ZHCSP28B July   2021  – October 2022 SN74HCS244

PRODMIX  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS 3-State Outputs
      2. 8.3.2 Balanced CMOS Push-Pull Outputs
      3. 8.3.3 Open-Drain CMOS Outputs
      4. 8.3.4 CMOS Schmitt-Trigger Inputs
      5. 8.3.5 TTL 兼容型 CMOS 输入
      6. 8.3.6 Standard CMOS Inputs
      7. 8.3.7 Clamp Diode Structure
      8. 8.3.8 Wettable Flanks
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

GUID-20210730-SS0I-6FGJ-V3VL-1HLPZRRWNCKT-low.gifFigure 5-1 RKS Package,
20-Pin VQFN
(Top View)
GUID-20200716-CA0I-S9LS-XJSH-FGFWDBZDT97R-low.gifFigure 5-2 DGS Package,
20-Pin SOT
(Top View)
Table 5-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAME NO.
1OE1IBank 1, output enable, active low
1A12IBank 1, channel 1 input
2Y43OBank 2, channel 4 output
1A24IBank 1, channel 2 input
2Y35OBank 2, channel 3 output
1A36IBank 1, channel 3 input
2Y27OBank 2, channel 2 output
1A48IBank 1, channel 4 input
2Y19OBank 2, channel 1 output
GND10

G

Ground
2A111IBank 2, channel 1 input
1Y412OBank 1, channel 4 output
2A213IBank 2, channel 2 input
1Y314OBank 1, channel 3 output
2A315IBank 2, channel 3 input
1Y216OBank 1, channel 2 output
2A417IBank 2, channel 4 input
1Y118OBank 1, channel 1 output
2OE19IBank 2, output enable, active low
VCC20

P

Positive supply
Thermal pad(2)—The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
(2) RKS package only.