ZHCSES3C March   2016  – August 2019 SN65DPHY440SS , SN75DPHY440SS

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
      2.      典型应用
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics, Power Supply
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 HS Receive Equalization
      2. 7.3.2 HS TX Edge Rate Control
      3. 7.3.3 TX Voltage Swing and Pre-Emphasis Control
      4. 7.3.4 Dynamic De-skew
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 LP Mode
      3. 7.4.3 ULPS Mode
      4. 7.4.4 HS Mode
    5. 7.5 Register Maps
      1. 7.5.1  BIT Access Tag Conventions
      2. 7.5.2  Standard CSR Registers (address = 0x000 - 0x07)
        1. Table 6. Standard CSR Registers (0x000 - 0x07)
      3. 7.5.3  Standard CSR Register (address = 0x08)
        1. Table 7. Standard CSR Register (0x08)
      4. 7.5.4  Standard CSR Register (address = 0x09)
        1. Table 8. Standard CSR Register (0x09)
      5. 7.5.5  Standard CSR Register (address = 0x0A)
        1. Table 9. Standard CSR Register (0x0A)
      6. 7.5.6  Standard CSR Register (address = 0x0B)
        1. Table 10. Standard CSR Register (0x0B)
      7. 7.5.7  Standard CSR Register (address = 0x0D)
        1. Table 11. Standard CSR Register (0x0D)
      8. 7.5.8  Standard CSR Register (address = 0x0E)
        1. Table 12. Standard CSR Register (0x0E)
      9. 7.5.9  Standard CSR Register (address = 0x10) [reset = 0xFF]
        1. Table 13. Standard CSR Register (0x10)
      10. 7.5.10 Standard CSR Register (address = 0x11) [reset = 0xFF]
        1. Table 14. Standard CSR Register (0x11)
  8. 8 Application and Implementation
    1. 8.1 Application Information,
    2. 8.2 Typical Application, CSI-2 Implementations
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Reset Implementation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 相关链接
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from B Revision (August 2017) to C Revision

  • Changed F(BR) MAX value From: 1 Gbps To: 1.5 Gbps in the Switching Characteristics tableGo

Changes from A Revision (April 2016) to B Revision

  • 将特性 从“CSI-2/DSI 时钟频率范围为 100MHz 至 500MHz”更改为“CSI-2/DSI 时钟频率范围为 100MHz 至 750MHz”Go
  • 更改了说明 部分的文本，将“高达 1Gbps 的数据速率下的 MIPI DSI 应用。” 更改为“高达 1.5Gbps 的数据速率下的 MIPI DSI 应用。”Go
  • Changed VIH = 4 dB To: VIH = 5 dB in the Pin Functions tableGo
  • Added a Test Condition of EQ is at 750 MHz to V(RXEQ1) n the Electrical Characteristics tableGo
  • Changed V(RXEQ2) TYP value From: 4 dB To: 5 dB in the Electrical Characteristics table Go
  • Changed the MIPI DPHY HS Interface section in the Timing Requirements tableGo
  • Changed F(HSCLK) From 500 µsMHz To: 750 MHz in the Switching Characteristics tableGo
  • Changed F(DESKEW) from 500 MHz To: 750 MHz. Go
  • Changed tR and tF Datarate Test Conditions and values Go
  • Changed text From: application at datarates of up to 1 Gbps To: application at datarates of up to 1.5 Gbps in the Overview sectionGo
  • Changed Table 1Go
  • Changed 11 – 4 dB To: 11 – 5 dB for RXEQ_CLK in Table 8Go
  • Changed 11 – 4 dB To: 11 – 5 dB for RXEQ_DATA in Table 8Go
  • Changed From: Data Rate To: Data Rate (200 Mbps to 1.5 Gbps) in Table 15Go

Changes from * Revision (March 2016) to A Revision

  • 将特性从“具有 3kV ESD HBM 保护功能”更改为“具有 2kV ESD HBM 保护功能”Go
  • Changed From: (approx. 100K) To: (100K) in the Pin Functions table for pins 13 and 14Go
  • Changed From: (approx. 100K) To: (100K) in the Pin Functions table for pins 26, 27, and 28Go
  • Changed ESD Ratings values. HBM From: ±2000 To: ±3000, and CDM Form: ±500 To: ±1000 Go
  • Changed V(RXEQ2) TYP value From: 5 dB To: 4 dB in the Electrical Characteristics table Go
  • Added MIN and MAX values to |VOD(VD0)|, |VOD(VD1)|, and |VOD(VD2)| in the Electrical Characteristics tableGo
  • Deleted rows ZOS and ΔZOS from the Electrical Characteristics tableGo
  • Updated the MIPI DPHY LP Transmitter Interface section of the Switching Characteristics tableGo
  • Changed 5 dB to 4 dB in HS Receive Equalization and Table 1Go
  • Changed 11 – 4 dB To: 11 – 5 dB in Table 8Go