ZHCSHI9B December   2017  – June 2019 MSP432P4011T , MSP432P401VT , MSP432P401YT , MSP432P4111T , MSP432P411VT , MSP432P411YT

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram for MSP432P411xT Devices
    2. 4.2 Pin Diagram for MSP432P401xT Devices
    3. 4.3 Pin Attributes
    4. 4.4 Signal Descriptions
      1. Table 4-3 Signal Descriptions
    5. 4.5 Pin Multiplexing
    6. 4.6 Buffer Types
    7. 4.7 Connections for Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Recommended External Components
    5. 5.5  Operating Mode VCC Ranges
    6. 5.6  Operating Mode CPU Frequency Ranges
    7. 5.7  Operating Mode Peripheral Frequency Ranges
    8. 5.8  Operating Mode Execution Frequency and Flash Wait-State Requirements
    9. 5.9  Current Consumption During Device Reset of the 100-Pin LQFP Package
    10. 5.10 Current Consumption in LDO-Based Active Modes – Dhrystone 2.1 Program
    11. 5.11 Current Consumption in DC/DC-Based Active Modes – Dhrystone 2.1 Program
    12. 5.12 Current Consumption in Low-Frequency Active Modes – Dhrystone 2.1 Program
    13. 5.13 Typical Characteristics of Active Mode Currents for CoreMark Program
    14. 5.14 Typical Characteristics of Active Mode Currents for Prime Number Program
    15. 5.15 Typical Characteristics of Active Mode Currents for Fibonacci Program
    16. 5.16 Typical Characteristics of Active Mode Currents for While(1) Program
    17. 5.17 Typical Characteristics of Low-Frequency Active Mode Currents for CoreMark Program
    18. 5.18 Current Consumption in LDO-Based LPM0 Modes
    19. 5.19 Current Consumption in DC/DC-Based LPM0 Modes
    20. 5.20 Current Consumption in Low-Frequency LPM0 Modes
    21. 5.21 Current Consumption in LPM3, LPM4 Modes
    22. 5.22 Current Consumption in LPM3 Modes With LCD
    23. 5.23 Current Consumption in LPM3.5, LPM4.5 Modes
    24. 5.24 Current Consumption of Digital Peripherals
    25. 5.25 Thermal Resistance Characteristics
    26. 5.26 Timing and Switching Characteristics
      1. 5.26.1  Reset Timing
        1. Table 5-1 Reset Recovery Latencies
        2. Table 5-2 External Reset Recovery Latencies
      2. 5.26.2  Peripheral Register Access Timing
        1. Table 5-3 Peripheral Register Access Latency
      3. 5.26.3  Mode Transition Timing
        1. Table 5-4 Active Mode Transition Latencies
        2. Table 5-5 LPM0 Mode Transition Latencies
        3. Table 5-6 LPM3, LPM4 Mode Transition Latencies
        4. Table 5-7 LPM3.5, LPM4.5 Mode Transition Latencies
      4. 5.26.4  Clock Specifications
        1. Table 5-8  Low-Frequency Crystal Oscillator, LFXT, Recommended Operating Conditions
        2. Table 5-9  Low-Frequency Crystal Oscillator, LFXT
        3. Table 5-10 High-Frequency Crystal Oscillator, HFXT, Recommended Operating Conditions
        4. Table 5-11 High-Frequency Crystal Oscillator, HFXT
        5. Table 5-12 DCO
        6. Table 5-13 DCO Overall Tolerance
        7. Table 5-14 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        8. Table 5-15 Internal-Reference Low-Frequency Oscillator (REFO) – 32.768-kHz Mode
        9. Table 5-16 Internal-Reference Low-Frequency Oscillator (REFO) – 128-kHz Mode
        10. Table 5-17 Module Oscillator (MODOSC)
        11. Table 5-18 System Oscillator (SYSOSC)
      5. 5.26.5  Power Supply System
        1. Table 5-19 VCORE Regulator (LDO) Characteristics
        2. Table 5-20 VCORE Regulator (DC/DC) Characteristics
        3. Table 5-21 PSS, VCCDET
        4. Table 5-22 PSS, SVSMH
      6. 5.26.6  Digital I/Os
        1. Table 5-23 Digital Inputs (Applies to Both Normal and High-Drive I/Os)
        2. Table 5-24 Digital Outputs, Normal I/Os
        3. Table 5-25 Digital Outputs, High-Drive I/Os
        4. Table 5-26 Pin-Oscillator Frequency, Ports Px
        5. 5.26.6.1   Typical Characteristics, Normal-Drive I/O Outputs at 3.0 V and 2.2 V
        6. 5.26.6.2   Typical Characteristics, High-Drive I/O Outputs at 3.0 V and 2.2 V
        7. 5.26.6.3   Typical Characteristics, Pin-Oscillator Frequency
      7. 5.26.7  Precision ADC
        1. Table 5-27 14-Bit ADC, Power Supply and Input Range Conditions
        2. Table 5-28 14-Bit ADC, Timing Parameters
        3. Table 5-29 14-Bit ADC, Linearity Parameters
        4. Table 5-30 14-Bit ADC, Dynamic Parameters
        5. Table 5-31 14-Bit ADC, Temperature Sensor and Built-In V1/2
        6. Table 5-32 14-Bit ADC, Internal Reference Buffers
        7. Table 5-33 14-Bit ADC, External Reference
        8. 5.26.7.1   Typical Characteristics of ADC
      8. 5.26.8  REF_A
        1. Table 5-35 REF_A, Built-In Reference
      9. 5.26.9  Comparator_E
        1. Table 5-36 Comparator_E Characteristics
      10. 5.26.10 LCD_F
        1. Table 5-37 LCD Recommended Operating Conditions
        2. Table 5-38 LCD Electrical Characteristics
      11. 5.26.11 eUSCI
        1. Table 5-39 eUSCI Clock Frequency (UART Mode)
        2. Table 5-40 eUSCI Switching Characteristics (UART Mode)
        3. Table 5-41 eUSCI Clock Frequency (SPI Master Mode)
        4. Table 5-42 eUSCI Switching Characteristics (SPI Master Mode)
        5. Table 5-43 eUSCI Switching Characteristics (SPI Slave Mode)
        6. Table 5-44 eUSCI Clock Frequency (I2C Mode)
        7. Table 5-45 eUSCI Switching Characteristics (I2C Mode)
      12. 5.26.12 Timer_A
        1. Table 5-46 Timer_A Characteristics
        2. Table 5-47 Timer32 Characteristics
      13. 5.26.13 Memories
        1. Table 5-48 Flash Memory Characteristics
        2. Table 5-49 Flash Characteristics for Operations Using MSP432 Peripheral Driver Libraries
        3. Table 5-50 Flash Characteristics for Stand-Alone Operations
        4. Table 5-51 SRAM Characteristics
      14. 5.26.14 Emulation and Debug
        1. Table 5-52 JTAG Timing Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Processor and Execution Features
      1. 6.2.1 Floating-Point Unit (FPU)
      2. 6.2.2 Memory Protection Unit (MPU)
      3. 6.2.3 Nested Vectored Interrupt Controller (NVIC)
      4. 6.2.4 SysTick
      5. 6.2.5 Debug and Trace Features
    3. 6.3  Memory Map
      1. 6.3.1 Code Zone Memory Map
        1. 6.3.1.1 Flash Memory Region
        2. 6.3.1.2 SRAM Region
        3. 6.3.1.3 ROM Region
      2. 6.3.2 SRAM Zone Memory Map
        1. 6.3.2.1 SRAM Region
        2. 6.3.2.2 SRAM Bit-Band Alias Region
      3. 6.3.3 Peripheral Zone Memory Map
        1. 6.3.3.1 Peripheral Region
        2. 6.3.3.2 Peripheral Bit Band Alias Region
      4. 6.3.4 Debug and Trace Peripheral Zone
    4. 6.4  Memories on MSP432P4x1xT
      1. 6.4.1 Flash Memory
        1. 6.4.1.1 Flash Main Memory (0x0000_0000 to 0x001F_FFFF)
        2. 6.4.1.2 Flash Information Memory (0x0020_0000 to 0x0020_7FFF)
        3. 6.4.1.3 Flash Operation
      2. 6.4.2 SRAM
        1. 6.4.2.1 SRAM Bank Enable Configuration
        2. 6.4.2.2 SRAM Block Retention Configuration and Backup Memory
        3. 6.4.2.3 Utility SRAM
      3. 6.4.3 ROM
    5. 6.5  DMA
      1. 6.5.1 DMA Source Mapping
      2. 6.5.2 DMA Completion Interrupts
      3. 6.5.3 DMA Access Privileges
    6. 6.6  Memory Map Access Details
      1. 6.6.1 Master and Slave Access Priority Settings
      2. 6.6.2 Memory Map Access Response
    7. 6.7  Interrupts
      1. 6.7.1 NMI
      2. 6.7.2 Device-Level User Interrupts
    8. 6.8  System Control
      1. 6.8.1 Device Resets
        1. 6.8.1.1 Power On/Off Reset (POR)
        2. 6.8.1.2 Reboot Reset
        3. 6.8.1.3 Hard Reset
        4. 6.8.1.4 Soft Reset
      2. 6.8.2 Power Supply System (PSS)
        1. 6.8.2.1 VCCDET
        2. 6.8.2.2 Supply Supervisor and Monitor for High Side (SVSMH)
        3. 6.8.2.3 Core Voltage Regulator
      3. 6.8.3 Power Control Manager (PCM)
        1. 6.8.3.1 Peripherals in LPM3 and LPM4
      4. 6.8.4 Clock System (CS)
        1. 6.8.4.1 LFXT
        2. 6.8.4.2 HFXT
        3. 6.8.4.3 DCO
        4. 6.8.4.4 Very-Low-Power Low-Frequency Oscillator (VLO)
        5. 6.8.4.5 Low-Frequency Reference Oscillator (REFO)
        6. 6.8.4.6 Module Oscillator (MODOSC)
        7. 6.8.4.7 System Oscillator (SYSOSC)
        8. 6.8.4.8 Fail-Safe Mechanisms
      5. 6.8.5 System Controller (SYSCTL_A)
    9. 6.9  Peripherals
      1. 6.9.1  Digital I/O
        1. 6.9.1.1 Glitch Filtering on Digital I/Os
      2. 6.9.2  Port Mapping Controller (PMAPCTL)
        1. 6.9.2.1 Port Mapping Definitions
      3. 6.9.3  Timer_A
        1. 6.9.3.1 Timer_A Signal Connection Tables
      4. 6.9.4  Timer32
      5. 6.9.5  Enhanced Universal Serial Communication Interface (eUSCI)
      6. 6.9.6  Real-Time Clock (RTC_C)
      7. 6.9.7  Watchdog Timer (WDT_A)
      8. 6.9.8  Precision ADC
      9. 6.9.9  Comparator_E (COMP_E)
      10. 6.9.10 Shared Reference (REF_A)
      11. 6.9.11 LCD Controller (LCD_F)
      12. 6.9.12 CRC32
      13. 6.9.13 AES256 Accelerator
      14. 6.9.14 True Random Seed
    10. 6.10 Code Development and Debug
      1. 6.10.1 JTAG and Serial Wire Debug (SWD) Based Development, Debug, and Trace
      2. 6.10.2 Peripheral Halt Control
      3. 6.10.3 Bootloader (BSL)
      4. 6.10.4 Device Security
    11. 6.11 Performance Benchmarks
      1. 6.11.1 CoreMark/MHz Performance: 3.41
      2. 6.11.2 DMIPS/MHz (Dhrystone 2.1) Performance: 1.196
    12. 6.12 Input/Output Schematics
      1. 6.12.1  Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
      2. 6.12.2  Port P2, P2.0 to P2.3, Input/Output With Schmitt Trigger
      3. 6.12.3  Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger
      4. 6.12.4  Port P9, P9.4 to P9.7, Input/Output With Schmitt Trigger
      5. 6.12.5  Port P10, P10.0 to P10.3, Input/Output With Schmitt Trigger
      6. 6.12.6  Port P2, P2.4 to P2.7, Input/Output With Schmitt Trigger
      7. 6.12.7  Port P7, P7.0 to P7.2, Input/Output With Schmitt Trigger
      8. 6.12.8  Port P7, P7.3, Input/Output With Schmitt Trigger
      9. 6.12.9  Port P9, P9.2 and P9.3, Input/Output With Schmitt Trigger
      10. 6.12.10 Port P4, P4.2 to P4.7, Input/Output With Schmitt Trigger
      11. 6.12.11 Port P5, P5.0 to P5.5, Input/Output With Schmitt Trigger
      12. 6.12.12 Port P4, P4.0 to P4.1, Input/Output With Schmitt Trigger
      13. 6.12.13 Port P6, P6.0 and P6.1, Input/Output With Schmitt Trigger
      14. 6.12.14 Port P8, P8.2 to P8.7, Input/Output With Schmitt Trigger
      15. 6.12.15 Port P9, P9.0 and P9.1, Input/Output With Schmitt Trigger
      16. 6.12.16 Port P5, P5.6 and P5.7, Input/Output With Schmitt Trigger
      17. 6.12.17 Port P6, P6.2 to P6.5, Input/Output With Schmitt Trigger
      18. 6.12.18 Port P6, P6.6 and P6.7, Input/Output With Schmitt Trigger
      19. 6.12.19 Port P8, P8.0 and P8.1, Input/Output With Schmitt Trigger
      20. 6.12.20 Port P10, P10.4 and P10.5, Input/Output With Schmitt Trigger
      21. 6.12.21 Port P7, P7.4 to P7.7, Input/Output With Schmitt Trigger
      22. 6.12.22 Port PJ, PJ.0 and PJ.1 Input/Output With Schmitt Trigger
      23. 6.12.23 Port PJ, PJ.2 and PJ.3 Input/Output With Schmitt Trigger
      24. 6.12.24 Port PJ, PJ.4 and PJ.5 Input/Output With Schmitt Trigger
      25. 6.12.25 Ports SWCLKTCK and SWDIOTMS With Schmitt Trigger
    13. 6.13 Device Descriptors (TLV)
    14. 6.14 Identification
      1. 6.14.1 Revision Identification
      2. 6.14.2 Device Identification
      3. 6.14.3 Arm Cortex-M4F ROM Table Based Part Number
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 General Layout Recommendations
      4. 7.1.4 Do's and Don'ts
    2. 7.2 Peripheral and Interface-Specific Design Information
      1. 7.2.1 Precision ADC Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Layout Guidelines
  8. 8器件和文档支持
    1. 8.1  开始使用
    2. 8.2  器件命名规则
    3. 8.3  工具与软件
    4. 8.4  文档支持
    5. 8.5  相关链接
    6. 8.6  社区资源
    7. 8.7  商标
    8. 8.8  静电放电警告
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PZ|100
散热焊盘机械数据 (封装 | 引脚)
订购信息

Table 5-9 Low-Frequency Crystal Oscillator, LFXT

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
IVCC,LFXT Current consumption(9) fOSC = 32.768 kHz,
LFXTBYPASS = 0, LFXTDRIVE = \{0\},
CL,eff  =  3.7 pF,
Typical ESR, CSHUNT 		3.0 V 100 nA
fOSC = 32.768 kHz,
LFXTBYPASS = 0, LFXTDRIVE = \{1\},
CL,eff  =  6 pF,
Typical ESR, CSHUNT 		120
fOSC = 32.768 kHz,
LFXTBYPASS = 0, LFXTDRIVE = \{2\},
CL,eff  = 9 pF,
Typical ESR, CSHUNT 		150
fOSC = 32.768 kHz,
LFXTBYPASS = 0, LFXTDRIVE = \{3\},
CL,eff  =  12 pF,
Typical ESR, CSHUNT 		170
fLFXT LFXT oscillator crystal frequency LFXTBYPASS = 0(10) 32.768 kHz
DCLFXT LFXT oscillator duty cycle fLFXT  =  32.768 kHz(10) 30% 70%
fLFXT,SW LFXT oscillator logic-level square-wave input frequency LFXTBYPASS = 1(4)(7) 10 32.768 50 kHz
DCLFXT, SW LFXT oscillator logic-level square-wave input duty cycle LFXTBYPASS = 1 30% 70%
OALFXT Oscillation allowance for LF crystals(8) LFXTBYPASS  =  0, LFXTDRIVE  = \{1\},
fLFXT  =  32.768 kHz, CL,eff  =  6 pF		 200 240 kΩ
LFXTBYPASS  =  0, LFXTDRIVE  =  \{3\},
fLFXT  =  32.768 kHz, CL,eff  =  12 pF		 300 340
CLFXIN Integrated load capacitance at LFXIN terminal(5)(6) 2 pF
CLFXOUT Integrated load capacitance at LFXOUT terminal(5)(6) 2 pF
tSTART,LFXT Start-up time(2) fOSC = 32.768 kHz,
LFXTBYPASS = 0, LFXTDRIVE = \{0\},
CL,eff  =  3.7 pF,
Typical ESR, CSHUNT,
FCNTLF_EN = 0(10) 		3.0 V 1.1 s
fOSC = 32.768 kHz,
LFXTBYPASS = 0, LFXTDRIVE = \{3\},
CL,eff  =  12 pF,
Typical ESR, CSHUNT,
FCNTLF_EN = 0(10) 		1.3
fFault,LFXT Oscillator fault frequency(3)(1) 1 3 kHz
(1) Measured with logic-level input frequency but also applies to operation with crystals.
(2) Does not include programmable start-up counter.
(3) Frequencies above the MAX specification do not set the fault flag. Frequencies in between the MIN and MAX specification may set the flag. A static condition or stuck at fault condition will set the fault flag.
(4) When LFXTBYPASS is set, LFXT circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in the Schmitt-trigger Inputs section of this data sheet. Duty cycle requirements are defined by DCLFXT, SW.
(5) This represents all the parasitic capacitance present at the LFXIN and LFXOUT terminals, respectively, including parasitic bond and package capacitance. The effective load capacitance, CL,eff can be computed as CIN × COUT / (CIN + COUT), where CIN and COUT are the total capacitance at the LFXIN and LFXOUT terminals, respectively.
(6) Requires external capacitors at both terminals to meet the effective load capacitance specified by crystal manufacturers. Recommended effective load capacitance values supported are 3.7 pF, 6 pF, 9 pF, and 12 pF. Maximum shunt capacitance of 1.6 pF. Because the PCB adds additional capacitance, so it must also be considered in the overall capacitance. TI recommends verifying that the recommended effective load capacitance of the selected crystal is met.
(7) Maximum frequency of operation of the entire device cannot be exceeded.
(8) Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the LFXTDRIVE settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following guidelines, but should be evaluated based on the actual crystal selected for the application:
  • For LFXTDRIVE = \{0\}, CL,eff = 3.7 pF
  • For LFXTDRIVE = \{1\}, 6 pF ≤ CL,eff ≤ 9 pF
  • For LFXTDRIVE = \{2\}, 6 pF ≤ CL,eff ≤ 10 pF
  • For LFXTDRIVE = \{3\}, 6 pF ≤ CL,eff ≤ 12 pF
(9) Total current measured on both AVCC and DVCC supplies.
(10) Measured at ACLK pin.

Table 5-10 lists the input requirements for the high-frequency crystal oscillator, HFXT.