ZHCSK95 September   2019 LP8733

PRODUCTION DATA.  

  1. 特性
    1.     简化原理图
  2. 应用
  3. 说明
    1.     直流/直流效率与输出电流间的关系
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Serial Bus Timing Parameters
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  DC/DC Converters
        1. 7.3.1.1 Overview
        2. 7.3.1.2 Dual-Phase Operation and Phase-Adding/Shedding
        3. 7.3.1.3 Transition Between PWM and PFM Modes
        4. 7.3.1.4 Dual-Phase Switcher Configurations
        5. 7.3.1.5 Buck Converter Load Current Measurement
        6. 7.3.1.6 Spread-Spectrum Mode
      2. 7.3.2  Sync Clock Functionality
      3. 7.3.3  Low-Dropout Linear Regulators (LDOs)
      4. 7.3.4  Power-Up
      5. 7.3.5  Regulator Control
        1. 7.3.5.1 Enabling and Disabling Regulators
        2. 7.3.5.2 Changing Output Voltage
      6. 7.3.6  Enable and Disable Sequences
      7. 7.3.7  Device Reset Scenarios
      8. 7.3.8  Diagnosis and Protection Features
        1. 7.3.8.1 Power-Good Information (PGOOD pin)
          1. 7.3.8.1.1 PGOOD Pin Gated Mode
          2. 7.3.8.1.2 PGOOD Pin Continuous Mode
        2. 7.3.8.2 Warnings for Diagnosis (Interrupt)
          1. 7.3.8.2.1 Output Power Limit
          2. 7.3.8.2.2 Thermal Warning
        3. 7.3.8.3 Protection (Regulator Disable)
          1. 7.3.8.3.1 Short-Circuit and Overload Protection
          2. 7.3.8.3.2 Overvoltage Protection
          3. 7.3.8.3.3 Thermal Shutdown
        4. 7.3.8.4 Fault (Power Down)
          1. 7.3.8.4.1 Undervoltage Lockout
      9. 7.3.9  Operation of the GPO Signals
      10. 7.3.10 Digital Signal Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Auto-Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
        1. 7.6.1.1  DEV_REV
          1. Table 8. DEV_REV Register Field Descriptions
        2. 7.6.1.2  OTP_REV
          1. Table 9. OTP_REV Register Field Descriptions
        3. 7.6.1.3  BUCK0_CTRL_1
          1. Table 10. BUCK0_CTRL_1 Register Field Descriptions
        4. 7.6.1.4  BUCK0_CTRL_2
          1. Table 11. BUCK0_CTRL_2 Register Field Descriptions
        5. 7.6.1.5  BUCK1_CTRL_1
          1. Table 12. BUCK1_CTRL_1 Register Field Descriptions
        6. 7.6.1.6  BUCK1_CTRL_2
          1. Table 13. BUCK1_CTRL_2 Register Field Descriptions
        7. 7.6.1.7  BUCK0_VOUT
          1. Table 14. BUCK0_VOUT Register Field Descriptions
        8. 7.6.1.8  BUCK1_VOUT
          1. Table 15. BUCK1_VOUT Register Field Descriptions
        9. 7.6.1.9  LDO0_CTRL
          1. Table 16. LDO0_CTRL Register Field Descriptions
        10. 7.6.1.10 LDO1_CTRL
          1. Table 17. LDO1_CTRL Register Field Descriptions
        11. 7.6.1.11 LDO0_VOUT
          1. Table 18. LDO0_VOUT Register Field Descriptions
        12. 7.6.1.12 LDO1_VOUT
          1. Table 19. LDO1_VOUT Register Field Descriptions
        13. 7.6.1.13 BUCK0_DELAY
          1. Table 20. BUCK0_DELAY Register Field Descriptions
        14. 7.6.1.14 BUCK1_DELAY
          1. Table 21. BUCK1_DELAY Register Field Descriptions
        15. 7.6.1.15 LDO0_DELAY
          1. Table 22. LDO0_DELAY Register Field Descriptions
        16. 7.6.1.16 LDO1_DELAY
          1. Table 23. LDO1_DELAY Register Field Descriptions
        17. 7.6.1.17 GPO_DELAY
          1. Table 24. GPO_DELAY Register Field Descriptions
        18. 7.6.1.18 GPO2_DELAY
          1. Table 25. GPO2_DELAY Register Field Descriptions
        19. 7.6.1.19 GPO_CTRL
          1. Table 26. GPO_CTRL Register Field Descriptions
        20. 7.6.1.20 CONFIG
          1. Table 27. CONFIG Register Field Descriptions
        21. 7.6.1.21 PLL_CTRL
          1. Table 28. PLL_CTRL Register Field Descriptions
        22. 7.6.1.22 PGOOD_CTRL_1
          1. Table 29. PGOOD_CTRL_1 Register Field Descriptions
        23. 7.6.1.23 PGOOD_CTRL_2
          1. Table 30. PGOOD_CTRL_2 Register Field Descriptions
        24. 7.6.1.24 PG_FAULT
          1. Table 31. PG_FAULT Register Field Descriptions
        25. 7.6.1.25 RESET
          1. Table 32. RESET Register Field Descriptions
        26. 7.6.1.26 INT_TOP_1
          1. Table 33. INT_TOP_1 Register Field Descriptions
        27. 7.6.1.27 INT_TOP_2
          1. Table 34. INT_TOP_2 Register Field Descriptions
        28. 7.6.1.28 INT_BUCK
          1. Table 35. INT_BUCK Register Field Descriptions
        29. 7.6.1.29 INT_LDO
          1. Table 36. INT_LDO Register Field Descriptions
        30. 7.6.1.30 TOP_STAT
          1. Table 37. TOP_STAT Register Field Descriptions
        31. 7.6.1.31 BUCK_STAT
          1. Table 38. BUCK_STAT Register Field Descriptions
        32. 7.6.1.32 LDO_STAT
          1. Table 39. LDO_STAT Register Field Descriptions
        33. 7.6.1.33 TOP_MASK_1
          1. Table 40. TOP_MASK_1 Register Field Descriptions
        34. 7.6.1.34 TOP_MASK_2
          1. Table 41. TOP_MASK_2 Register Field Descriptions
        35. 7.6.1.35 BUCK_MASK
          1. Table 42. BUCK_MASK Register Field Descriptions
        36. 7.6.1.36 LDO_MASK
          1. Table 43. LDO_MASK Register Field Descriptions
        37. 7.6.1.37 SEL_I_LOAD
          1. Table 44. SEL_I_LOAD Register Field Descriptions
        38. 7.6.1.38 I_LOAD_2
          1. Table 45. I_LOAD_2 Register Field Descriptions
        39. 7.6.1.39 I_LOAD_1
          1. Table 46. I_LOAD_1 Register Field Descriptions
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Inductor Selection
        2. 8.2.1.2 Buck Input Capacitor Selection
        3. 8.2.1.3 Buck Output Capacitor Selection
        4. 8.2.1.4 LDO Input Capacitor Selection
        5. 8.2.1.5 LDO Output Capacitor Selection
        6. 8.2.1.6 Current Limit vs. Maximum Output Current
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 器件工作温度范围:–40°C 至 +125°C(环境温度)
  • 输入电压:2.8V 至 5.5V
  • 两个高效降压直流/直流转换器:
    • 输出电压:0.7V 至 3.36V
    • 最大输出电流为每相 3A
    • 采用两相配置的自动相位增加/减少和强制多相操作
    • 采用两相配置的远程差分反馈电压检测
    • 可编程输出电压压摆率范围:0.5mV/µs 至 10mV/µs
    • 2MHz 开关频率
    • 用于降低 EMI 的扩频模式和相位交错
  • 两个线性稳压器:
    • 输入电压:2.5V 至 5.5V
    • 输出电压:0.8V 至 3.3V
    • 最大输出电流为 300mA
  • 可配置通用输出信号(GPO、GPO2)
  • 具有可编程屏蔽的中断功能
  • 可编程电源正常信号 (PGOOD)
  • 输出短路和过载保护
  • 过热警告和保护
  • 过压保护 (OVP) 和欠压锁定 (UVLO)
  • 具有可湿性侧面的 28 引脚、5mm × 5mm VQFN 封装
  • 简化原理图

    LP8733 Schem_03_SNVSAB5.gif