ZHCSI01C April   2018  – October 2019 LMR36006

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化原理图
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 System Characteristics
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Good Flag Output
      2. 8.3.2 Enable and Start-up
      3. 8.3.3 Current Limit and Short Circuit
      4. 8.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto Mode
      2. 8.4.2 Dropout
      3. 8.4.3 Minimum Switch On-Time
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design 1: Low Power 24-V, 600-mA PFM Converter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Custom Design With WEBENCH Tools
          2. 9.2.1.2.2  Choosing the Switching Frequency
          3. 9.2.1.2.3  Setting the Output Voltage
          4. 9.2.1.2.4  Inductor Selection
          5. 9.2.1.2.5  Output Capacitor Selection
          6. 9.2.1.2.6  Input Capacitor Selection
          7. 9.2.1.2.7  CBOOT
          8. 9.2.1.2.8  VCC
          9. 9.2.1.2.9  CFF Selection
            1. 9.2.1.2.9.1 External UVLO
          10. 9.2.1.2.10 Maximum Ambient Temperature
      2. 9.2.2 Application Curves
      3. 9.2.3 Design 2: High Density 24-V, 600-mA PFM Converter
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Application Curves
    3. 9.3 What to Do and What Not to Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground and Thermal Considerations
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
        1. 12.1.1.1 使用 WEBENCH® 工具创建定制设计方案
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Maximum Ambient Temperature

As with any power conversion device, the LMR36006 dissipates internal power while operating. The effect of this power dissipation is to raise the internal temperature of the converter above ambient. The internal die temperature (TJ) is a function of the ambient temperature, the power loss and the effective thermal resistance, RθJA of the device and PCB combination. The maximum internal die temperature for the LMR36006 must be limited to 150°C. This establishes a limit on the maximum device power dissipation and therefore the load current. Equation 11 shows the relationships between the important parameters. It is easy to see that larger ambient temperatures (TA) and larger values of RθJA reduce the maximum available output current. The converter efficiency can be estimated by using the curves provided in this data sheet. If the desired operating conditions cannot be found in one of the curves, then interpolation can be used to estimate the efficiency. Alternatively, the EVM can be adjusted to match the desired application requirements and the efficiency can be measured directly. The correct value of RθJA is more difficult to estimate. As stated in Semiconductor and IC Package Thermal Metrics, the values given in Thermal Information are not valid for design purposes and must not be used to estimate the thermal performance of the application. The values reported in that table were measured under a specific set of conditions that are rarely obtained in an actual application.

Equation 11. LMR36006 TJmax_eq2.gif

where

  • η = Efficiency

The effective RθJA is a critical parameter and depends on many factors such as power dissipation, air temperature/flow, PCB area, copper heat-sink area, number of thermal vias under the package, and adjacent component placement; to mention just a few. Due to the ultra-miniature size of the VQFN (RNX) package, a DAP is not available. This means that this package exhibits a somewhat greater RθJA.A typical example of RθJA vs copper board area can be found in Figure 20. Note that the data given in this graph is for illustration purposes only, and the actual performance in any given application depends on all of the factors mentioned above.

LMR36006 JA_curve_wson_4L_SNVSAN3.pngFigure 20. RθJA versus Copper Board Area for the VQFN (RNX) Package

Use the following resources as guides to optimal thermal PCB design and estimating RθJA for a given application environment: