pF To: MAX = 25 pF and added VSUP = 14 V for Test Condition in Electrical Characteristics Go
  • Changed text From: "... a 200 pF capacitor" To: "... a 220 pF capacitor" For Pin 6 (LIN) in the Layout Guidelines Go

Changes from Revision B (February 2018) to Revision C (July 2019)

  • 将 SOIC 封装尺寸从:4.90mm x 6.00mm 更改为4.90mm x 3.91mm,在器件信息Go
  • 将 220pF 电容器更改为:200pF,在简化原理图,指挥官模式Go
  • 将 220pF 电容器更改为:200pF,在简化原理图,响应者模式Go
  • Changed VLOGIC absolute maximum rating MAX from 5.5 V to 6 VGo
  • Changed the title of Figure 10-2 To: Recessive to Dominant PropagationGo
  • Changed the title of Figure 10-3 To: Dominant to Recessive PropagationGo
  • Changed text From: "... a 220 pF capacitor" To: "... a 200 pF capacitor" For Pin 6 (LIN) in the Layout Guidelines Go

Changes from Revision A (December 2017) to Revision B (February 2018)

  • 在整个数据表中将“特性”和“说明”中的“投诉 LIN 2.0...”更改为“符合 LIN 2.0...”Go
  • Changed From: "complaint to LIN 2.0..." To: "compliant to LIN 2.0..." in the Overview sectionGo

Changes from Revision * (October 2017) to Revision A (December 2017)

  • 将器件状态从预告信息 更改为量产数据 Go