ZHCSIQ4B September 2018 – December 2018 OPA828
The OPA828 is protected from thermal overloads due to an internal thermal shutdown feature. The shutdown design assures thermal protection when operated in demanding, high-temperature industrial environments. The device accurately measures the die junction temperature at the hottest spot on the die. As the junction temperature reaches the thermal shutdown temperature the device is disabled by placing the output into a high impedance state — this prevents further power dissipation by the OPA828 and allows the OPA828 to begin cooling. Once the junction temperature reduces by the thermal hysteresis amount, the OPA828 resumes normal operation. If the output condition that caused the OPA828 to heat up is still present the device may enter thermal shutdown again. The OPA828 quiescent current during shutdown reduces to approximately 20 µA. Identify the cause of any thermal shutdown, and correct for normal device operation. Thermal shutdown occurs when the OPA828 junction temperature exceeds approximately 165°C. Once in thermal shutdown, the OPA828 returns to normal operation when the junction temperature cools to approximately 145°C.