ZHCSIQ4B September   2018  – December 2018 OPA828

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      开环增益和相位与频率间的关系
      2.      失调电压漂移
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Operating Characteristics
      2. 7.3.2  Phase-Reversal Protection
      3. 7.3.3  Electrical Overstress
      4. 7.3.4  MUX Friendly Inputs
      5. 7.3.5  Overload Power Limiter
      6. 7.3.6  Capacitive Load and Stability
      7. 7.3.7  Capacitive Load and Stability
      8. 7.3.8  Settling Time
      9. 7.3.9  Slew Rate
      10. 7.3.10 Full Power Bandwidth
      11. 7.3.11 Small Signal Response
      12. 7.3.12 Thermal Considerations
      13. 7.3.13 Thermal Shutdown
      14. 7.3.14 Low Noise
      15. 7.3.15 Low Offset Voltage Drift
      16. 7.3.16 Overload Recovery
    4. 7.4 Device Functional Modes
      1. 7.4.1 Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application: SAR ADC Driver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application: Low-Pass Filter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Considerations

Through normal operation the OPA828 experiences self-heating, a natural increase in the die junction temperature which occurs in every amplifier. This is a result of several factors including the quiescent power consumption, the package’s thermal resistance, PCB layout and the device operating conditions.

To fully ensure the amplifier will operate without entering thermal shutdown it is important to calculate the approximate junction (die) temperature which can be done using Equation 4.

Equation 4. OPA828 Eq1-JunctionTemp.gif

Equation 5 shows the approximate junction temperature for the OPA828 while unloaded with an ambient temperature of 25°C.

Equation 5. OPA828 Eq1-JunctionTemp-Calc.gif

For high voltage, high precision amplifiers such as the OPA828 the junction temperature can easily be 10s of degrees higher than the ambient temperature in a quiescent (unloaded) condition. If the device then begins to drive a heavy load the junction temperature may rise and trip the thermal shutdown circuit. The Figure 54 shows the maximum output voltage of the OPA828 without entering thermal shutdown vs ambient temperature in both a loaded and unloaded condition.

OPA828 Thermal SOA.gifFigure 54. OPA828 Thermal Safe Operating Area