SN6501-Q1 数据表 | 德州仪器 TI.com.cn

ZHCSB64A June 2013 – September 2014 SN6501-Q1

PRODUCTION DATA.

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DBV|5
- MPDS018P

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

		MIN	MAX	UNIT
V_CC	Supply voltage	–0.3	6	V
V_D1, V_D2	Output switch voltage		14	V
I_D1P, I_D2P	Peak output switch current		500	mA
P_TOT	Continuous power dissipation		250	mW
T_J	Junction temperature		170	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods affects device reliability.

6.2 Handling Ratings

			MIN	MAX	UNIT
T_stg	Storage temperature range		–65	150	°C
V_(ESD)	Electrostatic discharge	Human body model (HBM) AEC-Q100 Classification Level H2, all pins	–2	2	kV
V_(ESD)	Electrostatic discharge	Charged device model (CDM) AEC-Q100 Classification Level C4B, all pins	–750	750	V

6.3 Recommended Operating Conditions

				MIN	MAX	UNIT
V_CC	Supply voltage			3	5.5	V
V_D1, V_D2	Output switch voltage	V_CC = 5 V ± 10%,	When connected to Transformer with primary winding Center-tapped	0	11	V
V_D1, V_D2	Output switch voltage	V_CC = 3.3 V ± 10%		0	7.2	V
I_D1, I_D2	D1 and D2 output switch current – Primary-side	V_CC = 5 V ± 10%	V_D1, V_D2 Swing ≥ 3.8 V, see Figure 32 for typical characteristics		350	mA
I_D1, I_D2	D1 and D2 output switch current – Primary-side	V_CC = 3.3 V ± 10%	V_D1, V_D2 Swing ≥ 2.5 V, see Figure 31 for typical characteristics		150	mA
T_A	Ambient temperature			–40	125	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN6501	UNIT
THERMAL METRIC⁽¹⁾		DBV 5-PINS	UNIT
θ_JA	Junction-to-ambient thermal resistance	208.3	°C/W
θ_JCtop	Junction-to-case (top) thermal resistance	87.1
θ_JB	Junction-to-board thermal resistance	40.4
ψ_JT	Junction-to-top characterization parameter	5.2
ψ_JB	Junction-to-board characterization parameter	39.7
θ_JCbot	Junction-to-case (bottom) thermal resistance	N/A

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over full-range of recommended operating conditions, unless otherwise noted

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
R_ON	Switch-on resistance	V_CC = 3.3 V ± 10%, See Figure 36		1	3	Ω
R_ON	Switch-on resistance	V_CC = 5 V ± 10%, See Figure 36		0.6	2	Ω
I_CC	Average supply current⁽¹⁾	V_CC = 3.3 V ± 10%, no load		150	400	µA
I_CC	Average supply current⁽¹⁾	V_CC = 5 V ± 10%, no load		300	700	µA
f_ST	Startup frequency	V_CC = 2.4 V, See Figure 36		300		kHz
f_SW	D1, D2 Switching frequency	V_CC = 3.3 V ± 10%, See Figure 36	250	360	495	kHz
f_SW	D1, D2 Switching frequency	V_CC = 5 V ± 10%, See Figure 36	300	410	620	kHz

(1) Average supply current is the current used by SN6501 only. It does not include load current.

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER		TEST CONDITIONS	TYP	UNIT
t_r-D	D1, D2 output rise time	V_CC = 3.3 V ± 10%, See Figure 36	70	ns
t_r-D	D1, D2 output rise time	V_CC = 5 V ± 10%, See Figure 36	80	ns
t_f-D	D1, D2 output fall time	V_CC = 3.3 V ± 10%, See Figure 36	110	ns
t_f-D	D1, D2 output fall time	V_CC = 5 V ± 10%, See Figure 36	60	ns
t_BBM	Break-before-make time	V_CC = 3.3 V ± 10%, See Figure 36	150	ns
t_BBM	Break-before-make time	V_CC = 5 V ± 10%, See Figure 36	50	ns

6.7 Typical Characteristics

TP1 Curves are measured with the Circuit in Figure 33; whereas, TP1 and TP2 Curves are measured with Circuit in Figure 35 (T_A = 25°C unless otherwise noted). See Table 3 for Transformer Specifications.