ZHCSIQ4B September   2018  – December 2018 OPA828

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      开环增益和相位与频率间的关系
      2.      失调电压漂移
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Operating Characteristics
      2. 7.3.2  Phase-Reversal Protection
      3. 7.3.3  Electrical Overstress
      4. 7.3.4  MUX Friendly Inputs
      5. 7.3.5  Overload Power Limiter
      6. 7.3.6  Capacitive Load and Stability
      7. 7.3.7  Capacitive Load and Stability
      8. 7.3.8  Settling Time
      9. 7.3.9  Slew Rate
      10. 7.3.10 Full Power Bandwidth
      11. 7.3.11 Small Signal Response
      12. 7.3.12 Thermal Considerations
      13. 7.3.13 Thermal Shutdown
      14. 7.3.14 Low Noise
      15. 7.3.15 Low Offset Voltage Drift
      16. 7.3.16 Overload Recovery
    4. 7.4 Device Functional Modes
      1. 7.4.1 Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application: SAR ADC Driver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application: Low-Pass Filter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Shutdown

The OPA828 is protected from thermal overloads due to an internal thermal shutdown feature. The shutdown design assures thermal protection when operated in demanding, high-temperature industrial environments. The device accurately measures the die junction temperature at the hottest spot on the die. As the junction temperature reaches the thermal shutdown temperature the device is disabled by placing the output into a high impedance state — this prevents further power dissipation by the OPA828 and allows the OPA828 to begin cooling. Once the junction temperature reduces by the thermal hysteresis amount, the OPA828 resumes normal operation. If the output condition that caused the OPA828 to heat up is still present the device may enter thermal shutdown again. The OPA828 quiescent current during shutdown reduces to approximately 20 µA. Identify the cause of any thermal shutdown, and correct for normal device operation. Thermal shutdown occurs when the OPA828 junction temperature exceeds approximately 165°C. Once in thermal shutdown, the OPA828 returns to normal operation when the junction temperature cools to approximately 145°C.