SCAS293M January   1993  – June 2026 SN74LVC240A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   5
  6.   6
  7. 4 Pin Configuration and Functions
  8. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, –40°C to 85°C
    7. 5.7 Switching Characteristics, –40°C to 125°C
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  9. 6 Parameter Measurement Information
  10. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 Partial Power Down (Ioff)
      3. 7.3.3 Standard CMOS Inputs
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  11. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  12. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  13.   49
  14. 10Revision History
  15. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DGV|20
  • DB|20
  • NS|20
  • DW|20
  • PW|20
  • DGS|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

PACKAGE PINS THERMAL METRIC(1) UNIT
RθJA RθJC(top) RθJB ΨJT ΨJB RθJC(bot)
PW (TSSOP) 20 120.3 62.5 82.4 16.0 81.5 N/A °C/W
DGS (VSSOP) 20 129.9 72.4 86.1 18.6 85.8 N/A °C/W
RKS (VQFN) 20 87.2 93.4 59.8 24.9 59.6 44.3 °C/W
DB (SSOP) 20 121.7 86.8 87.8 44.7 87.0 N/A °C/W
DW (SOIC) 20 114.8 84.1 88.8 55.8 87.8 N/A °C/W
NS (SOP) 20 116.3 82.4 86.2 43.9 85.5 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.