SCAS339S March   1994  – February 2017 SN74LVC126A

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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Specifications

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage, VCC –0.5 6.5 V
Input voltage, VI(2) –0.5 6.5 V
Output voltage, VO(2)(3) –0.5 VCC + 0.5 V
Input clamp current, IIK VI < 0 –50 mA
Output clamp current, IOK VO < 0 –50 mA
Continuous output current, IO ±50 mA
Continuous current through VCC or GND ±100 mA
Power dissipation, Ptot TA = –40°C to +125°C(4)(5) 500 mW
Maximum junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in Recommended Operating Conditions.
For the D package: above 70°C, the value of Ptot derates linearly with 8 mW/K.
For the DB, NS, and PW packages: above 60°C, the value of Ptot derates linearly with 5.5 mW/K.

ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. This rating was tested on the D (SOIC) package.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. This rating was tested on the D (SOIC) package.

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN NOM MAX UNIT
VCC Supply voltage Operating 1.65 3.6 V
Data retention only 1.5
VIH High-level input voltage VCC = 1.65 V to 1.95 V 0.65 × VCC V
VCC = 2.3 V to 2.7 V 1.7
VCC = 2.7 V to 3.6 V 2
VIL Low-level input voltage VCC = 1.65 V to 1.95 V 0.35 × VCC V
VCC = 2.3 V to 2.7 V 0.7
VCC = 2.7 V to 3.6 V 0.8
VI Input voltage 0 5.5 V
VO Output voltage 0 VCC V
IOH High-level output current VCC = 1.65 V –4 mA
VCC = 2.3 V –8
VCC = 2.7 V –12
VCC = 3 V –24
IOL Low-level output current VCC = 1.65 V 4 mA
VCC = 2.3 V 8
VCC = 2.7 V 12
VCC = 3 V 24
Δt/Δv Input transition rise or fall rate 10 ns/V
TA Operating free-air temperature –40 125 °C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs.

Thermal Information

THERMAL METRIC(1) SN74LVC126A UNIT
D (SOIC) DB (SSOP) DGV (TVSOP) NS (SOP) PW (TSSOP) RGY (VQFN)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 98.4(2) 112.2(2) 140.9(2) 93.9(2) 127.7(2) 35(3) °C/W
RθJC(top) Junction-to-case (top) thermal resistance 58.2 64.2 59.9 51.7 56 43.6 °C/W
RθJB Junction-to-board thermal resistance 52.6 59.6 70.2 52.7 69.5 11.6 °C/W
ψJT Junction-to-top characterization parameter 24.1 28.3 9.1 20.7 8.9 0.4 °C/W
ψJB Junction-to-board characterization parameter 52.4 59.1 69.5 52.3 68.9 11.8 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
The package thermal impedance is calculated in accordance with JESD 51-7.
The package ther mal impedance is calculated in accordance with JESD 51-5.

Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH IOH = –100 µA, VCC = 1.65 V to 3.6 V TA = 25°C VCC – 0.2 V
TA = –40°C to +125°C VCC – 0.3
IOH = –4 mA, VCC = 1.65 V TA = 25°C 1.29
TA = –40°C to +85°C 1.2
TA = –40°C to +125°C 1.05
IOH = –8 mA, VCC = 2.3 V TA = 25°C 1.9
TA = –40°C to +85°C 1.7
TA = –40°C to +125°C 1.55
IOH = –12 mA VCC = 2.7 V TA = 25°C 2.2
TA = –40°C to +125°C 2.05
VCC = 3 V TA = 25°C 2.4
TA = –40°C to +125°C 2.25
IOH = –24 mA, VCC = 3 V TA = 25°C 2.3
TA = –40°C to +85°C 2.2
TA = –40°C to +125°C 2
VOL IOL = 100 µA, VCC = 1.65 V to 3.6 V TA = 25°C 0.1 V
TA = –40°C to +85°C 0.2
TA = –40°C to +125°C 0.3
IOL = 4 mA, VCC = 1.65 V TA = 25°C 0.24
TA = –40°C to +85°C 0.45
TA = –40°C to +125°C 0.6
IOL = 8 mA, VCC = 2.3 V TA = 25°C 0.3
TA = –40°C to +85°C 0.7
TA = –40°C to +125°C 0.75
IOL = 12 mA, VCC = 2.7 V TA = 25°C 0.4
TA = –40°C to +125°C 0.6
IOL = 24 mA, VCC = 3 V TA = 25°C 0.55
TA = –40°C to +125°C 0.8
II VI = 5.5 V or GND, VCC = 3.6 V TA = 25°C ±1 µA
TA = –40°C to +85°C ±5
TA = –40°C to +125°C ±20
IOZ VO = VCC or GND, VCC = 3.6 V TA = 25°C ±1 µA
TA = –40°C to +85°C ±10
TA = –40°C to +125°C ±20
ICC VI = VCC or GND, IO = 0, VCC = 3.6 V TA = 25°C 1 µA
TA = –40°C to +85°C 10
TA = –40°C to +125°C 40
ΔICC One input at VCC  – 0.6 V, other inputs at VCC or GND, VCC = 2.7 V to 3.6 V TA = 25°C 500 µA
TA = –40°C to +125°C 5000
Ci VI = VCC or GND, VCC = 3.3 V 4.5 pF
Co VO = VCC or GND, VCC = 3.3 V 7 pF
Cpd Power dissipation capacitance per gate f = 10 MHz, TA = 25°C Outputs enabled VCC = 1.8 V 20 pF
VCC = 2.5 V 21
VCC = 3.3 V 22
Outputs disabled VCC = 1.8 V 2
VCC = 2.5 V 3
VCC = 3.3 V 4

Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted; see Parameter Measurement Information)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tpd From A (input) to Y (output) VCC = 1.8 V ± 0.15 V TA = 25°C 1 4.2 9.3 ns
TA = –40°C to +85°C 9.8
TA = –40°C to +125°C 11.3
VCC = 2.5 V ± 0.2 V TA = 25°C 1 2.7 6.7
TA = –40°C to +85°C 7.2
TA = –40°C to +125°C 9.3
VCC = 2.7 V TA = 25°C 1 2.9 5
TA = –40°C to +85°C 5.2
TA = –40°C to +125°C 6.5
VCC = 3.3 V ± 0.3 V TA = 25°C 1 2.5 4.5
TA = –40°C to +85°C 4.7
TA = –40°C to +125°C 6
ten From OE (input) to Y (output) VCC = 1.8 V ± 0.15 V TA = 25°C 1 4.8 9.5 ns
TA = –40°C to +85°C 10
TA = –40°C to +125°C 11.5
VCC = 2.5 V ± 0.2 V TA = 25°C 1 2.8 7.8
TA = –40°C to +85°C 8.3
TA = –40°C to +125°C 10.4
VCC = 2.7 V TA = 25°C 1 3.1 6.1
TA = –40°C to +85°C 6.3
TA = –40°C to +125°C 8
VCC = 3.3 V ± 0.3 V TA = 25°C 1 2.5 5.5
TA = –40°C to +85°C 5.7
TA = –40°C to +125°C 7.5
tdis From OE (input) to Y (output) VCC = 1.8 V ± 0.15 V TA = 25°C 1 4.4 12.1 ns
TA = –40°C to +85°C 12.6
TA = –40°C to +125°C 14.1
VCC = 2.5 V ± 0.2 V TA = 25°C 1 2.7 8.2
TA = –40°C to +85°C 8.7
TA = –40°C to +125°C 10.8
VCC = 2.7 V TA = 25°C 1 2.7 6.5
TA = –40°C to +85°C 6.7
TA = –40°C to +125°C 8.5
VCC = 3.3 V ± 0.3 V TA = 25°C 1.3 2.3 5.8
TA = –40°C to +85°C 6
TA = –40°C to +125°C 7.5
tsk(o) VCC = 3.3 V ± 0.3 V TA = –40°C to +85°C 1 ns
TA = –40°C to +125°C 1.5

Typical Characteristics

TA = 25°C
SN74LVC126A lvc126a_tpd_vcc.png Figure 1. TPD vs VCC