ZHCSHI9B December 2017 – June 2019 MSP432P4011T , MSP432P401VT , MSP432P401YT , MSP432P4111T , MSP432P411VT , MSP432P411YT
PRODUCTION DATA.
THERMAL METRIC(1) | PACKAGE | VALUE(2)(3) | UNIT | |
---|---|---|---|---|
RθJA | Junction-to-ambient thermal resistance, still air | LQFP-100 (PZ) | 44.5 | °C/W |
RθJC(TOP) | Junction-to-case (top) thermal resistance | 6.4 | °C/W | |
RθJB | Junction-to-board thermal resistance | 22.0 | °C/W | |
ΨJB | Junction-to-board thermal characterization parameter | 21.7 | °C/W | |
ΨJT | Junction-to-top thermal characterization parameter | 0.2 | °C/W | |
RθJC(BOTTOM) | Junction-to-case (bottom) thermal resistance | N/A | °C/W | |
RθJA | Junction-to-ambient thermal resistance, still air | QFN-64 (RGC) | 28.2 | °C/W |
RθJC(TOP) | Junction-to-case (top) thermal resistance | 7.7 | °C/W | |
RθJB | Junction-to-board thermal resistance | 6.8 | °C/W | |
ΨJB | Junction-to-board thermal characterization parameter | 6.7 | °C/W | |
ΨJT | Junction-to-top thermal characterization parameter | 0.1 | °C/W | |
RθJC(BOTTOM) | Junction-to-case (bottom) thermal resistance | 0.7 | °C/W |